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7378297 |
Methods of bonding two semiconductor devices
A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second...
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7367489 |
Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps
A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of...
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7367486 |
System and method for forming solder joints
Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a...
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7358115 |
Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
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7357293 |
Soldering an electronics package to a motherboard
In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered...
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7356907 |
Method of manufacturing a carriage assembly of a hard disk drive
A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective...
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7353596 |
Component mounting method
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto...
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7351072 |
Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module
A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module...
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7348678 |
Integrated circuit package to provide high-bandwidth communication among multiple dice
A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some...
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7344061 |
Multi-functional solder and articles made therewith, such as microelectronic components
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation...
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7340829 |
Method for fabricating electrical connection structure of circuit board
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of...
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7331502 |
Method of manufacturing electronic part and electronic part obtained by the method
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder...
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7331500 |
Solder bumps formation using solder paste with shape retaining attribute
Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially...
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7328830 |
Structure and method for bonding to copper interconnect structures
An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed...
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7326859 |
Printed circuit boards having pads for solder balls and methods for the implementation thereof
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a...
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7325716 |
Dense intermetallic compound layer
Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve...
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7314819 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that...
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7311242 |
Design of an insulated cavity
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA 1 ] with a connecting surface of a second silicon wafer [WA 2 ] so as to form an insulated cavity...
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7299965 |
Method and apparatus for mounting and removing an electronic component
A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting...
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7296727 |
Apparatus and method for mounting electronic components
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the...
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7290321 |
Alignment apparatus and method for aligning stacked devices
An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus...
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7287685 |
Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders
Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a...
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7287317 |
Apparatus for mounting semiconductor chips
An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving...
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7273806 |
Forming of high aspect ratio conductive structure using injection molded solder
Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high...
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7268438 |
Semiconductor element including a wet prevention film
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package...
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7268437 |
Semiconductor package with encapsulated passive component
A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder...
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7263769 |
Multi-layered flexible print circuit board and manufacturing method thereof
A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit...
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7257887 |
Die holding apparatus for bonding systems
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and...
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7251880 |
Method and structure for identifying lead-free solder
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board...
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7249411 |
Methods for mounting surface-mounted electrical components
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7239484 |
Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device utilizing solder balls with nonmelting cores
A magnetic head slider or a precise positioning actuator is electrically and mechanically connected to a suspension, by performing molten-solder connections using solder balls with cores that will...
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7222776 |
Printed wiring board and manufacturing method therefor
A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is...
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7219825 |
SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is...
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7216424 |
Method for fabricating electrical connections of circuit board
A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit...
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7213740 |
Optical structures including liquid bumps and related methods
A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first...
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7213739 |
Underfill fluxing curative
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic...
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7213331 |
Method for forming stencil
A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the...
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7205177 |
Methods of bonding two semiconductor devices
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface...
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7192861 |
Wire bonding for thin semiconductor package
An assembly of a semiconductor chip ( 301 ) having an integrated circuit (IC) including at least one contact pad ( 320 ) on its surface ( 301 a ), wherein the contact pad has a metallization...
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7191516 |
Method for shielding integrated circuit devices
A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the...
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7188408 |
Method of making a straddle mount connector
A method of making an electrical connector includes the steps of: providing a connector body ( 2 ) having an insert ( 5 ) defining a recessed area ( 54 a ) at one side and a number of channels ( 54...
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7185799 |
Method of creating solder bar connections on electronic packages
Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating...
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7183648 |
Method and apparatus for low temperature copper to copper bonding
A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive...
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7180186 |
Ball grid array package
A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors...
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7178232 |
Connector having improved contacts with fusible members
An electrical connector includes a connector body, a plurality of cores and a plurality of electrically conductive contacts disposed in the cores of the connector body. Each of the contacts...
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7170036 |
Apparatus and method for heating and cooling an article
An apparatus for heating and cooling an article is provided. The apparatus comprises an enclosure having top, bottom, and side walls and an entrance and an exit. A first belt system comprising one...
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7166494 |
Method of fabricating a semiconductor stacked multi-package module having inverted second package
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
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7165314 |
Method for manufacturing a magnetic head arm assembly (HAA)
A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC)...
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7159309 |
Method of mounting electronic component on substrate without generation of voids in bonding material
When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate....
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7156283 |
Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor
A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the...
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