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7383977 |
Method for attaching a shield can to a PCB and a shield can therefor
A method for providing a PCB (printed circuit board) with a shield can ( 1 ) comprising a metal shell with a free rim ( 5 ). The method prescribes that the rim ( 5 ) of the shield can ( 1 ) is...
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7378297 |
Methods of bonding two semiconductor devices
A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second...
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7357294 |
Method for mounting a semiconductor package onto PCB
A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a...
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7357293 |
Soldering an electronics package to a motherboard
In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered...
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7351072 |
Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module
A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module...
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7344060 |
Apparatus and method for aligning solder pads during head gimbal assembly soldering
A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at...
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7337534 |
SMD chip handling apparatus
The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart...
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7331500 |
Solder bumps formation using solder paste with shape retaining attribute
Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially...
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7328830 |
Structure and method for bonding to copper interconnect structures
An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed...
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7316062 |
Solder extraction tool and method
Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus...
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7288742 |
Method and device for heating a strip-shaped carrier
According to a method and a device for heating a strip-shaped carrier in an oven, a carrier is passed through the oven in a direction of conveyance. The carrier is supported by a heatable plate,...
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7263769 |
Multi-layered flexible print circuit board and manufacturing method thereof
A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit...
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7260890 |
Methods for fabricating three-dimensional all organic interconnect structures
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP...
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7257887 |
Die holding apparatus for bonding systems
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and...
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7251880 |
Method and structure for identifying lead-free solder
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board...
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7249411 |
Methods for mounting surface-mounted electrical components
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7237331 |
Electronic part manufacturing method and electronic part
Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical...
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7216792 |
Self assembled nano-devices using DNA
An article of manufacture including an organic structure and inorganic atoms bonded to specific locations on the organic structure.
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7205177 |
Methods of bonding two semiconductor devices
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface...
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7199329 |
Method of soldering semiconductor part and mounted structure of semiconductor part
A semiconductor part 1 in which a metal terminal 2 is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal 2 is in contact with a...
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7197819 |
Method of assembling an electric power
A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also...
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7191516 |
Method for shielding integrated circuit devices
A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the...
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7191515 |
Method for manufacturing an interconnected circuit board assembly
An electrical assembly ( 200 , FIG. 2 ) is formed from two, interconnected circuit boards ( 202, 204 ). Conductive spacers ( 240 ) and a conductive material ( 260 ) are placed between...
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7186926 |
Surface mounting structure for surface mounting an electronic component
A surface mounting structure for a surface mounting electronic component includes an electronic component, a circuit board and a solder fillet. The electronic component has on a marginal portion...
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7185420 |
Apparatus for thermally coupling a heat dissipation device to a microelectronic device
An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply...
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7174627 |
Method of fabricating known good dies from packaged integrated circuits
A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the...
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7159754 |
Apparatus and method for corrective soldering
The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints,...
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7153765 |
Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles
A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder...
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7150096 |
Universal tool for uniformly applying a force to a plurality of components on a circuit board
A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of...
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7128979 |
Circuit board, method of producing same, and power module
A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98%...
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7093746 |
Coated stencil with reduced surface tension
A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated...
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7071033 |
Method for forming semiconductor device including stacked dies
A semiconductor device including a leadframe and two stacked dies, a first of which is on a top surface of a leadframe while the second one is on a bottom surface of the leadframe. The drain region...
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7036217 |
Methods of manufacturing via intersect pad for electronic components
According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads....
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7032306 |
Method for producing module
The invention concerns a method for producing electronic modules with ball connector ( 7 ) or integrated preforms capable of being soldered on a printed circuit ( 3 ) and a device for implementing...
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7024764 |
Method of making an electronic package
A method of making an electronic package. The method includes forming a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact...
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7013564 |
Method of producing an electronic device having a PB free solder connection
A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free...
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7013557 |
Method of packaging electronic components without creating unnecessary solder balls
A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited....
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7007378 |
Process for manufacturing a printed wiring board
A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is...
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6996899 |
Electronic assembly and a method of constructing an electronic assembly
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground...
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6991151 |
Method of fabricating an electronic module comprising an active component on a base
To reduce the capacitance of an electronic module having an active component ( 1 ) bonded to a base ( 2 ), thereby enabling its cutoff frequency to be raised, the method provides a plurality of...
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6988652 |
Solder printing using a stencil having a reverse-tapered aperture
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable...
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6978539 |
Method for attaching an integrated circuit package to a circuit board
A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to...
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6973717 |
Method for producing a semiconductor device in chip format
A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating...
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6959489 |
Methods of making microelectronic packages
A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends...
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6945447 |
Thermal solder writing eutectic bonding process and apparatus
A chip or die attachment process and related apparatus, in which a desired quantity of solder ( 7 or 17 ) is dispensed onto each, in turn, of a number of desired locations on a substrate ( 4 or ...
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6936793 |
Oven apparatus and method of use thereof
A solder reflow oven with horizontal cyclonic convection air flow for enhancing equalized heating of printed circuit boards conveyed therethrough. Air circulation apparatus can include a first air...
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6928727 |
Apparatus and method for making electrical connectors
A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the...
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6927346 |
Surface mount technology to via-in-pad interconnections
Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher...
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6911624 |
Component installation, removal, and replacement apparatus and method
An apparatus and method for attaching a flip chip configured semiconductor die to a substrate as well as removing the die and replacing it on the substrate with another flip chip-configured...
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6902101 |
Bump bonding method apparatus
In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic...
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