|
Match
|
Document |
Document Title |
|
|
8178156 |
Surface treatment process for circuit board
A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer...
|
|
|
8168920 |
Bonding device
A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light...
|
|
|
8166650 |
Method of manufacturing a printed circuit board
A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a...
|
|
|
8162200 |
Micro-fluidic injection molded solder (IMS)
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively...
|
|
|
8162203 |
Spherical solder reflow method
The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce...
|
|
|
8136714 |
Micro-fluidic injection molded solder (IMS)
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively...
|
|
|
8132775 |
Solder mold plates used in packaging process and method of manufacturing solder mold plates
Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate...
|
|
|
8127979 |
Electrolytic depositon and via filling in coreless substrate processing
Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a...
|
|
|
8122598 |
Multilayer printed wiring board and component mounting method thereof
A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof,...
|
|
|
8117982 |
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint...
|
|
|
8113412 |
Methods for detecting defect connections between metal bumps
A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second...
|
|
|
8104666 |
Thermal compressive bonding with separate die-attach and reflow processes
A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The...
|
|
|
8100314 |
Carbon nanotubes solder composite for high performance interconnect
An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined...
|
|
|
8096464 |
Solder-bearing articles and method of retaining a solder mass along a side edge thereof
A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and...
|
|
|
8092621 |
Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder all...
|
|
|
8091764 |
Joining method and device produced by this method and joining unit
A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy...
|
|
|
8087163 |
Method of manufacturing a contact arrangement between a microelectronic component and a carrier
The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by...
|
|
|
8087566 |
Techniques for arranging solder balls and forming bumps
A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the...
|
|
|
8083123 |
Method for manufacturing a printed wiring board
A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that...
|
|
|
8079141 |
Electrical connection and method of manufacturing the same
The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump...
|
|
|
8074867 |
Conductive ball mounting apparatus
A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a...
|
|
|
8070048 |
Method of attaching a solder ball and method of repairing a memory module
In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically...
|
|
|
8067835 |
Method and apparatus for manufacturing semiconductor module
Disclosed herewith is a semiconductor module manufacturing apparatus capable of reducing occurrence of warping of the wiring substrate, etc., as well as occurrence of failures of bonding between...
|
|
|
8061583 |
Ball mounting apparatus and method
A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate...
|
|
|
8052035 |
Method and mask assembly for forming solder bodies on a substrate
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole...
|
|
|
8048479 |
Method for placing material onto a target board by means of a transfer board
A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material...
|
|
|
8047421 |
Elliptic C4 with optimal orientation for enhanced reliability in electronic packages
An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical...
|
|
|
8042724 |
Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic...
|
|
|
8038050 |
Solder ball printing apparatus
The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball...
|
|
|
8033446 |
Manufacturing method of solid-state image pickup device
After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a...
|
|
|
8025205 |
Electronic component mounting method
By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface...
|
|
|
8001683 |
Solder ball loading method
This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied...
|
|
|
7980446 |
Micro-fluidic injection molded solder (IMS)
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively...
|
|
|
7975898 |
Joining method and reflow apparatus
A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt...
|
|
|
7971349 |
Bump bonding method
In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness...
|
|
|
7966721 |
Electronic component mounting method and electronic component mounting device
In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles...
|
|
|
7954693 |
Method of treating and probing a via
A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely...
|
|
|
7951700 |
Flip chip mounting method and bump forming method
The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3)...
|
|
|
7950141 |
Apparatus for the reworking of a microwave module
A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream...
|
|
|
7946470 |
Method for depositing solder material on an electronic component part using separators
A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder...
|
|
|
7943844 |
Thermoelectric module and manufacturing method for same
A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module...
|
|
|
7939939 |
Stable gold bump solder connections
A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2...
|
|
|
7938311 |
Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
The hybridization method provides a first component with first pads and a second component with second pads for accommodating protrusions of a fusible material, so that the first pads and second...
|
|
|
7931249 |
Reduced friction molds for injection molded solder processing
A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are...
|
|
|
7927997 |
Flip-chip mounting method and bump formation method
To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. A semiconductor chip...
|
|
|
7926697 |
Underfill formulation and method of increasing an adhesion property of same
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of...
|
|
|
7900809 |
Solder interconnection array with optimal mechanical integrity
A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a...
|
|
|
7900341 |
Method of manufacturing hard disk recording device using patterned medium
A high yield in a manufacture of an HDD having a high recording density and using a patterned medium by a trench-like or a dot-like pattern is realized. In this HDD manufacturing method, a magnetic...
|
|
|
7900349 |
Method of fabricating an electronic device
An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device...
|
|
|
7900807 |
Conductive ball mounting apparatus and conductive ball mounting method
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball...
|