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4781319 |
Bonding head
A bonding head (10) of a wire bonding machine for bonding wire to electronic or electronical components comprises a bonding tool (18) connected to an ultrasonic transducer (16), a wire spool (22)...
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4771930 |
Apparatus for supplying uniform tail lengths
A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing...
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4765526 |
Wire bonding apparatus
An apparatus is provided with a capillary having a plurality of through holes. A plurality of bonding wires are delivered through the plurality of through holes at the same time from a wire supply...
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4765531 |
Quick change work station apparatus for automatic wire bonders
A modular quick change work station is provided for automatic wire bonders which permits the rapid exchange of work stations without manual adjustments for continuing operations. The modular work...
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4763826 |
Automatic wire feed system
An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop...
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4759073 |
Bonding apparatus with means and method for automatic calibration using pattern recognition
A wire bonding apparatus and method incorporating a pattern recognition system wherein there is stored, in a teach mode, signatures representing a pre-determined point on a chip to be bonded, the...
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4750666 |
Method of fabricating gold bumps on IC's and power chips
A method for depositing gold bumps on metallized pads of semiconductor chips uses a commercially available thermocompression or thermosonic gold wire bonder. The method includes the steps of...
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4732313 |
Apparatus and method for manufacturing semiconductor device
A lead frame is conveyed along a convey direction in a convey path filled with a reducing gas. A semiconductor pellet is placed on the lead frame at a die bonding portion. A bonding wire made of...
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4730764 |
Ultrasonic welding wire termination apparatus
Apparatus for ultrasonically welding a wire to a wire terminal. A stationary anvil forms the lower horizontal wall of a work chamber into which a wire workpiece is inserted. The vertical walls of...
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4720914 |
Method for forming thick film circuit using rotatable nozzle having wide discharge hole
The present invention relates to method and apparatus for forming a thick film circuit by discharging a thick film paste from a paste discharging hole of a drawing nozzle and drawing a desired...
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4718591 |
Wire bonder with open center of motion
A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially...
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4717066 |
Method of bonding conductors to semiconductor devices
Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire...
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4696425 |
Programmable ultrasonic power supply
An ultrasonic generator for providing power to a bonding apparatus having a bonding horn which is brought into contact with respective conductive pads and which carries a wire to be dispensed for...
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4691854 |
Coatings for ceramic bonding capillaries
A bonding apparatus for bonding lead wires to a semiconductor surface includes a supply spool that contains a supply of the bonding wire that is fed to a capillary that is made of a non-conductive...
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4691855 |
Twin wire splitter system
A twin wire splitter system comprises an X-Y table for mounting a printed circuit board thereon; a wire bonding device for continuously bonding a twin wire to a plurality of wire connecting...
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4671446 |
Method and system for automatically bonding a leadwire on a semiconductor
The bonding of a lead wire on a semiconductor having an ohmic contact metal electrode provided locally on a surface at a selected location is achieved through detecting the image of the metal...
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4653681 |
Voice coil actuated fine wire clamp
A high speed low inertia fine wire clamp is provided for automatic wire bonders of the type which move the bond head and bond head frame relative to the workstation which supports the semiconductor...
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4645118 |
Method and means for threading wire bonding machines
Semiautomatic threading of bonding wire into the guide hole of a wire bonding tool is accomplished by holding the end of the wire in a reference position while its standing part is disposed in the...
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4619397 |
Method of and apparatus for bonding an electrically conductive wire to bonding pads
A method and an apparatus for bonding a thin electrically conductive wire, especially an aluminum wire (11), to electrical bonding pads or areas (12, 14) of electric or electronic components (16),...
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4619395 |
Low inertia movable workstation
The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is...
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4603803 |
Wire bonding apparatus
A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that...
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4600138 |
Bonding tool and clamp assembly and wire handling method
A bonding tool and clamp assembly is disclosed and includes an upper wire guide (23,51) and a bonding tool (17,75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41)....
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4598853 |
Open-center flexural pivot wire bonding head
A flexural pivot structure useful in a wire bonding machine bonding head (10) is disclosed and includes first and second leaf spring assemblies (39,41) which provide a pivot axis (PA) displaced...
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4597522 |
Wire bonding method and device
A wire bonding method and device in which a bonding tool for holding the leading end of a bonding wire and a wire clamp for clamping the bonding wire at a position between the bonding tool and a...
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4597520 |
Bonding method and means
A sonic, lead wire bonding tool has both bonding elements and wire cutting elements formed on its working face and a bail which limits lateral movement of the bonding wire and aids in forming the...
