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7389905 |
Flip chip bonding tool tip
A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large...
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7364063 |
Thermally coupling an integrated heat spreader to a heat sink base
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may...
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7360679 |
Method for the production of a soldered connection
A method for the production of a soldered joint between at least two contact partners ( 22, 23 ) of a bonding arrangement ( 21 ), with a formed piece of solder material ( 27 ) being arranged at a...
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7344060 |
Apparatus and method for aligning solder pads during head gimbal assembly soldering
A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at...
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7325715 |
Unitary vacuum tube incorporating high voltage isolation
A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said...
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7267260 |
Apparatus for holding a fiber array
Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate...
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7265315 |
Method of joining terminals by soldering
A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback...
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7196294 |
Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during...
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7195145 |
Electrical circuit apparatus and method for assembling same
A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink;...
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7161122 |
Assembly packaging using induction heating
An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first...
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7138328 |
Packaged IC using insulated wire
A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate,...
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7135770 |
Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package...
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7086148 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated...
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7086147 |
Method of accommodating in volume expansion during solder reflow
Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated,...
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7078109 |
Heat spreading thermal interface structure
The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality...
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7070084 |
Electrical circuit apparatus and methods for assembling same
An electrical circuit apparatus ( 300 ) that includes: a substrate ( 330 ) having a ground layer ( 336 ), at least one thermal aperture ( 332 ), and at least one solder aperture ( 334 ); a heat...
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7063249 |
Electrical circuit apparatus and method
An electrical circuit apparatus ( 300 ) that includes: a substrate ( 330 ) having a ground layer ( 336 ), at least one device aperture ( 332 ), and at least one solder aperture ( 334 ); a heat sink...
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7007378 |
Process for manufacturing a printed wiring board
A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is...
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7005584 |
Compact navigation device assembly
One embodiment of the invention provides a compact navigation device assembly that is rugged, compact and does not require independent connector components to interconnect multiple circuit boards....
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6997370 |
Optical pickup device
A method for assembling an optical disk apparatus involves disposing first and second short-cutting terminals at different faces of a housing and in parallel with a laser diode of the apparatus. In...
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6929170 |
Solder deposition method
A solder deposition method according to the present invention comprises the steps of: (1) providing a solder slab; (2) providing a complementary means having a plurality of through holes; (3)...
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6898849 |
Method for controlling wire balls in electronic bonding
A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses...
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6878396 |
Micro C-4 semiconductor die and method for depositing connection sites thereon
A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The solder bumps are preferably about 10...
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6864165 |
Method of fabricating integrated electronic chip with an interconnect device
A method is described for forming an integrated structure, including a semiconductor device and connectors for connecting to a motherboard. A first layer is formed on a plate transparent to...
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6833526 |
Flex to flex soldering by diode laser
A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one...
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6817092 |
Method for assembling a circuit board apparatus with pin connectors
A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a...
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6807730 |
Pad structure of semiconductor package
A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally...
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6796018 |
Method of forming a slider/suspension assembly
A slider/suspension design and assembly method include securing a slider to a suspension assembly for use in a magnetic disk drive data recording device. To this end, a solder fillet bond is...
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6795746 |
System for providing IC bonding diagram via network
The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to...
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6793123 |
Packaging for multi-processor shared-memory system
An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls)...
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6786390 |
LED stack manufacturing method and its structure thereof
A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and...
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6772501 |
Apparatus and method for the design and manufacture of thin-film electrochemical devices
The present invention relates to the design and manufacture of single cell units for planar, thin-film, ceramic electrochemical devices such as solid oxide fuel cells, electrochemical oxygen...
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6742695 |
Soldering machine for tape carrier package outer leads
A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first...
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6728106 |
Heat dissipation structure of integrated circuit (IC)
A heat dissipation structure of an IC includes a circuit board provided with through holes perforated thereinto, an IC mounted on the upper surface of the circuit board, a solder filling a space...
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6727580 |
Microelectronic spring contact elements
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic...
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6712111 |
Bonding method and apparatus
A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded...
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6648210 |
Lead-free solder alloy powder paste use in PCB production
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in...
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6622905 |
Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias
An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface...
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6592018 |
Sealant against potting compound
The present method relates to the use of a peelable anti-solder mask as a sealant against potting compound. In certain electrical apparatus, a modular component ( 300 ) must be attached to a side...
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6581820 |
Lead bonding method for SMD package
Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder...
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6572009 |
Passive and active heat retention device for solder fountain rework
A method and apparatus for retaining heat at a pin-in-hole rework site on a printed circuit board during solder fountain rework of the board. A preheated heat retention plate is attached to the...
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6550664 |
Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths...
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6543673 |
Dissolving shunt connection system for ESD sensitive components
A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on...
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6536653 |
One-step bumping/bonding method for forming semiconductor packages
A one-step bumping/bonding process for forming a semiconductor package is disclosed. In the method, a first electronic substrate which has either a plurality of conductive pads or a plurality of...
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6531232 |
System for assembling substrates to bonding zones provided with cavities
The invention relates to a system comprising a first substrate ( 100 ) with at least one bonding area ( 110 a, 110 b ), liable to be assembled with a second substrate ( 200 ), the bonding area (...
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6523255 |
Process and structure to repair damaged probes mounted on a space transformer
Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with...
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6481616 |
Bump bonding device and bump bonding method
To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device...
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6467674 |
Method of manufacturing semiconductor device having sealing film on its surface
A sealing film is formed on a semiconductor substrate on which a number of columnar electrodes are formed, and then the upper surface of the sealing film is polished to expose the upper surfaces of...
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6454160 |
Method for hermetically encapsulating microsystems in situ
The method for hermetically encapsulating microsystems in situ consists, in a first phase, of mounting on a common substrate ( 1 ), several microsystems ( 6 ) surrounded by a metal adhesion layer (...
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6449836 |
Method for interconnecting printed circuit boards and interconnection structure
In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive...
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