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8181845 |
Electrical bond connection system
An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least...
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8152046 |
Conductive bumps, wire loops, and methods of forming the same
A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the...
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8141765 |
Cutting blade for a wire bonding system
A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a...
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8123108 |
Method of manufacturing semiconductor device and wire bonding apparatus
A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point...
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8100317 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and...
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8096461 |
Wire-bonding machine with cover-gas supply device
A wire-bonding machine includes a main body, a fixture block, a mounting block, a gas supply tube, a cover-gas supply device, a capillary tool and an electrode. The fixture block is provided with a...
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8096462 |
Method of reworking electrical short in ultra sonic bonder
A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control...
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8091757 |
Wire alignment tool for use during soldering
A wire alignment tool for use during soldering is disclosed. The tool includes a handle configured to contain a supply of solder, a solder advancement mechanism constructed and arranged to move the...
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8091761 |
Bonding apparatus and bonding method
A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired...
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8066171 |
Conductive metal ball bonding with electrostatic discharge detection
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a...
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8066170 |
Gas delivery system for reducing oxidation in wire bonding operations
A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the...
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8056794 |
Combination wedge bonding and ball bonding transducer
A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least...
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8053351 |
Method of forming at least one bonding structure
A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary...
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8042725 |
Wire bonding method, wire bonding apparatus, and wire bonding control program
The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even...
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8025201 |
Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site...
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8016182 |
Wire loop, semiconductor device having same and wire bonding method
A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point...
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8016183 |
Adjustable clamp system and method for wire bonding die assembly
A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping...
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8011557 |
Automatic soldering machine
An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic...
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8008183 |
Dual capillary IC wirebonding
The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires...
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7975901 |
Bonding apparatus and wire bonding method
A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being...
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7954689 |
Vacuum wire tensioner for wire bonder
A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body...
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7946465 |
Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit...
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7938308 |
Wire bonder for improved bondability of a conductive wire and method therefor
A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is...
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7934634 |
Wire bonding method
A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a...
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7934633 |
Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create...
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7934632 |
Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second...
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7932171 |
Dual metal stud bumping for flip chip applications
A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a...
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7931186 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and...
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7926698 |
Spot heat wirebonding
Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a...
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7918378 |
Wire bonding deflector for a wire bonder
Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
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7909228 |
Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create...
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7909233 |
Method of manufacturing a semiconductor package with fine pitch lead fingers
A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of...
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7896218 |
Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive...
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7886956 |
Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached...
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7857190 |
Wire bonding apparatus, record medium storing bonding control program, and bonding method
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for...
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7842897 |
Bonding apparatus
A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and...
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7838101 |
Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create...
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7815095 |
Wire loop, semiconductor device having same and wire bonding method
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to...
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7810695 |
Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip
A wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip uses a grinding film of the wire bonding machine mounted on a clamp block. The...
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7810703 |
Wire bonding method
A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact...
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7795557 |
Electronic flame-off electrode with ball-shaped tip
An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
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7789289 |
Holding tool for fixing an electronic component and circular table manufacturing unit
A holding tool for fixing an electronic component (2) during a manufacturing process, the electronic component (2) comprising a winding assembly (20) and an electronic circuit (24), wherein the...
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7780056 |
Horn attachment arm
A horn attachment arm for a bonding apparatus that performs high speed bonding with high accuracy to a large sized workpiece is provided. The horn attachment arm includes a fixing bracket fixed to...
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7780064 |
Wire bonding method for forming low-loop profiles
A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a...
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7766211 |
Temperature control of a bonding stage
A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution...
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7766212 |
Spool wound with a gold alloy wire used for a bonding process
A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The...
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7762449 |
Bond head for heavy wire bonder
A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the...
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7748599 |
Wire bonding method, wire bonding apparatus, and wire bonding control program
The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even...
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7735711 |
Method of testing bonded connections, and a wire bonder
A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated...
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7735716 |
Method of controlling the trajectory of a bonding tool during the formation of a wire loop
A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The...
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