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4589584 |
Electrical connection for polymeric conductive material
Flexible flat ribbon cables with a polyester binder silver particle conductive ink deposited on a heat bondable substrate are bonded to each other or to rigid circuit boards by applying ultrasonic...
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4586642 |
Wire bond monitoring system
Apparatus is provided for monitoring conditions of a fine wire interconnection during a bonding operation. The apparatus comprise a system which is capable of being installed on new automatic wire...
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4583676 |
Method of wire bonding a semiconductor die and apparatus therefor
A semiconductor die surface heater and a method of using the die surface heater as a wire bonding assembly are provided. In the preferred form, the semiconductor die surface heater comprises two...
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4576322 |
Machine for ultrasonically bonding wires to cavity-down integrated circuit packages
A machine for bonding a wire between pads on an integrated circuit die and a cavity-down circuit package includes a wedge for transferring heat energy to one part of the wire of sufficient...
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4575602 |
Apparatus for forming bonding balls on bonding wires
There is disclosed an improved apparatus for forming a bonding ball on a tip end of the bonding wire. There are provided a capillary member having a through-hole for holding and guiding the bonding...
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4572421 |
Apparatus for feeding wire to a wire bonding mechanism
An apparatus for supplying wire to a wire bonding mechanism is presented. Lengths of wire are fed to a low mass wire-loop reservoir while the bonding process is taking place. Wire is then supplied,...
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4558596 |
Apparatus for detecting missing wires
Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop...
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4555052 |
Lead wire bond attempt detection
A method and circuits are described for sensing and detecting bond attempts and weld attempts during bonding and welding of lead wire. The method and circuitry are particularly applicable for...
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4550871 |
Four-motion wire bonder
A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the...
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4527730 |
Wire bonding apparatus
A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the...
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4516673 |
Apparatus for conveying a lead frame mounting semiconductor pellets
An apparatus for conveying a lead frame mounting semiconductor pellets comprises a guide path for guiding the lead frame, and a feed member. The feed member is moved by a solenoid mechanism from a...
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4485957 |
Wire bonder
A wire bonder is frequently used for assembling the electronic parts of a semiconductor device or the like and exhibits an effect in the electric connections of the aforementioned electronic parts...
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4475681 |
Bonder apparatus
A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support...
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4445633 |
Automatic bonder for forming wire interconnections of automatically controlled configuration
An automatic wire bonder for bonding at least one wire between a first predetermined location on a workpiece and a second predetermined location on a substrate on which the workpiece is carried...
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4437603 |
Automatic wiring machine for printed circuit boards
A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied...
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4418858 |
Deep bonding methods and apparatus
To permit accomplishment of wire bonding at a depth that precludes the use of the conventional clamp adjacent to the bonding tool, a new tool is provided which includes a means for preventing...
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4415115 |
Bonding means and method
A new wire bonding capillary design is employed in which the bonding and cutting surfaces of the bonding capillary are separated. The bonding capillary tip has an annular bonding surface and an...
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4387283 |
Apparatus and method of forming aluminum balls for ball bonding
An apparatus and method of forming aluminum balls utilized for ball bonding. The aluminum balls are formed in a moist argon atmosphere by applying an electrical potential across a spark gap causing...
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4382322 |
Automated welding systems and methods
An automated welding system takes initially randomly oriented negative glow lamps and welds a resistor to each lamp. Lead wires are trimmed to desired lengths and the physical strength of the weld...
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4378902 |
Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices
In an apparatus for the assembly of microcomponents semiconductor devices, an improvement is provided for the step involving wire bonding of thin gold wires between conductor pads on the...
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4359623 |
Method and apparatus for bonding terminals to electrical devices
A strip (21) of pairs of terminals (13 and 14) are incrementally advanced into a bonding station (24) where electrical components, e.g., metallized film capacitors (10), are successively advanced...
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4351468 |
Apparatus for wiring connections on a substrate
The surface of a substrate, particularly a multi-layer substrate, is wired y an apparatus including a tool carrier and a substrate carrier. The substrate carrier is positioned in a substantially...
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4347964 |
Wire bonding apparatus
In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a...
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4340166 |
High speed wire bonding method
A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a...
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4327860 |
Method of making slack free wire interconnections
Electrodes and lead-out terminals of semiconductor devices employ fine wire interconnections which require forming into a predetermined configuration. The method of the present invention provides...
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