|
Match
|
Document |
Document Title |
|
|
6607847 |
Bonded niobium silicide and molybdenum silicide composite articles using brazes
An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece ...
|
|
|
6586118 |
Bonded niobium silicide and molybdenum silicide composite articles using semi-solid brazes
An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first ...
|
|
|
6565990 |
Bonded niobium silicide and molybdenum silicide composite articles and method of manufacture
An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece ...
|
|
|
6199747 |
High temperature refractory joining paste
A method of and novel composition for transient liquid phase bonding of refractory metal structures is described herein. Preferably, the composition comprises a first component substantially...
|
|
|
6131796 |
Direct brazing of refractory metal features
A brazing method for the direct bonding of a metallic item to a refractory metal without the need for an adhesion layer. The direct brazing process uses a Cu--Ag--Ni alloy which eliminates the need...
|
|
|
5704538 |
Method for joining rhenium to columbium
A method for joining rhenium to columbium and columbium based alloys that minimizes the formation of brittle intermetallics. First, a layer of ruthenium is applied to both the rhenium and columbium...
|
|
|
5392981 |
Fabrication of boron sputter targets
A process for fabricating high density boron sputtering targets with sufficient mechanical strength to function reliably at typical magnetron sputtering power densities and at normal process...
|
|
|
5305947 |
Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same
A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo...
|
|
|
5253797 |
Method of bonding molybdenum to steel
A thin layer of silver metal is formed between a molybdenum surface and a eel surface. The silver metal layer is diffusion bonded to the molybdenum surface and diffusion bonded to the steel...
|
|
|
5234153 |
Permanent metallic bonding method
A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount,...
|
|
|
5023043 |
Actively cooled device
An actively cooled device, such as a heat shield for a fusion reactor, includes elements (10) of a heat-resistant material, particularly graphite, each being provided with at least one recess...
|
|
|
4989773 |
Method of joining graphite and metallic material with a material comprising titanium, nickel and copper
A method for joining graphite and metallic material with a material comprising titanium, nickel and copper in a composition ratio of, by weight, Ti 69-57 Ni 24-20 Cu 7-23.
|
|
|
4921158 |
Brazing material
A mechanical and electrical bond between a silicon semiconductor wafer and a molybdenum contact is created by a multi-layer brazing material. The material includes adjacent layers of titanium and...
|
|
|
4883218 |
Method of brazing a ceramic article to a metal article
A new and improved method of brazing a ceramic-metal article is described. The ceramic-metal article comprises a ceramic article, such as a lanthana-strengthened yttria article, bonded to a metal...
|
|
|
4856702 |
Method for manufacturing semiconductor components
In a method for manufacturing an alloy contact between a wafer-shaped semiconductor substrate (4) and a metal contact wafer (6) a material bond for which the alloy layer reaches only slightly into...
|
|
|
4832253 |
Method for manufacturing a laminar bond and apparatus for conducting the method
In a method for the firm bonding at elevated temperatures of thin, large-area wafers of different thermal expansion the deformations of the laminar bond occurring later during cooling are at least...
|
|
|
4736883 |
Method for diffusion bonding of liquid phase sintered materials
A method is disclosed for bonding liquid phase sintered metal powder parts of a tungsten alloy containing nickel. The method involves placing a sheet of copper based material between the parts at...
|
|
|
4718593 |
Method of forming alloyed metal contacts on rough saw-damaged silicon surfaces
The present invention relates to an improved method for the permanent bonding of a metal to a rough cut and unmodified semiconductor material, which comprises (a) contacting the surface of (i) the...
|
|
|
4706872 |
Method of bonding columbium to nickel and nickel based alloys using low bonding pressures and temperatures
The disclosure relates to a method of joining nickel and nickel based alloys to columbium at low pressure and low temperature, wherein a thin titanium brazing foil is provided, with or without a...
|
|
|
4705207 |
Method of brazing columbium to itself using low bonding pressures and temperatures
The disclosure relates to a method of bonding columbium to columbium wherein a brazing foil of titanium which has been coated with either a layer of copper or a layer of nickel or layers of copper...
|
|
|
4627864 |
Method of making glass fiber forming feeders
A method of making an orificed discharge wall for supplying a plurality of streams of molten glass to be attenuated into filaments is provided comprising inserting elements in apertures in a...
|
|
|
4486386 |
Reactive metal-palladium-gold brazing alloys
Reactive metal-palladium-gold ductile alloys are suitable for brazing ceramics, other non-metallic and metallic materials.
