Matches 201 - 250 out of 514 < 1 2 3 4 5 6 7 8 9 10 11 >
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4475007 Method of mounting semiconductor chip for producing semiconductor device and a chip-supporting member used therein  
A method for mounting a semiconductor chip to a supporting member in producing an integrated circuit, and a semiconductor chip supporting member used in this method, wherein the chip-mounting...
4465223 Process for brazing  
A method of brazing two surfaces together with a Au/Sn brazing solder. The method includes the additional step of providing a film of Cu, for example on one of the surfaces, in addition to the...
4457976 Method for mounting a sapphire chip on a metal base and article produced thereby  
A sapphire chip is bonded to a metal substrate by means of an intermediate layer of 98% by weight of gold and 2% by weight of silicon. The intermediate layer directly contacts and is bonded to a...
4451972 Method of making electronic chip with metalized back including a surface stratum of solder  
Electronic chip having a composite stratified metal back and method of making it in which strata of metal and/or metal alloys are deposited on the back of the silicon base or a wafer carrying a...
4450471 Semi-conductor power device assembly and method of manufacture thereof  
A heat spreader has a thin ceramic layer plasma sprayed onto its lower surface which may be chamfered. The upper surface of the spreader is then plated with a thin nickel or gold layer and a...
4439918 Methods of packaging an electronic device  
An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of...
4389557 Semiconductor laser bonding technique  
In a method and apparatus for bonding a semiconductor laser chip to a heatsink and testing the bond obtained, temperature in the bonding operation is regulated by passing a small fixed current...
4360965 Method of mounting a semiconductor laser device  
A method of manufacturing a semiconductor laser device to be used for an optical communication system. A semiconductor laser device, with a heat sink comprising a diamond, is arranged on a heat...
4360142 Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate  
A process for forming ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising: forming a conductive layer that is adherent to the semiconductor...
4352449 Fabrication of circuit packages  
A method of fabricating circuit packages which employ macro-components (10) mounted on supporting substrates (20). In order to maintain sufficient clearance between the component and substrate and...
4326663 Pyroelectric detector  
A pyroelectric detector comprising a wafer of pyroelectric material, means for collecting electrical charge indicative of energy absorbed by the wafer, electrical means for removing and processing...
4323759 Electrical inter-connection method  
To permit ball-bonding of wires of aluminium or aluminium alloy to small electrical circuits or components, a spark discharge is created between the end of the wire and an electrode in a shielding...
4321617 System for soldering a semiconductor laser to a metal base  
A GaAs diode and a copper base are joined together so as to form a soldered system comprising an indium layer inserted between two tungsten layers which serve as a barrier for preventing indium...
4319397 Method of producing semiconductor displacement transducer  
A strain gauge is formed on one main surface of a semiconductor single crystal substrate while an insulating oxide film is formed on the other main surface of the substrate. A metal junction layer...
4315591 Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer  
A method is provided for thermo-compression diffusion bonding respective structured copper strain buffers directly to each of the two major opposed surfaces of a substrateless semiconductor device...
4278990 Low thermal resistance, low stress semiconductor package  
A semiconductor device having especially low thermal impedance between a semiconductor element and a heatsink is described wherein the semiconductor element is directly disposed upon a thin, low...
4278195 Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such _a bonding technique  
A method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel using a layered structure with an aluminum interface between the nickel or nickel steel...
4271584 Method of attaching LED chip to a header  
A method of fabricating light emitting diodes to prevent degradation caused y thermally induced stress. A voltage is applied across the chip to cause it to bend to a prestressed condition while it...
4237607 Method of assembling semiconductor integrated circuit  
A method of assembling a semiconductor integrated circuit in which a semiconductor integrated circuit chip with bumps is bonded to a flexible film circuit substrate. The assembling method of the...
4233103 High temperature-resistant conductive adhesive and method employing same  
A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a...
4189084 Low cost assembly processes for non-linear resistors and ceramic capacitors  
A brazing operation, using a silver-copper alloy preform in a temperature range of from 800° C. to 1100° C., is employed to attach either radial or axial conductive leads to ceramic non-linear...
4189083 Low temperature and low cost assembly process for nonlinear resistors  
A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering...
4187599 Semiconductor device having a tin metallization system and package containing same  
An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of...
4183126 Process for preparing quartz oscillator  
A quartz oscillator comprises a quartz blank having electrode films deposited on opposite parallel faces thereof. Holding wires which are parallel to the quartz blank extend along and spaced...
4181249 Eutectic die attachment method for integrated circuits  
A method is described for attaching sapphire, quartz, Spinel, etc. die to gold pads in a ceramic package. Because sapphire is not directly bondable to or alloyable with gold, while silicon is,...
