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7607216 |
Method for manufacturing monolithic ceramic electronic component
A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially...
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7584533 |
Method of fabricating an inductor structure on an integrated circuit structure
A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal...
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7527755 |
Method for increasing bulk conductivity of a ferroelectric material such as lithium tantalate
In one embodiment, a ferroelectric material is processed by placing the material in an environment including metal vapor and heating the material to a temperature below the Curie temperature of the...
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7428979 |
Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated...
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7413109 |
Joining of advanced materials by superplastic deformation
A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this...
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7412766 |
Method of fabricating coil-embedded inductor
A method of fabricating a coil-embedded inductor provides steps for obtaining uniform density of coil-embedded inductor. The cavity of a first die is filled with dust before being flipped, and then...
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7380699 |
Method and apparatus for vapour phase soldering
The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone,...
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7377418 |
Method of brazing aluminum products and furnace therefor
When aluminium products are preheated in a preheating furnace up to about 500° C. before they are brazed with a flux in a heating furnace, a nitrogen atmosphere in the preheating furnace is made...
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7347354 |
Metallic solder thermal interface material layer and application of the same
A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member,...
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7306133 |
System for fabricating an integrated circuit package on a printed circuit board
A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered...
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7246736 |
Supplying shielding gas
A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially...
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7222774 |
Electronic component mounting apparatus and electronic component mounting method
In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component...
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7165314 |
Method for manufacturing a magnetic head arm assembly (HAA)
A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC)...
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7114644 |
Joining method by Au-Sn brazing material
The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the...
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7112358 |
Self-adhesive purge dam for retaining purge gas around a weld zone
A self-adhesive purge dam for retaining purge gas around a weld zone includes a base configured to substantially obstruct an air passage leading to the weld zone and an adhesive skirt extending...
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7100279 |
Method of mounting an electronic part
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and...
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7077306 |
Ceramic armor and method of making by encapsulation in a hot pressed three layer metal assembly
A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed....
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7073703 |
Aluminum/ceramic bonding substrate and method for producing same
An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at...
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7051424 |
Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension
A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension.
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7036711 |
PROCESS FOR THE MANUFACTURE OF METAL-CERAMIC COMPOUND MATERIAL IN PARTICULAR METAL-CERAMIC SUBSTRATES AND METAL-CERAMIC COMPOUND MATERIAL ESPECIALLY METAL-CERAMIC SUBSTRATE MANUFACTURED ACCORDING TO THIS PROCESS
In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal...
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7026569 |
Welding machine
The inventive system and method allows the control of shielding gas in an electric welding apparatus having automatic wire feed by controlling the flow rate of the shielding gas as a function of...
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7021521 |
Bump connection and method and apparatus for forming said connection
A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is...
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6994919 |
Brazing product and method of manufacturing a brazing product
The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to...
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6940034 |
Long life welding electrode and its fixing structure, welding head, and welding method
A fixing structure for a welding electrode and a welding head is shown which enable improvement of durability of a welding electrode, improvement of work efficiency in welding, and a reduction of...
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6936793 |
Oven apparatus and method of use thereof
A solder reflow oven with horizontal cyclonic convection air flow for enhancing equalized heating of printed circuit boards conveyed therethrough. Air circulation apparatus can include a first air...
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6908026 |
Method and apparatus for making a lid with an optically transmissive window
A metal plate ( 126 ) has a plurality of openings ( 127 ) extending through it, and is cleaned using a wet hydrogen process ( 157 ). Glass windows ( 106 ) are then placed in the openings, and are...
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6905063 |
Method of manufacturing semiconductor device
A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the...
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6896977 |
Method of brazing aluminum or aluminum alloy materials and aluminum alloy brazing sheet
A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both...
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6885613 |
Apparatus for monitoring a solder wave
There is disclosed apparatus for monitoring a solder wave comprising a board of insulating material simulating a printed circuit board, an array of spaced electrical contact elements on the...
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6866182 |
Apparatus and method to prevent oxidation of electronic devices
The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which...
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6857558 |
Metal lamination method and structure
A method of forge welding laminates of titanium and titanium alloys includes interleaving first and second pluralities of metal pieces in an enclosure, filling the enclosure with an inert gas,...
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6840435 |
Method for brazing aluminum alloy-assembled articles within a short period of time and a filler alloy usable at low temperature
A method for brazing aluminum alloy-assembled articles with a filler alloy having a liquidus temperature of 540° C. or lower and a difference of temperature between the liquidus temperature and...
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6834790 |
Friction welding
Blades ( 20 ) are friction welded onto a disc ( 10 ) to form an integrally bladed rotor. To prevent the formation of defects in the weld interface between the blades ( 20 ) and the disc ( 10 ) a...
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6829818 |
Manufacturing method of a head gimbal assembly
A magnetic head slider with at least one thin-film magnetic head element on a suspension is mounted. This mounting includes electrically connecting the magnetic head slider with the suspension with...
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6827253 |
Method and means for rapid heat-sink soldering
A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of...
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6805279 |
Fluxless bumping process using ions
A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and...
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6796483 |
Method and device for producing a soldered joint
A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece...
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6793119 |
Process for welding duplex steel
Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex...
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6780225 |
Reflow oven gas management system and method
Reflow solder oven gas management system introduces an inert gas into and removes contaminated gas from a reflow oven tunnel ( 42 ) at predetermined points ( 6, 8 ) to influence the oven tunnel gas...
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6732911 |
Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the...
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6712260 |
Bump reflow method by inert gas plasma
A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side...
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6702177 |
Manufacturing process for a plated product comprising a support part in steel and an anticorrosion metallic coating
The aim of the present invention is a process for manufacturing a plated product ( 1 ) comprising a support part in steel ( 2 ) and an anticorrosion metallic coating ( 3 ), characterized in that...
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6635360 |
Aluminum alloy brazing sheet
A brazing sheet comprises a thin covering material and a core material as well as an Al—Si alloy brazing material inserted between the thin covering material and the core material. The brazing...
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6634544 |
Method and arrangement for improving quality in fusion welding operations
Arrangement for improving quality in fusion welding operations where protective gas is supplied to the welding point via a hose line. The arrangement comprises means ( 5, 6 ), such as a bypass line...
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6624387 |
Process for MSG-soldering and use of a shielding gas
The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby...
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6601753 |
Void-free die attachment method with low melting metal
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the...
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6600137 |
Heating device and heating method
The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat...
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6599645 |
Composite metal panel
The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet...
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6570127 |
Shielding gas mixture for MIG brazing
The shielding gas mixture is useful for MIG brazing galvanized steel. The gas mixture having by volume percent, about 0.5 to 4 carbon dioxide, about 0.2 to 1 hydrogen, and the balance is argon and...
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6568584 |
Nickel-plated brazing sheet product
The invention relates to a brazing sheet product comprising a core sheet made of an aluminum alloy, an aluminum clad layer cladding at least one of the surfaces of said core sheet, and a layer...
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