|
|
|
3985281 |
Method of producing an electrical conductor
A method of producing a conductor for a superconducting cable or the like is disclosed. The conductor is made up of at least niobium and copper of which the copper is an electrically...
|
|
|
3946932 |
Brazing graphite to graphite
Graphite is joined to graphite by employing both fine molybdenum powder as the brazing material and an annealing step that together produce a virtually metal-free joint exhibiting properties...
|
|
|
3923232 |
Method of bonding RECo5 magnets, apparatus for effecting the method and permanent magnets produced by the method
Complex shaped permanent magnets are formed by braze bonding together at least two simpler shaped permanent magnets by applying a layer of a solder between the surfaces of said shaped permanent...
|
|
|
3897223 |
Nb joined to alumina with Ni-Ti eutectic seal
The method of joining members 23 and 21 (FIG. 1) of copper and tungsten and members 33 and 31 (FIG. 2) of copper and corrosion and/or temperature-resistant nickel-base alloys in the practice of...
|
|
|
3896542 |
Method of sealing electrical component envelopes
A method of sealing a metal lid on a metal peripheral wall portion of a base part of an electrical device envelope, for example an integrated circuit envelope, by pressure bonding via an...
|
|
|
3748729 |
TRAVELING WAVE TUBE INTERACTION CIRCUIT MANUFACTURE
A helix slow wave propagation circuit supported by longitudinally aligned ceramic rods is brazed to the rods by providing seal-forming surfaces on the rods and a plating of brazing material on the...
|
|
|
3653119 |
METHOD OF PRODUCING ELECTRICAL CAPACITORS
Simultaneously subjecting an electrical capacitor comprising, a valve metal electrode, an anodic oxide layer thereon, and a semiconducting oxide counterelectrode, to a temperature of 250°-400° C. w...
|
|
|
3634926 |
METHOD OF FORMING A COMPOSITE METAL BY ROLLING AND RECRYSTALLIZATION
The disclosure teaches a process for obtaining composite metal articles and the article obtained thereby wherein a first metal component has a recrystallization temperature under 500° F. and a ...
|
|
|
3636297 |
REFRACTORY METAL BRAZING WITH NIOBIUM PENTOXIDE FLUX
A method for sealing the niobium end cap of a ceramic arc tube to the tantalum exhaust and fill tubulation which comprises the steps of; placing the tubulation through a close fit aperture in the...
|
|
|
3604103 |
METHOD OF CLADDING METALS AND COMPOSITES THEREOF
A method of forming an integral metallurgical composite of dissimilar metals one of which is a refractory metal comprising covering the refractory metal with at least one other metal to form a...
|
|
|
3594896 |
METHOD FOR THE PROTECTION OF METAL ARTICLES AT ELEVATED TEMPERATURES
A method of protecting an article made of zirconium, titanium, hafnium, niobium, tantalum, vanadium or their alloys against high-temperature corrosion consisting of pickling the surface to be...
|
|
|
3591917 |
PROCESS FOR JOINING SURFACES
A method for joining refractory and reactive surfaces to themselves or to other surfaces by depositing a layer of a titanium-indium alloy between the joinable surface, and heating under vacuum to...
|
|
|
3495323 |
ASSEMBLY OF UNITS IN METAL CONTAINERS
|
|
|
3600144 |
LOW MELTING POINT BRAZING ALLOY
|
|
|
3570110 |
METHOD OF BRAZING
|
|
|
3584372 |
METHOD OF JOINING REFRACTORY METAL MEMBERS
|
|
|
3566512 |
THERMOELECTRIC DEVICES
|
|
|
3608167 |
METHOD FOR FABRICATING A "RISING SUN" MAGNETRON ANODE
|
|
|
3468021 |
METHOD FOR MANUFACTURING SUPERCONDUCTIVE CONDUCTORS
|
|
|
3449818 |
SUPERCONDUCTOR JOINT
|
|
|
3443304 |
METHOD OF PRODUCING SUPERCONDUCTIVE TAPES OR BANDS
|
|
|
3431631 |
REFRACTORY METAL DIFFUSION BONDING
|
|
|
3396454 |
Method of forming ohmic contacts in semiconductor devices
|
|
|
3376121 |
Composite body and method of making
|
|
|
3374092 |
High temperature brazing alloys for tungsten and tantalum and alloys thereof
|
|
|
3370342 |
Fluxless soldering process for rare earth chalcogenides
|
|
|
3362064 |
Measuring device
|
|
|
3359623 |
Method for making refractory metal contacts having integral welding surfaces thereon
|