|
Match
|
Document |
Document Title |
|
|
8181845 |
Electrical bond connection system
An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least...
|
|
|
8156643 |
Semiconductor device
A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a...
|
|
|
8152046 |
Conductive bumps, wire loops, and methods of forming the same
A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the...
|
|
|
8141765 |
Cutting blade for a wire bonding system
A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a...
|
|
|
8143155 |
Wire bonding method and semiconductor device
After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a...
|
|
|
8132709 |
Semiconductor device and method for manufacturing same
A semiconductor device comprises a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within...
|
|
|
8123108 |
Method of manufacturing semiconductor device and wire bonding apparatus
A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point...
|
|
|
8100317 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and...
|
|
|
8096461 |
Wire-bonding machine with cover-gas supply device
A wire-bonding machine includes a main body, a fixture block, a mounting block, a gas supply tube, a cover-gas supply device, a capillary tool and an electrode. The fixture block is provided with a...
|
|
|
8091762 |
Wedge bonding method incorporating remote pattern recognition system
A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to...
|
|
|
8091761 |
Bonding apparatus and bonding method
A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired...
|
|
|
8087163 |
Method of manufacturing a contact arrangement between a microelectronic component and a carrier
The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by...
|
|
|
8066171 |
Conductive metal ball bonding with electrostatic discharge detection
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a...
|
|
|
8066170 |
Gas delivery system for reducing oxidation in wire bonding operations
A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the...
|
|
|
8056794 |
Combination wedge bonding and ball bonding transducer
A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least...
|
|
|
8051555 |
Circuit manufacturing apparatus
An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an...
|
|
|
8047421 |
Elliptic C4 with optimal orientation for enhanced reliability in electronic packages
An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical...
|
|
|
8042725 |
Wire bonding method, wire bonding apparatus, and wire bonding control program
The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even...
|
|
|
8033445 |
Nano-soldering to single atomic layer
A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are...
|
|
|
8025201 |
Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site...
|
|
|
8020290 |
Processes for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present...
|
|
|
8016182 |
Wire loop, semiconductor device having same and wire bonding method
A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point...
|
|
|
8016183 |
Adjustable clamp system and method for wire bonding die assembly
A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping...
|
|
|
8008183 |
Dual capillary IC wirebonding
The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires...
|
|
|
7975901 |
Bonding apparatus and wire bonding method
A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being...
|
|
|
7971349 |
Bump bonding method
In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness...
|
|
|
7938308 |
Wire bonder for improved bondability of a conductive wire and method therefor
A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is...
|
|
|
7934634 |
Wire bonding method
A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a...
|
|
|
7934633 |
Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create...
|
|
|
7934632 |
Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second...
|
|
|
7932171 |
Dual metal stud bumping for flip chip applications
A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a...
|
|
|
7931186 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and...
|
|
|
7926698 |
Spot heat wirebonding
Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a...
|
|
|
7909228 |
Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create...
|
|
|
7911061 |
Semiconductor device
A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact area faces away from the carrier, a...
|
|
|
7909233 |
Method of manufacturing a semiconductor package with fine pitch lead fingers
A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of...
|
|
|
7910472 |
Method of manufacturing semiconductor device
A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad...
|
|
|
7906858 |
Contact securing element for bonding a contact wire and for establishing an electrical connection
A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact...
|
|
|
7896218 |
Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive...
|
|
|
7886956 |
Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached...
|
|
|
7857190 |
Wire bonding apparatus, record medium storing bonding control program, and bonding method
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for...
|
|
|
7854368 |
Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance...
|
|
|
7851347 |
Wire bonding method and semiconductor device
Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point...
|
|
|
7845542 |
Monitoring deformation and time to logically constrain a bonding process
A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is...
|
|
|
7841508 |
Elliptic C4 with optimal orientation for enhanced reliability in electronic packages
A method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are...
|
|
|
7832616 |
Methods of securing a thermocouple to a ceramic substrate
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of...
|
|
|
7815095 |
Wire loop, semiconductor device having same and wire bonding method
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to...
|
|
|
7815122 |
Method for making an electronic label and electronic label obtained by said method
A method of making an electronic label including a chip (1) provided with two contact strips (2, 3) onto which a conducting wire (4) is welded in a single operation. The segment of conducting wire...
|
|
|
7810695 |
Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip
A wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip uses a grinding film of the wire bonding machine mounted on a clamp block. The...
|
|
|
7810703 |
Wire bonding method
A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact...
|