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8172126 |
Joining of parts via magnetic heating of metal-aluminum powders
A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least...
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8167190 |
Electrically conductive polymer compositions containing metal particles and a graphene and methods for production and use thereof
Polymer compositions containing a polymer matrix, a graphene that is covalently bonded to the polymer matrix and metal particles are described herein. A combined concentration of the metal...
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8141766 |
Automatic soldering system
An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism,...
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8136716 |
Soldering work piece, soldering method and heat exchanger
The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the...
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8123111 |
Production method of solder circuit board
A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area....
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8123109 |
Method for making brazed heat exchanger and apparatus
Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond...
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8123105 |
Process for brazing wide gaps
A method for repairing wider gaps in a substrate of a component by brazing at a brazing temperature is provided. Filler material and solder are prevented from separating in that, in a two-stage...
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8118211 |
Method for the low-temperature pressure sintering of electronic units to heat sinks
A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following...
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8109432 |
Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto...
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8104663 |
Solder ball mounting method and apparatus
The periphery of a mask (3) is formed higher than a region where a ball holding hole (3a) is formed, a work (1) is arranged at a lower section of the ball holding hole (3a) of the mask (3), and the...
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8100314 |
Carbon nanotubes solder composite for high performance interconnect
An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined...
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8091766 |
Method and apparatus for loading solder balls
A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask...
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8070045 |
Curable amine flux composition and method of soldering
A curable amine flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; an amine fluxing agent represented by formula I:...
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8070046 |
Amine flux composition and method of soldering
An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a...
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8070043 |
Curable flux composition and method of soldering
A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a fluxing agent represented by formula I: wherein R1,...
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8070044 |
Polyamine flux composition and method of soldering
A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a...
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8070047 |
Flux composition and method of soldering
A flux composition is provided, comprising, as an initial component: a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted...
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8038050 |
Solder ball printing apparatus
The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball...
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8038051 |
Method for production of electronic circuit board
A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering...
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8016184 |
Method for manufacturing electronic component module
A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective...
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8016181 |
Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device
A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes...
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7975898 |
Joining method and reflow apparatus
A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt...
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7946470 |
Method for depositing solder material on an electronic component part using separators
A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder...
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7946471 |
Brazing composition and brazing method for superalloys
A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus...
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7926700 |
Solder pastes comprising nonresinous fluxes
According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the...
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7919359 |
Semiconductor mounting substrate and method for manufacturing the same
A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device...
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7918382 |
Method for attaching a porous metal layer to a metal substrate
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip...
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7905383 |
Manufacturing method of metal matrix composite using friction stir welding
A metal layer such as copper, silver or nickel is coated on a surface of reinforcement particles (aluminum oxide or silicon carbide powder) by electroless plating technique. The metal-coated...
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7896223 |
Solder ball printing apparatus
Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is...
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7891540 |
Soldering work piece, soldering method and heat exchanger
The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the...
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7886957 |
Method of bonding probes and method of manufacturing a probe card using the same
In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder...
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7878387 |
Magnetic particle containing material for fastening together parts or substrates
In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an...
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7874472 |
Method for diffusion bonding metallic components with nanoparticle foil
A method for joining metal parts of a turbine engine component, the method comprising positioning a nanoparticle foil between faying surfaces of the metal parts, and diffusion bonding the metal...
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7870991 |
Electronic component mounting system and electronic component mounting method
In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of...
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7857194 |
Method of joining metals to ceramic matrix composites
A method of joining metals to a ceramic material such as a ceramic matrix composite is provided which utilizes a compliant interlayer having a coefficient of thermal expansion between the...
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7854367 |
Apparatus and method for arranging magnetic solder balls
An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower...
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7845541 |
Soldering apparatus and soldering method
A soldering apparatus has a fixture receiving an electronic component and a conducting wire, with a free end of the conducting wire superimposed on the soldering area of the electronic component, a...
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7845547 |
Method for manufacturing a printed wiring board
A method for manufacturing a printed wiring board having a bump. The method includes forming a solder-resist layer having a small-diameter aperture and a large-diameter aperture, each aperture...
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7832616 |
Methods of securing a thermocouple to a ceramic substrate
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of...
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7832618 |
Termination bonding
Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of...
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7810705 |
Apparatus and method for supplying electrically conductive material
In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is...
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7810701 |
Method for bonding metallic terminals by using elastic contact
A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact each other at a contact portion. Regarding the elastic contact, a resistive...
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7793820 |
Solder preform and a process for its manufacture
A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder...
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7793817 |
Electronic component placing apparatus and electronic component mounting method
To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp...
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7793818 |
Semiconductor device, manufacturing method and apparatus for the same
A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is...
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7789288 |
Brazing process and material for repairing a component
A process and braze paste suitable for filling and closing voids in relatively thin wall sections of high temperature components, such as an impingement plate of a combustor of a gas turbine...
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7789285 |
Solder printing process to reduce void formation in a microvia
In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with...
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7784671 |
Apparatus and method for arranging magnetic solder balls
An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower...
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7775416 |
Microwave brazing process
A process for heating a braze alloy by microwave radiation so that heating of the alloy is selective and sufficient to cause complete melting of the alloy and permit metallurgical bonding to a...
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7775414 |
Consumable insert and method of using the same
A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center...
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