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6619538 |
Nickel plating process having controlled hydrogen concentration
A flexible plating method by continuously controlling the hydrogen concentration of the plating bath by adding controlled amounts of hydrogen gas. The control of the hydrogen concentration is...
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6619530 |
Wire bonding apparatus
A tension mechanism that applies a back tension to a wire in a bonding apparatus including: a first nozzle which has a through-hole through which the wire passes, second and third nozzles which...
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6616030 |
Gantry mounted ultrasonic wire bonder with orbital bonding tool head
An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded...
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6609648 |
Ultrasonic bonding method of electric wires
Electric wires ( 20 ) and ( 21 ) are intersected with each other at right angles such that the electric wires ( 20 ) and ( 21 ) are inclined with respect to the vibration direction of ultrasonic...
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6607121 |
Quick change precisor
A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and...
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6607112 |
Wire bonding apparatus
There is provided a wire bonding apparatus operated steadily at a high speed without excitation of vibrations of an XY stage 102 and a capillary 104, which are movable parts. The wire bonding...
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6595400 |
Wire bonding apparatus
In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary,...
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6585145 |
Die bonder and/or wire bonder with a device for holding down a substrate
A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether...
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6581816 |
Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device
A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is...
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6578753 |
Ultrasonic transducer for a bonding apparatus and method for manufacturing the same
An ultrasonic transducer used in a bonding apparatus, comprising a first hollow section, which communicates with a rear end opening formed in a base end of a horn body of the transducer, and an...
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6572001 |
Bonding system
A bonding system ( 1 ) bonds wires between a first electrical contact surface on a semiconductor chip and a second electrical contact surface on a substrate. The bonding system ( 1 ) has a first...
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6568581 |
Detection of wire bonding failures
A device for monitoring a wire bonding process measures an electric signal applied to a bond wire during the bonding process, and generates an output which discriminates between successful and...
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6564989 |
Wire bonding method and wire bonding apparatus
A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined to the wire and a wire feeding hole open to the pressing surface; a wire...
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6553647 |
Method of wiring a head suspension assembly
A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension...
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6533158 |
Wire bonding apparatus having wire clamp
Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in...
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6530512 |
Wire bonding apparatus and wire bonding method
A wire bonding apparatus for connecting a metal fine wire at a normal position on a bonding pad of an IC chip so that there will be no variations in the positions of a die pad and the IC chip at...
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6527027 |
Single-point bonding apparatus
In a single-point bonding apparatus that connects the end portions of leads or the cut end portions of leads to pads respectively by pressing such end portions of leads or cut end portions of leads...
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6523733 |
Controlled attenuation capillary
A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second...
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6523255 |
Process and structure to repair damaged probes mounted on a space transformer
Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with...
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6520400 |
Wire tensioning apparatus
A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a...
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6516990 |
Apparatus for making wire connections
An apparatus for making wire connections between a first connection area and a second connection area by means of a capillary. The apparatus contains an image recognition system which is designed...
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6516994 |
Wire bonding apparatus for connecting semiconductor devices
A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of...
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6516991 |
Wire bonding apparatus
To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward...
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6516515 |
Semiconductor integrated circuit
A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main...
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6513696 |
Wedge bonding head
The present invention provides a bonding head for a wedge wire bonding apparatus in which the bonding force of the transducer assembly, and also the clamping force of the wire clamping assembly are...
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6505823 |
Apparatus for positioning a semiconductor pellet
Method and apparatus for suction-holding a semiconductor pellet on a positioning stage of a bonding apparatus without causing the pellet to be misaligned after positioning thereof including a...
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6502738 |
Wire bonding apparatus
A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away...
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6499648 |
Method and device for making a metal bump with an increased height
A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is...
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6497356 |
Controlled attenuation capillary with planar surface
A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second...
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6491202 |
Wire bonding apparatus and method
A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor...
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6484922 |
Apparatus and method of clamping semiconductor devices using sliding finger supports
An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present...
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6478212 |
Bond pad structure and method for reduced downward force wirebonding
A bond pad structure for an integrated circuit has bondable base member for receiving a wire bonded thereon. A cavity is formed within the base member, with the cavity being configured to capture...
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6474529 |
Wire bonding apparatus
A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding...
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6474538 |
Bonding apparatus and bonding method
A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and...
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6471116 |
Wire bonding spool system
A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire...
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6467672 |
Methods for clamping and wire-bonding the leads of a lead frame one set at a time
A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding...
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6467678 |
Wire bonding method and apparatus
A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary...
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6460751 |
Bondhead for a wire bonder
A Wire Bonder contains a bondhead which comprises a slide, a rotary beam rotatable on a vertical axis and a rocker mounted on the rotary beam. The slide is movable back and forth in a predetermined...
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6457627 |
Bonding capillary and semiconductor device
A capillary is prevented from contacting an adjacent wire when bonding a given wire to an electrode pad on a semiconductor element, and can increase a compression bonding area when bonding the...
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6454153 |
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing...
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6454155 |
Stroke and pressure adjusting device for solder machine
A stroke and pressure adjusting device is used for the soldering process of a soldering machine which has a driving device for driving a soldering device of the soldering machine to solder, and the...
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6443384 |
Wire brake
A wire brake for use with automatic wedge bonding machines which have cutting pliers arranged behind the associated bonding tool and movable along the bonding wire for detaching bonding wire from...
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6439448 |
Large wire bonder head
An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm,...
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6430809 |
Method for bonding conductors, in particular beam leads
A method for bonding conductors onto semiconductor components is disclosed, where an opening is provided in an insulation layer on a semiconductor component. At least one conductor extends across...
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6427897 |
Feed unit for moving parts
A feed unit for moving parts over short distances has a four-bar chain forming a translating solid parallelogram having two parallel rigid opposite legs, one of which constitutes a base leg,...
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6422448 |
Ultrasonic horn for a bonding apparatus
An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that...
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6402009 |
Apparatus and method for shaping lead frame for semiconductor device and lead frame for semiconductor device
In apparatus and method for shaping a lead frame for a semiconductor device, there are provided a lower die having a concave shape for forming a step portion on the lower surface of the lead frame...
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6398098 |
Wire bonding head involving minimized tip skid
In a wire bonding head, a transducer block depends from a carriage block via a special link mechanism including a main link member pivotally attached to the carriage block at its one end and to the...
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6392202 |
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer
An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and...
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6382494 |
Automatic ultrasonic bonding machine with vertically tiered orthogonally translatable tool support platforms
A machine for automatically making ultrasonic bonds between metallic conductors using a metal bonding wire precisely positions the tip of an ultrasonic bonding tool relative to a workpiece with a...
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