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7497365 |
Paste coater and PoP automatic mounting apparatus employing the same
A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a...
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7093746 |
Coated stencil with reduced surface tension
A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated...
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7070087 |
Method and apparatus for transferring solder bumps
The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the...
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6988652 |
Solder printing using a stencil having a reverse-tapered aperture
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable...
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6964093 |
System for mounting electronic device
An electronics packaging system ( 1 ) including a printer ( 3 ), a placing unit ( 4 ) and a reflow unit ( 5 ), wherein a printed wiring board ( 2 ) is carried while being kept in an upright...
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6955285 |
Apparatus for aligning and dispensing solder columns in an array
An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate...
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6905059 |
Solder ball attachment system
A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a...
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6814804 |
Apparatus and method for printing solder paste
A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings...
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6805274 |
Solder ball attracting mask and its manufacturing method
A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component...
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6708871 |
Method for forming solder connections on a circuitized substrate
A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as...
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6708868 |
Method for producing weld points on a substrate and guide for implementing said method
A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive...
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6702173 |
Reflow apparatus in continuous printing and mounting apparatus for film-like printing body
When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from...
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6698648 |
Method for producing solderable and functional surfaces on circuit carriers
Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit...
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6676006 |
Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method
A flux supply device comprises a liquid replenishing portion containing a liquid flux for replenishment, a liquid holding portion connected to the lower end of the liquid replenishing portion with...
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6659328 |
Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board...
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6641030 |
Method and apparatus for placing solder balls on a substrate
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a...
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6592943 |
Stencil and method for depositing solder
A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also...
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6569248 |
Apparatus for selectively applying solder mask
A method and apparatus are disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed...
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6550662 |
Chip rework solder tool
A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips...
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6510977 |
Method and apparatus using laminated foils for placing conductive preforms
A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100....
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6464130 |
Method of manufacturing piezoelectric actuator and method of joining lead wire to piezoelectric element of piezoelectric actuator
A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed...
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6427898 |
Solder bump forming method and apparatus
A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat...
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6412685 |
Method and apparatus for release and optional inspection for conductive preforms placement apparatus
A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a...
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6375064 |
Method of forming projecting electrodes and method of manufacturing semiconductor device provided with projecting electrodes
A conductive paste is loaded in circular holes made in a reinforcing film of a carrier tape which includes a film substrate and the reinforcing film, followed by applying a heat treatment to the...
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6237832 |
Wave soldering fixture
An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and...
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6223973 |
Apparatus and method for connecting printed circuit boards through soldered lap joints
An apparatus and method for connecting together first and second printed circuit boards 10/20 (PCBs), wherein one or both of the PCBs is a flex circuit. The method includes overlapping the two PCBs...
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6221514 |
High-current circuit trace and composition and method therefor
A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a...
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6182883 |
Method and apparatus for precisely registering solder paste in a printed circuit board repair operation
The precise solder paste application process makes use of mask registration apertures that are formed in the printed circuit board and that are adapted to receive a component solder paste mask that...
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6145729 |
Non-connected drainage channels for selective wave solder pallets
A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to...
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6139079 |
Universal transport apparatus
A transport head (10) and a method for transporting flux and solder balls (50) to locations for bonding pads (46) on a workpiece (44). To transfer flux, a first pattern definition mask (12) is...
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6126059 |
Captured-cell solder printing and reflow methods and apparatuses
Disclosed are methods and apparatuses for forming solder bumps on integrated circuit chips (and other similar circuitized units) and apparatuses. A screening stencil is laid over the surface of the...
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6027006 |
Method and apparatus for applying solder and forming solder balls on a substrate
A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is...
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5830014 |
Electrical connector
The present invention provides a vertical card connector capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The...
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5820013 |
Adjustable support apparatus for wave soldering of printed circuit boards
A fixture for supporting printed circuit (PC) boards during wave soldering includes a rigid frame having a ledge formed along the inner perimeter of the frame. The ledge supports a PC board along a...
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5704535 |
Shield and method for selective wave soldering
A shield (50) for use in wave soldering processes to selectively affix solder to an area of circuit board (20), having one or more electronic components (21) on the solder side of the board, is...
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5593080 |
Mask for printing solder paste
A mask for printing solder paste includes a mask plate, and first mask holes which are formed in the mask plate and have a first size, and second mask holes which are formed in the mask plate and...
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5588885 |
Connector with terminals having anti-wicking gel
An electrical connector comprises a housing and terminals mounted therein, the terminals comprising contact tails for soldered connection to a printed circuit board. The contact tails have sealing...
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5460316 |
Stencils having enhanced wear-resistance and methods of manufacturing the same
Stencils having enhanced wear-resistance consisting of a metal body, preferably fabricated from stainless steel, having a first major surface and a second major surface and a plurality of apertures...
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5454505 |
Wave solder pallet
An apparatus for facilitating wave solder treatment and other handling of a circuit component during manufacture of the circuit component having first areas configured for wave solder treatment and...
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5275326 |
Guide hole sleeves for boat transports supporting semiconductor device assemblies
Damage to the pins and ceramic body of pin grid array type semiconductor device assemblies is avoided by providing ceramic bushings in the pin-receiving holes of a boat transport. The bushings...
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5164010 |
Solder coating method and apparatus for semiconductor devices
This invention relates to an apparatus for coating solder on the outer leads of TAB-type semiconductor devices. The solder coating apparatus comprises a solder tank accommodating a heater, a...
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5086371 |
Printed circuit board assembly handle/stiffener
A printed circuit board handle is disclosed for use with a printed circuit board. The printed circuit board handle includes a flange that extends for the length of the handle and is mounted to the...
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4986210 |
Apparatus for coating pipe threads
Apparatus for coating the endmost threaded section of a pipe with corrosion resistant powder coating material by rotating the pipe and spraying the section to be coated with electrostatically...
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4981248 |
Electronically controlled wave solder mask shield
An electronically controlled mask shield for a wave soldering machine is disclosed which can be positioned to shield gold contacts on printed wiring boards (PWBs) during a wave soldering operation....
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4942997 |
Solder flow well for reflowing solder of multipin components
A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the...
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4932585 |
Method and apparatus for solder plating an object
A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable...
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4858816 |
Tin-soldering machine with automatic wave barrier for printed circuit boards
The wave barrier device of the invention comprises a flap which is rigidly joined to the soldering machine. This flap plunges lightly into the molten tin bath and pushes it before the board which...
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4739919 |
Masking of circuit boards for wave soldering
A soldering mask for soldering the leads of leaded components to a circuit pattern on a surface of a circuit board also having surface mounted components already soldered to the circuit pattern on...
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4717064 |
Wave solder finger shield apparatus
A set of titanium guide bars are shaped with inner angular finger shields to isolate designated underside edge areas of a printed circuit board being conveyed across a molten solder bath in a wave...
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4682723 |
Mask for wave soldering machine
A soldering mask for use with a wave soldering machine. The soldering mask is formed into a trough-like shape which is positioned in the machine to displace molten solder away from the part of the...
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