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7377415 |
Bond head link assembly for a wire bonding machine
A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes...
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7371676 |
Method for fabricating semiconductor components with through wire interconnects
A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also...
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7370785 |
Wire bonding method and apparatus
A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position...
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7360675 |
Wire bonder for ball bonding insulated wire and method of using same
An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical...
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7353976 |
Wire bonder
A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At...
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7347352 |
Low loop height ball bonding method and apparatus
In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to...
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7326640 |
Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads
Disclosed is a method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surfaces of semiconductor chips with copper pads, where a thin film that...
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7320424 |
Linear split axis wire bonder
A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach...
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7320423 |
High speed linear and rotary split-axis wire bonder
A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is...
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7314157 |
Wire bond with improved shear strength
A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a...
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7306132 |
Bonding apparatus
A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is...
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7303113 |
Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance...
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7299966 |
Initial ball forming method for wire bonding wire and wire bonding apparatus
An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that...
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7261230 |
Wirebonding insulated wire and capillary therefor
An improved method of bonding an insulated wire ( 14 ) that has one end connected to a first bond pad ( 16 ) to a second bond pad ( 18 ) includes moving a tip of a capillary ( 20 ) holding the bond...
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7259088 |
Apparatus for singulating and bonding semiconductor chips, and method for the same
An apparatus for singulating and bonding semiconductor chips includes a singulating station and a mounting station. In the singulating station, a semiconductor chip is provided with a bonding wire...
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7250684 |
Circular wire-bond pad, package made therewith, and method of assembling same
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also...
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7225538 |
Resilient contact structures formed and then attached to a substrate
Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical...
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7224067 |
Intermetallic solder with low melting point
Embodiments of the invention provide a low-melting temperature comprised primarily of a bulk intermetallic phase material. This solder may allow reflow with less of a chance to damage...
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7214606 |
Method of fabricating a wire bond with multiple stitch bonds
The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a...
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7213741 |
Lead wire bonding method
After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are...
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7192861 |
Wire bonding for thin semiconductor package
An assembly of a semiconductor chip ( 301 ) having an integrated circuit (IC) including at least one contact pad ( 320 ) on its surface ( 301 a ), wherein the contact pad has a metallization...
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7188759 |
Methods for forming conductive bumps and wire loops
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of...
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7174629 |
Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at...
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7168165 |
Fabrication of electrical medical leads employing multi-filar wire conductors
During fabrication of an electrical medical lead, a cut end of a stranded wire conductor is subjected to electrical current sufficient to heat and weld the strands together upon discharge of a high...
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7140529 |
Wire bonding method and apparatus
A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the...
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7137547 |
Process for forming electrical/mechanical connections
A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier;...
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7134591 |
Method of and apparatus for testing a wire bond connection
A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or...
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7131568 |
Methods for lead penetrating clamping system
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use...
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7124927 |
Flip chip bonding tool and ball placement capillary
A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high...
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7109589 |
Integrated circuit with substantially perpendicular wire bonds
An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for...
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7108167 |
Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method
A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical...
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7100814 |
Method for preparing integrated circuit modules for attachment to printed circuit substrates
A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer...
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7100812 |
Capillary holder
A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the...
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7086148 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated...
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7082682 |
Contact structures and methods for making same
Contact structures are formed by building a core structure on a substrate and over coating the core structure with a material that is harder or has a greater yield strength than the material of the...
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7080771 |
Method for checking the quality of a wedge bond
A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is...
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7077304 |
Bonding tool with polymer coating
A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the...
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7073702 |
Self-locking wire bond structure and method of making the same
A complimentary self-locking wire bond structure and technique is introduced, where the bonding force is focused at the tip of the bond wire and a barb-type construction is utilized to enhance the...
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7073247 |
Method of brazing a liquid-cooled stator bar
A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can...
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7051915 |
Capillary for wire bonding and method of wire bonding using it
A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed...
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7044357 |
Bump formation method and wire bonding method
Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a...
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7032802 |
Bonding tool with resistance
A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large...
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7025247 |
Wire bonding method
A wire bonding method including the steps of forming a bump by performing ball bonding of a ball by wire on a second conductor, raising a capillary to a height that is equal to or lower than the...
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7025243 |
Bondhead for wire bonding apparatus
A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool...
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7021521 |
Bump connection and method and apparatus for forming said connection
A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is...
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7021520 |
Stacked chip connection using stand off stitch bonding
The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the...
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7017794 |
Wire bonding method and wire bonding apparatus
A highly reliable bonding process is provided. The wire bonding method includes: (a) bonding a tip portion of a wire to a first electrode by pressing an open end section of a first hole of a first...
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7014095 |
Wire bonding method, wire bonding apparatus and wire bonding program
Wire bonding being performed by, following the formation of a neck portion on a wire at a first bonding point, raising the capillary from the neck portion while paying out a first specified length...
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7004373 |
Wire bond fault detection method and apparatus
A method and apparatus for confirming whether wire bonds are successfully made to sites on a workpiece by an ultrasonic bonding tool using wire supplied to an entrance bore through the tool from a...
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7004372 |
Method for determining optimum bond parameters when bonding with a wire bonder
A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With...
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