Matches 1 - 50 out of 150 1 2 3 >
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6820795 Joined article of a supporting member for a semiconductor wafer and a method of producing the same  
A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting...
6534194 Method of making reactive multilayer foil and resulting product  
In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the...
6316125 Aluminum welding process and composition for use in same  
The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one...
6199751 Polymer with transient liquid phase bondable particles  
A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The...
6089444 Process of bonding copper and tungsten  
Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM)...
6066219 Process for producing a ceramic substrate and a ceramic substrate  
The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer...
5988488 Process of bonding copper and tungsten  
Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM)...
5985464 Composite structure, and method of making same  
A composite structure includes a first nonmetallic component and a second mponent of metal or nonmetal, with the first and second components being joined together by a bonding material which is so...
5788142 Process for joining, coating or repairing parts made of intermetallic material  
A process for joining two parts of which at least one is made of an intermetallic material comprises: mixing elemental powders to form an intermetallic compound of the same type as that of the...
5679464 Joined product of heat-resisting alloys and method for joining heat-resisting alloys  
The present invention provides a joined product of heat-resisting alloys, comprising heat-resisting alloy sheets or foils optionally having an oxide film on their surfaces, said heat-resisting...
5628448 Process for bonding a contact layer of silver-metal oxide material and metal contact base, and suitable contact layer  
A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding...
5574629 Solderless printed wiring devices  
In a printed wiring device, the combination of a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the...
5564620 Forming metal-intermetallic or metal-ceramic composites by self-propagating high-temperature reactions  
Industrial applications of composites often require that the final product have a complex shape. In this invention intermetallic or ceramic phases are formed from sheets of unreacted elemental...
5549335 Solderless metallurgical joint  
A metallurgical joint between a copper tube and an aluminum tube is disclosed. The metallurgical joint between the tubes is elongated and extends along the length of the telescoping tubes and is...
5521150 Method of joining Y-based oxide superconductors  
Disclosed is a method of joining Y-based oxide superconductors on joining two or more Y-based oxide superconductors made by melting process under pressure, characterized by incorporating REBa 2 Cu...
5503698 Bonding method employing organometallic interconnectors  
A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder...
5490627 Direct bonding of copper composites to ceramics  
A ceramic member (52) is direct-bonded to a copper composite substrate (58) by heating to diffuse copper to the surface (56) of the copper composite substrate, oxidizing the surface of the copper...
5425496 Method for joining ceramic and metal-ceramic heating elements to electrical terminals by micropyretic synthesis, compositions for electrical terminals and heaters comprising the same  
A method for joining a ceramic or metal ceramic electrical heating element to a electrical terminal is disclosed, the heating element having been manufactured using micropyretic synthesis, the...
5425494 Method for forming infiltrated fiber-reinforced metallic and intermetallic alloy matrix composites  
Reinforced metallic or intermetallic alloy matrix composite materials which are reinforced by the incorporation of preferably small-diameter ceramic fibers infiltrated within a metal bonding layer....
5421507 Au-Sn transient liquid bonding in high performance laminates  
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects...
5419484 Apparatus and process for aluminothermic welding  
The disclosure relates to a multi-part mold for aluminothermic welding without preheating of metal parts, said mold having internally employed a welding cavity and two rising channels with variable...
5383594 Radiation-shielding transport and storage container  
A radiation-shielding storage/transport container has a cast-iron vessel having an open end defining an end face, a steel ring engaging the end face and forming at least one annular seat, a weld...
5372295 Solder material, junctioning method, junction material, and semiconductor device  
A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising...
5350107 Iron aluminide alloy coatings and joints, and methods of forming  
A method of joining two bodies together, at least one of the bodies being predominantly composed of metal, the two bodies each having a respective joint surface for joining with the joint surface...
5340014 Combustible slurry for joining metallic or ceramic surfaces or for coating metallic, ceramic and refractory surfaces  
A slurry for joining metallic or ceramic surfaces or for coating metallic or ceramic and refractory surfaces, comprising a liquid suspending medium and at least two constituents in particulate form...
5338072 Gastight connection between tubes of small diameter  
The invention relates to a gastight connection between tubes of small diameter of metals or metal alloys having different melting points, more particularly copper and aluminium, wherein the end...
5316863 Self-brazing aluminum laminated structure  
A novel self-brazing aluminum laminated structure is described, as well as a method of making the laminated structure and a brazed product produced therefrom. The laminated structure consists of a...
