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7405379 |
System for applying an isolation layer to a brazed end of a generator armature winding bar
A method of forming a brazed joint between an armature bar and a hydraulic header clip including: assembling an end of the armature bar, hydraulic header clip and a substantially phosphorus-free...
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7401637 |
Pressure-only molten metal valving apparatus and method
A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the...
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7389903 |
Device and method for soldering contacts on semiconductor chips
A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a...
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7380699 |
Method and apparatus for vapour phase soldering
The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone,...
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7347349 |
Apparatus and method for printing micro metal structures
A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above....
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7168608 |
System and method for hermetic seal formation
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder...
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7159752 |
Continuous mode solder jet apparatus
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems...
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7100813 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
A system ( 10 ) and method ( 30 ) for precisely depositing a solder compound onto a substrate ( 18 ). The system ( 10 ) generally includes a receiving member ( 20 ) having a rotatable portion ( 21...
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7070087 |
Method and apparatus for transferring solder bumps
The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the...
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7066378 |
Filling device
A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure...
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7048172 |
Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device
A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and...
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7040524 |
Automated packaging apparatus and method of optical elements
An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform...
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7040523 |
Method and apparatus for applying viscous or paste material onto a substrate
An applicator device for abutment by or attachment to a reciprocating mechanism of a viscous fluid material printing machine, the applicator device including: a body having a through passage with...
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7028879 |
System for depositing connection sites on micro C-4 semiconductor die
A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The pitch between the solder bumps is less...
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6957760 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on...
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6957759 |
Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device
A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and...
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6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an...
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6913182 |
Method and apparatus for controlled application of flux
Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based...
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6878396 |
Micro C-4 semiconductor die and method for depositing connection sites thereon
A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The solder bumps are preferably about 10...
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6854633 |
System with polymer masking flux for fabricating external contacts on semiconductor components
A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for...
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6832714 |
Heated filling device
A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material...
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6811074 |
Method and apparatus for dispensing solder on a substrate
For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber,...
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6805274 |
Solder ball attracting mask and its manufacturing method
A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component...
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6789724 |
Welding apparatus and method
An exothermic welding system uses compressible layers of disposable refractory batting or gaskets to form a weld chamber for parts to be welded. The parts to be welded are layered with the batting...
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6772937 |
Method and apparatus for applying viscous material
By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a...
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6744003 |
Automatic soldering machine
An automatic soldering machine utilizing many design features which substantially reduces maintenance, simplifies the soldering operation, improves the process reliability, reduces the cycle time,...
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6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying
A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150...
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6708873 |
Apparatus and method for filling high aspect ratio via holes in electronic substrates
An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the...
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6708871 |
Method for forming solder connections on a circuitized substrate
A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as...
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6708868 |
Method for producing weld points on a substrate and guide for implementing said method
A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive...
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6698648 |
Method for producing solderable and functional surfaces on circuit carriers
Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit...
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6588645 |
Continuous mode solder jet apparatus
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems...
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6576861 |
Method and apparatus for fine feature spray deposition
A system for fine feature spray deposition includes a substrate platform for supporting a substrate on which the features are to be deposited. A spray assembly is provided which includes a spray...
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6572010 |
Integrated solder bump deposition apparatus and method
An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and...
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6550662 |
Chip rework solder tool
A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips...
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6543677 |
Solder-ball bonding device and method
In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the...
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6540129 |
Apparatus and method for manufacturing solder balls
An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a...
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6533163 |
Solder ball pitcher
There is disclosed a solder ball pitcher supplying a large number of solder balls stored in a solder ball housing chamber in a row into a solder ball supply passage unit through a taper portion,...
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6533159 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball...
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6527158 |
Method and apparatus for forming solder bumps
The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for...
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6520402 |
High-speed direct writing with metallic microspheres
Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at...
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6484923 |
Hand held flux and solder feeding tool
A flux and solder tool includes a housing configured to store both flux and solder. A nozzle extends from the housing. A pump feeds solder from the housing through the nozzle. A wire drive feeds...
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6464130 |
Method of manufacturing piezoelectric actuator and method of joining lead wire to piezoelectric element of piezoelectric actuator
A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed...
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6464125 |
Rework and underfill nozzle for electronic components
A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections...
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6464122 |
Soldering method and soldering apparatus
Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of...
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6457634 |
Soldering method and soldering apparatus
A soldering device and method includes the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating...
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6454154 |
Filling device
A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure...
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6443350 |
Continuous mode solder jet apparatus
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems...
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6435396 |
Print head for ejecting liquid droplets
An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in...
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6431431 |
Apparatus and methods for wave soldering
Apparatus for use in wave soldering applications can include an adjustable wing device, a front gate and/or a mounted member. Each of these components are easily adjustable, thereby improving the...
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