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7525064 |
Method of forming a flux layer on an aluminum plate member
The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be...
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7219419 |
Component mounting apparatus including a polishing device
Component ( 3 ) is pressed onto a circuit board ( 4 ) so that their respective metal interconnects ( 5 ), ( 6 ) are in close contact with each other, and ultrasonic vibration is applied to the...
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7100279 |
Method of mounting an electronic part
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and...
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6974069 |
Solder ball attaching system and method
The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls...
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6880745 |
Method of diffusion bonding superalloy laminates
A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter...
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6840431 |
Methods of bonding two aluminum-comprising masses to one another
The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one...
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6805279 |
Fluxless bumping process using ions
A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and...
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6742701 |
Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft...
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6712262 |
Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective...
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6712260 |
Bump reflow method by inert gas plasma
A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side...
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6698647 |
Aluminum-comprising target/backing plate structures
The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in 2 . The invention...
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6689482 |
Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate
A method of manufacturing a high-quality metal foil/ceramics joining material ( 19 ) and a metal foil laminated ceramic substrate ( 20 ) which can prevent a damage to a ceramic material and enhance...
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6663980 |
Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame
The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad...
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6607613 |
Solder ball with chemically and mechanically enhanced surface properties
A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a...
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6536649 |
Method of preventing residue contamination of semiconductor devices during furnace processing
Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate...
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6527164 |
Removing flux residue from reflow furnace using active gaseous solvent
A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the...
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6471115 |
Process for manufacturing electronic circuit devices
The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising...
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6410881 |
Process for manufacturing electronic circuits
The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate...
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6375060 |
Fluxless solder attachment of a microelectronic chip to a substrate
A chip bonding location of a microelectronic chip is joined to a substrate bonding location of a substrate using a metallic solder in the absence of a flux. Surface contamination and oxide are...
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6367686 |
Self cleaning braze material
The present invention relates to a self cleaning braze paste which is used in the repair of gas turbine engines. The braze paste comprises lithium fluoride in an amount sufficient to act as a flux...
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6345756 |
Defectively joined portion removal apparatus for use in a continuous hot rolling process
The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are...
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6332568 |
Wafer scale micromachine assembly method
A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first...
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6332567 |
Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators
An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined...
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6250540 |
Fluxless joining process for enriched solders
A process for promoting fluxless soldering of a mass of bulk solder having a bulk ratio of a first metal to a second metal, such as lead-enriched solder that has significantly more lead than tin....
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6227436 |
Method of fabricating an electronic circuit device and apparatus for performing the method
In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the...
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6189770 |
Method of producing sectional strips and sectional sheets
A method of producing sectional strips and sectional sheets of different thicknesses over the width, in which at least two metal strips or metal sheets of different widths are joined to each other...
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6189769 |
Method of cable wire arrangement
The invention discloses a method of arranging a plurality of wires of a cable at proper positions for soldering to corresponding terminals of a connector. An arrangement for preparing wires of a...
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6158648 |
Method and apparatus for bonding using brazing material
High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic....
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6093904 |
Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus
There are disclosed a surface treatment apparatus and a wire bonding apparatus which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost The...
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6092714 |
Method of utilizing a plasma gas mixture containing argon and CF.sub.4 to clean and coat a conductor
A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF 4 to clean and coat a conductor. The method for cleaning and...
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6089445 |
Method and device for dry fluxing of metallic surfaces before soldering or tinning
The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to...
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6085965 |
Pressure bonding and densification process for manufacturing low density core metal parts
A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density...
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6079612 |
Big scale (500cc) golf club head fabrication method
A big scale (500 cc) golf club head fabrication method includes the step of preparing molds for making a top cover panel, a bottom cover panel and a face panel, the step of preparing metal alloy...
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6073830 |
Sputter target/backing plate assembly and method of making same
This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding...
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6053395 |
Method of flip-chip bonding between a chip element and a wafer-board
A method of bonding a chip element to a wafer-board through at least a solder bump having a surface coated with an oxide layer placed between the chip element and the wafer-board is provided. The...
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6021940 |
Method and apparatus for reflow soldering metallic surfaces
The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed...
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5960251 |
Organic-metallic composite coating for copper surface protection
Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of...
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5931370 |
Method to weld billets leaving a furnace and a rolling line adopting the method
Method is for welding billets leaving a heating furnace in a rolling line, the line including, in the segment (10) between the heating furnace (11) and the first rolling stand, at least a drawing...
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5906311 |
Secondary coil plate for linear motor and producing method of the same
A surface metal plate 2 made of aluminium or aluminium alloy is overlayed upon a backing metal plate 1 and integrally bonded by cold rolling bonding of a rolling machine 30. After that, the thus...
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5894053 |
Process for applying a metallic adhesion layer for ceramic thermal barrier coatings to metallic components
In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings to metallic components, the surface which is to be coated being cleaned in a first process...
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5816480 |
Method for cleaning a bonding tool used on covered bonding wires
A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for...
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5812925 |
Low temperature bonding of materials
A method for joining a first metal surface to a second metal surface that includes providing powder metal particles substantially all of which have hardnesses lower than the hardnesses of the first...
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5799860 |
Preparation and bonding of workpieces to form sputtering targets and other assemblies
A sputtering target assembly is fabricated by diffusion bonding a target material plate to a backing plate. The plates are cleaned in a vacuum environment, and an interlayer is formed on one or...
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5767577 |
Method of solder bonding and power semiconductor device manufactured by the method
A method of solder bonding suitable for a body having a large bonding surface area including the following steps of cleaning off the bonding surfaces in vacuum chamber by impinging accelerated...
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5672261 |
Method for brazing an end plate within an open body end, and brazed article
A method for preparing a Ni base superalloy inner wall surface of a body open end, such as an end of a turbomachinery blade, and an end plate, such as a blade tip cap, for brazing together at a rim...
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5669548 |
Soldering method
A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an...
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5598968 |
Method for preventing recrystallization after cold working a superalloy article
A process is provided for manufacturing and repairing components, and particularly superalloy components such as gas turbine engine components. The invention entails forming precipitates in a...
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5547122 |
Joints in bonding of electrical wires
A method is disclosed for improving the metallurgical bond between the end of an armature wire of an electric motor and the connector riser or tine on the motor armature. The armature wire has a...
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5516031 |
Soldering method and apparatus for use in connecting electronic circuit devices
In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a...
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5513791 |
Strippable mask patterning of stop-off for diffusion bond processing
An improved method for forming fluid inflatable metal structures is taught. The improvement concerns the patterning of the portion of the structure to be inflated. Patterning is accomplished by...
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