5292057 Fixture for, and method of, welding grounding connector to structural steel member  
A fixture for welding a grounding connector to a structural steel member is disclosed. Such fixture is formed of a magnetic material so that the fixture is attracted to, and retained upon, the...
5273203 Ceramic-to-conducting-lead hermetic seal  
A hermetic seal is provided for a conductive feedthrough through a thin ceramic component by a platinum or palladium lead by sealing the gap between the lead and the ceramic with a copper-copper...
5259549 Method to attach a plate to a steel substrate  
Shown is a method to attach a plate to a steel substrate. An iron or ferr alloy disk is fixed at one end of a pipe and wafers of aluminum or other iron reducing agent are stacked in the pipe on the...
5240171 Method for surface bonding of ceramic bodies  
Two or more ceramic bodies are bonded together by oxidizing with a vapor-phase oxidant molten metal obtained from a body of precursor metal to form an oxidation reaction product bond. The oxidation...
5203488 Method for joining ceramic composite bodies and articles formed thereby  
This invention relates generally to a novel method for joining at least one first self-supporting body, to at least one second self-supporting body which is similar in composition to or different...
5186380 Titanium hydride coated brazing product  
A one step ceramic brazing material preferably for use in joining ceramics to each other or in joining a ceramic to a metal. The brazing material includes a strip of a eutectic alloy and greater...
5156322 Process for the production of a solder coating on metallized materials  
A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the...
5133494 Method for joining ceramic composite bodies and articles formed thereby  
This invention relates generally to a novel method for joining at least one first self-supporting body, to at least one second self-supporting body which is similar in composition to or different...
5125557 Ceramics bonded product and method of producing the same  
Disclosed is a ceramics bonded product, which comprises a ceramics sintered body bonded to another ceramics sintered body or a metal member through a ductile metal and a group IVa transition metal...
5121871 Solder extrusion pressure bonding process and bonded products produced thereby  
Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40° C. and 110° C. Process involves interposing a thin layer of a metal...
5118029 Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board  
A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a circuit board. Then, the paste-like compsition is heated so as to cause...
5108026 Eutectic bonding of metal to ceramic  
An improved eutectic oxide bonding method is applied for bonding a metallic copper foil to a nonmetallic substrate by forming a liquid phase derived from a eutectic oxide composition. A metallic...
5104029 Method of bonding a ceramic composite body to a second body and articles produced thereby  
This invention relates generally to a novel method of manufacturing a composite body and to novel products made thereby. More particularly, the invention relates to a method of producing a...
5100049 Method of bonding carbon-carbon and metal matrix composite structures  
A method of bonding two carbon/carbon composite pieces or a carbon/carbon mposite piece and a graphite/aluminum metal matrix composite piece together by (1) forming a uniform coating of molten...
5100048 Method of brazing aluminum  
A novel method is described for joining aluminum surfaces by brazing. The method comprises (a) applying as a coating to at least one of the aluminum surfaces to be joined a mixture of a metal and a...
5082163 Method of metallizing non-oxide ceramics  
A non-oxide ceramic material such as aluminum nitride can be metallized with copper by directly bonding a thin sheet of copper to a substrate of the non-oxide ceramic material instead of using a...
5054683 Method of bonding together two bodies with silicon oxide and practically pure boron  
A method is set forth of bonding together two bodies (1, 2), according to which a first body (1) is provided with a flat surface (5) and the second body (2) is provided with a silicon oxide layer...
5040718 Method of repairing damages in superalloys  
A method of repairing damages in a superalloy component is disclosed wherein existing brazed joints and protective coatings are not harmed. The method entails the use of a silicon-free metal...
5017738 Connecting apparatus  
A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The...
5009360 Metal-to-metal bonding method and resulting structure  
A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved....
5005285 Method of producing an aluminum heat exchanger  
A method of producing an aluminum or aluminum alloy heat exchanger which involves the use of an aluminum-silicon alloy brazing filler metal element bearing zinc. During brazing, a diffused zinc...
4972988 Method of soldering semiconductor substrate on supporting plate  
In order to solder a silicon substrate on a supporting plate, an aluminum thin plate is inserted therebetween as a solder metal layer. An assembly thus obtained is heated to 580° C. which is...
4961529 Method and components for bonding a silicon carbide molded part to another such part or to a metallic part  
A layer of titanium carbosilicide Ti 3 SiC 2 on a silicon carbide surface polished for making a joint makes it possible to join silicon carbide bodies together in a hot pressing procedure and...
Matches 1 - 50 out of 150 1 2 3 >