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8178156 |
Surface treatment process for circuit board
A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer...
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8179690 |
Cut-edge positioning type soldering structure and method for preventing pin deviation
A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered...
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8156635 |
Carrier for manufacturing a printed circuit board
Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on...
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8148253 |
Electronic component soldering structure and electronic component soldering method
In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are...
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8118211 |
Method for the low-temperature pressure sintering of electronic units to heat sinks
A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following...
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8093505 |
Layered electronic circuit device
Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the...
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8048479 |
Method for placing material onto a target board by means of a transfer board
A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material...
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8038051 |
Method for production of electronic circuit board
A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering...
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8028403 |
Method for forming laminated multiple substrates
The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on...
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7975371 |
Apparatus for manufacturing a multilayer chip capacitor
The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a...
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7947933 |
Ceramic heater and method for manufacture thereof
A ceramic heater comprising a ceramic body, a heat generating resistor buried in the ceramic body, an electrode pad that is electrically connected to the heat generating resistor and is formed on...
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7913894 |
Selective soldering system
A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a...
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7900807 |
Conductive ball mounting apparatus and conductive ball mounting method
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball...
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7861908 |
Component mounting method, component mounting apparatus, and ultrasonic bonding head
A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base...
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7815122 |
Method for making an electronic label and electronic label obtained by said method
A method of making an electronic label including a chip (1) provided with two contact strips (2, 3) onto which a conducting wire (4) is welded in a single operation. The segment of conducting wire...
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7805834 |
Method for fabricating three-dimensional all organic interconnect structures
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low...
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7807073 |
Conductor composition, a mounting substrate and a mounting structure utilizing the composition
A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a...
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7784669 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce...
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7759613 |
Reflowing apparatus and reflowing method
A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying...
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7758350 |
Electrical connector with solder retention means for assembly
An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a...
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7751924 |
C4NP servo controlled solder fill head
An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative...
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7750475 |
Lead-free solder ball
A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder bal...
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7743963 |
Solderable lid or cover for an electronic circuit
A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern,...
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7703661 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with...
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7690550 |
Reflow soldering apparatus
In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2...
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7637415 |
Methods and apparatus for assembling a printed circuit board
A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The...
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7631796 |
Selective soldering system
A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a...
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7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit...
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7568610 |
Method of soldering electronic component having solder bumps to substrate
A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is...
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7562804 |
Methods for manufacturing optical modules using lead frame connectors
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead...
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7546682 |
Methods for repairing circuit board having defective pre-soldering bump
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided,...
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7536762 |
Method of manufacturing an ink-jet assembly
A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic...
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7537728 |
Method for increasing the effectiveness of a component of a material
A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared...
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7534978 |
Process chamber of an installation for the thermal treatment of printed circuit boards
A process chamber of an installation for the thermal treatment of printed circuit boards is described. The process chamber may include a fan wheel supported on a shaft parallel to the printed...
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7513032 |
Method of mounting an electronic part to a substrate
A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting...
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7506795 |
Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a...
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7490402 |
Technique for laminating multiple substrates
The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on...
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7490403 |
Soldering method
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead...
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7476564 |
Flip-chip packaging process using copper pillar as bump structure
A flip-chip packaging process is disclosed. The present invention is featured in forming a copper pillar on a wafer, forming a solder on a substrate; and enabling the solder to substantially cover...
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7456438 |
Nitride-based semiconductor light emitting diode
A nitride-based semiconductor LED which is flip-chip bonded on a lead pattern of a sub-mount through a bump ball comprises a substrate; a light-emitting structure formed on the substrate; an...
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7427423 |
Components with conductive solder mask layers
A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said...
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7357288 |
Component connecting apparatus
When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection...
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7345361 |
Stackable integrated circuit packaging
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated...
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7311240 |
Electrical circuits with button plated contacts and assembly methods
Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least...
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7311241 |
Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method
A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing...
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7308129 |
Characteristic amount calculating device for soldering inspection
A characteristic amount calculating device for soldering inspection. The characteristic amount calculating device includes a design information inputting section for inputting design information of...
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7263769 |
Multi-layered flexible print circuit board and manufacturing method thereof
A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit...
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7260890 |
Methods for fabricating three-dimensional all organic interconnect structures
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP...
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7251880 |
Method and structure for identifying lead-free solder
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board...
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7216794 |
Bond capillary design for ribbon wire bonding
A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping...
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