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7632750 |
Arrangement for solder bump formation on wafers
An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a...
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7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages
A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a...
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7506794 |
High-temperature alloy standoffs for injection molding of solder
A method in forming high-temperature alloy solder standoff in a solder bumping process, such as in injection molded solder molds. The standoffs are formed in an injection molded solder mold, by...
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7380698 |
Method of connecting module layers suitable for the production of microstructure modules and a microstructure module
A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional...
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7368035 |
Method for brazing and adhesive bonding
An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge...
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7360677 |
Spot joining method of metal members and spot joining apparatus of metal members
In a spot joining method and apparatus, pressing force of a rotating tool is maintained at a first pressing force, the frictional heat due to the rotation of the rotating tool is generated on a...
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7357293 |
Soldering an electronics package to a motherboard
In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered...
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7331502 |
Method of manufacturing electronic part and electronic part obtained by the method
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder...
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7328831 |
Method of making a brazed metal article and the article formed thereby
A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal...
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7311242 |
Design of an insulated cavity
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA 1 ] with a connecting surface of a second silicon wafer [WA 2 ] so as to form an insulated cavity...
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7293689 |
Two tier brazing for joining copper tubes to manifolds
A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube....
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7168608 |
System and method for hermetic seal formation
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder...
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7157150 |
Brazing titanium to stainless steel using layered particulate
A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material...
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7059512 |
Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor...
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7022415 |
Layered sphere braze material
The invention is a method of bonding a ceramic part ( 6 ) to a metal part ( 4 ) by heating a component assembly ( 2 ) comprised of the metal part ( 4 ), the ceramic part ( 6 ), and a thin laminated...
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6994243 |
Low temperature solder chip attach structure and process to produce a high temperature interconnection
A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has...
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6994245 |
Micro-reactor fabrication
A micro-reactor that is formed from a plurality of metal foil layers that are shaped by use of lithographic techniques in specific shapes. The formed metal foils layers are stacked and aligned...
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6957762 |
Vacuum brazing method for aluminum-based material
A vacuum brazing method is disclosed for joining aluminum stock materials to each other. The typical cladding material utilized includes aluminum and a melting point lowering agent such as silicon....
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6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
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6921014 |
Method for forming a channel on the surface of a metal substrate
A method for forming a channel within a coated, metal-based substrate is described. In one technique, a channel-forming material is first deposited on the substrate, followed by the deposition of a...
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6880244 |
Circuit board having simultaneously and unitarily formed wiring patterns and protrusions
Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including...
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6875332 |
Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for...
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6860420 |
Method of joining metal oilfield tubulars and well provided therewith
A method of interconnecting a pair of metal oilfield tubulars having complementary tapered edges with a common contact surface when the tubulars are interconnected, is provided. The method consist...
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6849136 |
Filler metal for aluminum brazing sheet for heat exchangers and method of manufacturing same
An object of the present invention is to provide a filler metal for an aluminum brazing sheet for heat exchangers capable of preventing or controlling occurrence of a melting hole during heating...
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6827251 |
Method for joining
A substrate ( 101 ) is coated with an aqueous solution of boehmite (AlO(OH)) which is an aluminum hydroxide to form a coating film ( 102 ), and the property of the coating film ( 102 ) is modified...
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6820798 |
Method for producing circuit arrangments
The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element ( 5 ), said element having thermal through-platings ( 7 )...
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6818988 |
Method of making a circuitized substrate and the resultant circuitized substrate
A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder...
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6799711 |
Minute copper balls and a method for their manufacture
Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn...
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6786390 |
LED stack manufacturing method and its structure thereof
A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and...
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6763580 |
Method and apparatus for securing an electrically conductive interconnect through a metallic substrate
A method and module for securing a conductive interconnect ( 30 ) through a metallic substrate ( 36 ). The method includes the steps of: forming a hole ( 34 ) in the metallic substrate ( 36 ), the...
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6758387 |
Solder coated material and method for its manufacture
The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient...
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6757963 |
Method of joining components using a silver-based composition
A surface of a first ceramic component is joined to a surface of a second ceramic component using a silver-based composition. The silver-based composition is a mixture of silver metal and a metal...
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6745930 |
Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member
The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat...
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6729532 |
Component mounting method
A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a...
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6712261 |
Solid conductive element insertion apparatus
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion...
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6708869 |
Method for production of heat exchanger
A heat exchanger, characterized in that Al or Al alloy tubes, each having a thermally Zn-sprayed layer formed on the surface of it, and having a brazing filler metal layer formed on said thermally...
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6708868 |
Method for producing weld points on a substrate and guide for implementing said method
A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive...
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6705512 |
Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding
A method of bonding a bonding element to a metal bonding pad comprises the following steps. A semiconductor structure having an exposed, recessed metal bonding pad within a layer opening is...
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6704150 |
Bonder chuck and optical component mounting structure interface
12 of 12 An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it...
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6702176 |
Solder, method for processing surface of printed wiring board, and method for mounting electronic part
A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
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6681484 |
Method for manufacturing electronic component
The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance...
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6637644 |
Method of manufacturing heat insulating structural and/or light elements and installation for carrying out the method
A method of manufacturing heat-insulating structural and/or light elements composed of at least two wall elements of glass, a glass alloy or metal, wherein the wall elements are separated from each...
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6637643 |
Method of applying a bond coating and a thermal barrier coating on a metal substrate, and related articles
A method for applying at least one bond coating on a surface of a metal-based substrate is described. A foil of the bond coating material is first attached to the substrate surface and then fused...
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6636313 |
Method of measuring photoresist and bump misalignment
A method including the acts of providing a semiconductor device having a plurality of misalignment ruler markers formed therein for measuring removable layer opening misalignment in the X and Y...
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6622773 |
Method and apparatus for forming solder balls
Methods and apparatus for forming a plurality of uniformly sized solder balls utilize a stencil having a plurality of holes of uniform volume disposed on a substrate. Solder is disposed in the...
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6610430 |
Method of attaching a device to a circuit board
A method of soldering a ball grid array device onto a circuit board which includes: positioning a solder paste brick on top of a contact pad of the circuit board, said solder past brick defining an...
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6609652 |
Ball bumping substrates, particuarly wafers
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the...
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6604499 |
Oil-through type push rod
An oil-through type push rod for, for instance, internal combustion engines including a metal pipe and a metal end fitting which has an oil hole formed therein and is welded to the end of the metal...
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6599645 |
Composite metal panel
The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet...
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6578755 |
Polymer collar for solder bumps
A method of forming a polymer support ring, or collar, around the base of solder balls used to form solder joints includes forming patterned regions of uncured polymer material over each of the...
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