4179802 Studded chip attachment process  
A plurality of metal studs are plated on a chip carrier surface in a pattern to match a terminal metal footprint on a chip to be joined. The studs are of sufficient height to permit flux cleaning,...
4176443 Method of connecting semiconductor structure to external circuits  
A silicon wafer, having a front surface with disjointed contact areas and a uniform rear surface, is provided at the contact areas of its front surface with respective pads each comprising a base...
4142662 Method of bonding microelectronic chips  
Disclosed is a method of bonding microelectronic chips to bonding surfaces utilizing thin, soft bonding material preforms. The bonding material, such as indium, is formed on a carrier strip. A...
4123293 Method of providing semiconductor pellet with heat sink  
A method of providing a silicon semiconductor pellet with a heat sink and a semiconductor device with such a heat sink. The heat sink to which the pellet is bonded with a eutectic alloy of gold and...
4098452 Lead bonding method  
A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the...
4081901 Method of making a ternary barrier structure for conductive electrodes  
A ternary barrier structure and method for forming the structure to be used on a conductive electrode. In electronic structures, dielectric substrates are used which have a plurality of connecting...
4078711 Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond  
A method for attaching a silicon-on-sapphire (SOS) device to a gold-plated surface of a package for the device. A layer of a metal adherent to both sapphire and gold such as, for example, tungsten,...
4074420 Method and apparatus for the assembly of jacketed electronic devices  
An apparatus and method employing a plurality of heating boats to provide for the soldered assembly of leads, electronic components and plastic jackets without intermediate handling steps. Two...
4039116 Photodetector-to-substrate bonds  
A photodetector is bonded to an electrically conductive substrate with an indium containing solder. An electrical insulating layer of a stable oxide which is wettable by indium provides electrical...
4027326 Metallic support carrier for semiconductor elements  
To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on the carrier, the bonding layer is formed as spongy, microporous structure,...
4023725 Semiconductor device manufacture  
A method of bonding a semiconductor body to a supporting member where the whole back face of the semiconductor body is covered with a thin evaporated layer of chromium or titanium, which layer is...
4020987 Solder preform for use in hermetically sealing a container  
A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and...
4019671 Method for dip-soldering semiconductor components  
A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface...
4005454 Semiconductor device having a solderable contacting coating on its opposite surfaces  
A semiconductor device which is resistant against alternating thermal stres in which a disc of semiconductor material, which is provided with at least one pn-junction and with solderable contacting...
3986251 Germanium doped light emitting diode bonding process  
A method for bonding a gallium-type light emitting diode (LED) to a metallized substrate interconnection member, such as, a header, or a strip. An LED wafer is subjected to premetallizing backside...
3986255 Process for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials therein  
Gold alloy bumps are built up upon conductive pads formed upon electronic chips. The bumps are thereafter aligned with conductive portions of a generally larger substrate to which the chips are to...
3979659 Automotive alternator rectifier bridges  
An automotive alternator rectifier bridge comprising a pair of generally flat heat-conducting laminated bases each having a central layer of aluminum with layers of copper bonded to the opposite...
3973996 Diffusion welded solar cell array  
A method of mounting and interconnecting solar cells to form a solar cell array particularly suited to space applications. In the present invention, the solar cells, which are already silver plated...
3958741 Method of mounting silicon anodes in a chlor-alkali cell  
Disclosed is a method of mounting a silicon member intended for use as an anode in the lead base of a chlor-alkali electrolytic cell. According to this invention, the amount of molten lead provided...
3958742 Manufacture of supports for semiconductor devices  
Apparatus in which gold tape is to be servered and placed on selected parts of support members of supports for semiconductor devices has means to feed the tape to severing means including a...
3956821 Method of attaching semiconductor die to package substrates  
A method of attaching semiconductor die to package substrates, which employs a zinc-aluminum alloy. The alloy is formed into the shape of a platelet. The platelet is melted on the die attach...
3936928 Method for providing mounting assemblies for a plurality of transistor integrated circuit chips  
A mounting assembly for a power transistor integrated circuit chip having a pair of electrodes on one surface thereof comprising base and emitter connections and a third electrode on the opposite...
3931673 Aluminum for bonding Si-Ge alloys to graphite  
Improved thermoelectric device and process, comprising the high-temperature, vacuum bonding of a graphite contact and silicon-germanium thermoelectric element by the use of a low void, aluminum,...
3930306 Process for attaching a lead member to a semiconductor device  
A thermally and electrically conductive metal lead member is joined to the refractory metal contact member of a semiconductor device using a brazing alloy comprising on a weight basis about 80-89...
3922775 High frequency diode and manufacture thereof  
High frequency diodes are manufactured by methods forming an efficient heat path from the active diode junction through a diamond heat conducting member to a heat sink. A planar preformed element...
Matches 201 - 250 out of 514 < 1 2 3 4 5 6 7 8 9 10 11 >