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7278564 |
Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that...
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7143929 |
Ceramic circuit board and method for manufacturing the same
In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the...
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7128256 |
Z-interconnections with liquid crystal polymer dielectric films
A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an...
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7101781 |
Integrated circuit packages without solder mask and method for the same
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder...
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7067200 |
Joined bodies and a method of producing the same
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are...
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7066376 |
Methods for manufacturing a tactile sensor using an electrically conductive elastomer
The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically...
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7041180 |
Method for joining workpieces using soldering alloy
A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group...
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6959853 |
Fluxless brazing method and method for manufacturing layered material systems for fluxless brazing
A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer...
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6918530 |
Bonded member comprising different materials, and production method thereof
A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base...
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6896976 |
Tin antimony solder for MOSFET with TiNiAg back metal
A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.
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6813153 |
Polymer solder hybrid
A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the...
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6802445 |
Cost effective substrate fabrication for flip-chip packages
A new method is provided for the creation of high-accuracy and low-accuracy openings overlying points of electrical access over the surface of a semiconductor device supporting substrate. Openings...
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6776329 |
Method for producing a heat-conducting connection between two work pieces
A method for producing a heat-conducting connection between two work pieces (1, 2) includes the steps of first producing a porous sintered layer (3), interposed between the two work pieces (1, 2)...
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6659329 |
Soldering alloy
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting...
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6651871 |
Substrate coated with a conductive layer and manufacturing method thereof
A substrate is coated with a conductive layer, which comprises a conductive layer of bonded ultrafine metal particles formed on the top surface thereof. The ultrafine metal particles have a...
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6648208 |
Method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor
A method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor. First, a predetermined hole is formed in the ceramic substrate to serve as a joint portion. A...
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6601753 |
Void-free die attachment method with low melting metal
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the...
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6592021 |
Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system
A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a...
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6578755 |
Polymer collar for solder bumps
A method of forming a polymer support ring, or collar, around the base of solder balls used to form solder joints includes forming patterned regions of uncured polymer material over each of the...
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6465892 |
Interconnect structure for stacked semiconductor device
In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise....
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6460753 |
Bi-material assembly adhesively bonded at the ends and fabrication method
A bi-material assembly comprising two adherends, adhesively bonded. The assembly is adhesively bonded in an area consisting of a length of 2l at each end of the bonded assembly. The interface of...
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6354485 |
Thermally enhanced packaged semiconductor assemblies
A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further...
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6354484 |
Process for producing a metal-ceramic composite substrate
A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to...
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6352195 |
Method of forming an electronic package with a solder seal
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide...
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6276599 |
Method and apparatus for forming solder bumps
A method of forming solder bumps on pads formed on a surface of a base material includes the steps of supplying solder to a template having a number of through holes formed to correspond to the...
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6276592 |
Process for the production of a holding device for semiconductor disks and holding device produced by this process
A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting...
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6268069 |
Joined articles and a process for producing such joined articles
A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a...
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6264093 |
Lead-free solder process for printed wiring boards
The present invention provides a method for soldering components to a printed wiring board. In one embodiment, the method comprises applying a substantially lead-free solder to the printed wiring...
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6216941 |
Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials
A method for forming high frequency connections between a fragile chip and a substrate is described, wherein metal is selectively deposited on a surface of a chip and a surface of a substrate, and...
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6202916 |
Method of wave soldering thin laminate circuit boards
A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally...
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6202299 |
Semiconductor chip connection components with adhesives and methods of making same
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than...
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6189767 |
Method of securing an electric contact to a ceramic layer as well as a resistance element thus manufactured
The invention provides a method of securing an electric contact of a metal to a layer of a sintered thick-film paste which is situated on an electrically insulating substrate. In this method, a...
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6164521 |
Method of fabricating generator main lead bushings
A method of fabricating an electric generator main lead bushing is provided for attaching a flange to a hollow conductor. In one application typically used for an air side flange, a gap is formed...
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6164520 |
Robust thick film conductors
A robust thick film conductor construction making an electric circuit connection of an electric component (20) to a Ag:Pd conductor (12) on a substrate. A substantially pure Ag conductor (10) is...
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6137690 |
Electronic assembly
An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at...
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6085967 |
Method of registrably aligning fabricated wafers preceding bonding
A method of registrably aligning wafers prior to bonding uses an assembly jig having a plurality of upstanding aligning elements each of which is arranged to registrably align with one of a...
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6073829 |
Method and arrangement for attaching a component
The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials...
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6062461 |
Process for bonding micromachined wafers using solder
A method by which semiconductor wafers (10, 12) can be solder bonded to form a semiconductor device, such as a sensor with a micromachined structure (14). The method entails forming a solderable...
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6040983 |
Vertical passive components for surface mount assembly
In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring...
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5965278 |
Method of making cathode targets comprising silicon
A method for bonding silicon-containing compositions to metal surfaces is disclosed wherein a coarse silicon-containing surface is arc-sprayed with a first adhesive layer, a second solderable...
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5964395 |
Predeposited transient phase electronic interconnect media
A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid...
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5898992 |
Method of mounting circuit components on a flexible substrate
This invention is concerned with improvements in or relating to methods of mounting circuit components on flexible substrates and, in particular, surface mounting components to the conductors of...
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5858537 |
Compliant attachment
In one embodiment the article includes a metal support having a top surface, a well provided in the top surface of the support and extends downwardly into the support, the well is defined by a...
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5794839 |
Bonding material and bonding method for electric element
A material and method for bonding a semiconductor device to a pedestal, which can obtain a sufficient bonding strength and stable electric contact, are disclosed. On an n-type electrode...
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5771157 |
Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads
A printed circuit board carries a microcircuit package electrically connected to bare copper connector pads on the printed circuit board microcircuit package by aluminum wires. The copper...
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5770468 |
Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere
A method of producing a semiconductor chip on a chip carrier includes preparing a semiconductor chip having opposite front and rear surfaces and an active element on the front surface, applying...
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5767577 |
Method of solder bonding and power semiconductor device manufactured by the method
A method of solder bonding suitable for a body having a large bonding surface area including the following steps of cleaning off the bonding surfaces in vacuum chamber by impinging accelerated...
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5751556 |
Method and apparatus for reducing warpage of an assembly substrate
A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component...
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5727727 |
Flowing solder in a gap
The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main...
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5706999 |
Preparation of a coated metal-matrix composite material
A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat...
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