|
Match
|
Document |
Document Title |
|
|
4810671 |
Process for bonding die to substrate using a gold/silicon seed
An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform...
|
|
|
4810672 |
Method of securing electronic components to a substrate
In order to secure electronic components, and particularly large-area power semiconductors, to a substrate, first a paste formed of metal powder and a solvent is applied in the form of a layer to a...
|
|
|
4806818 |
Method of providing electrical contact to a semiconductor cathode, cathode so produced, and electron tube provided with such cathode
A contact for a semiconductor cathode is produced by thermally bonding leads consisting of one of the metals Ag, Au, Cu and one of the metals Ta, Ti, V. Such a contact does not exhibit degradation...
|
|
|
4801067 |
Method of connecting metal conductor to ceramic substrate
A method of connecting a metal conductor to a ceramic substrate including the steps of providing a terminal portion on the ceramic substrate, the ceramic substrate having a dielectric constant less...
|
|
|
4793543 |
Solder joint
A power component such as a power transistor is mounted on an insulating substrate of, e.g., beryllia by using a thick film deposition technique. A first layer (2) is deposited and a second layer...
|
|
|
4787551 |
Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing
Disclosed is a method of welding a temperature-sensing thermocouple to a silicon wafer for sensing the temperature of the wafer during rapid thermal processing using TIG welding and/or...
|
|
|
4784310 |
Method for screen printing solder paste onto a substrate with device premounted thereon
A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device...
|
|
|
4772935 |
Die bonding process
A process for bonding silicon die to a package. This process comprises the following steps: (a) providing to the back surface of the die an adhesion layer of material which exhibits superior...
|
|
|
4771018 |
Process of attaching a die to a substrate using gold/silicon seed
An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform...
|
|
|
4769525 |
Circuit package attachment apparatus and method
A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure 30 therebetween to define a...
|
|
|
4765528 |
Plating process for an electronic part
Before Au-plating onto the metallic surface of an electronic part, Ni-plating and then Co-plating are applied to form a primer coating for Au-plating. But in the steps of Ni and Co-platings,...
|
|
|
4757934 |
Low stress heat sinking for semiconductors
A semiconductor die is mounted on a metal substrate via intermediate layers which permit the die to be readily soldered to the combination while yet reducing thermal stresses. A dielectric layer is...
|
|
|
4750665 |
Method of producing a combination cover
A process for manufacturing combination covers for closing and sealing an electronic package that includes a ceramic lid having a noble metal base frame thick-filmed onto the lid and fired...
|
|
|
4749120 |
Method of connecting a semiconductor device to a wiring board
Method of connecting a semiconductor device to a wiring board in which electrical connection of metal bumps of a semiconductor device and wiring pattern of a wiring board is accomplished by...
|
|
|
4746055 |
Method and connecting material for the metallic joining of parts
Method for the metallic joining of parts which are formed by semiconductor components with metallization on at least one side or by metallic components or metallic substrates. A composite...
|
|
|
4746390 |
Method for joining a semiconductor chip to a chip carrier
Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting...
|
|
|
4739917 |
Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by...
|
|
|
4727649 |
Method for producing an optical device
In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from...
|
|
|
H000434 |
Contacts to III-V semiconductors
A contact structure and method of bonding III-V semiconductors which prevents shorting of the edges of the semiconductor chip and also allows the chip to be bonded with either major surface facing...
|
|
|
4718593 |
Method of forming alloyed metal contacts on rough saw-damaged silicon surfaces
The present invention relates to an improved method for the permanent bonding of a metal to a rough cut and unmodified semiconductor material, which comprises (a) contacting the surface of (i) the...
|
|
|
4706870 |
Controlled chemical reduction of surface film
A process is disclosed for applying an electrical contact to the surface of a semiconductor device. A layer of metal selected from metals such as nickel, silver, copper, or alloys of these metals...
|
|
|
4700879 |
Method for manufacturing semiconductor power modules with an insulated contruction
A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating...
|
|
|
4688075 |
Integrated circuit having a pre-attached conductive mounting media and method of making the same
A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to...
|
|
|
4685606 |
Oxide-free extruded thermal joint
A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of...
|
|
|
4662063 |
Generation of ohmic contacts on indium phosphide
A process for forming low resistance ohmic contacts on indium phosphide (InP) avoids the usual problem of high temperature annealing. The method comprises passing a current between two contacts of...
|
|
|
4661835 |
Semiconductor structure and method of its manufacture
To prevent damage upon removal of a locating templet used in positioning a plate-like semiconductor on a support carrier (2, 14), for example a base plate (2) of a transistor housing or a...
|
|
|
4659006 |
Method of bonding a die to a substrate
A typical method for bonding a die to a substrate includes the steps of placing a solder preform onto the substrate, contacting the die to the preform and applying heat sufficient for the solder to...
|
|
|
4659378 |
Solderable adhesive layer
Electrical contacts to or mechanical connections between components and provided by using a thin layer of an alloy consisting of metals and metalloids. Such a layer shows excellent adhesion to...
|
|
|
4650108 |
Method for forming hermetic seals
A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable...
|
|
|
4650107 |
Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate
A large-area semiconductor component (1) is joined without bubbles by means of soldering to a substrate (2) by placing a perforated metallic intermediate layer (5) between the solder (3) before the...
|
|
|
4646958 |
Fluxless soldering process using a silane atmosphere
Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10%...
|
|
|
4645116 |
Fluxless bonding of microelectronic chips
Indium is used to bond semiconductor lasers to their heat-sinks without the presence of a corrosive liquid flux. Fluxless bonding is achieved in a vacuum chamber in reducing ambients of CO or H 2 ....
|
|
|
4632295 |
Reduction atmosphere workpiece joining
A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or...
|
|
|
4623086 |
Process of monitoring for the reflectivity change in indium phase transition soldering
An element is soldered to a heat sink by a flux-free technique in which flux-free solder is first deposited onto the heat sink surface, then the element is placed into position on the surface, then...
|
|
|
4615478 |
Method for the soldering of semiconductor chips on supports of not-noble metal
After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area...
|
|
|
4611746 |
Process for forming improved solder connections for semiconductor devices with enhanced fatigue life
In accordance with the present invention, we provide a new method for relieving stresses in the device-substrate interconnection structure which greatly enhances the resistance of the...
|
|
|
4611745 |
Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same
A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 μm comprising silver (Ag) and an active metal selected from the...
|
|
|
4603805 |
Method for enhancing the solderability of nickel layers
Nickel layers used in electronic devices are frequently plated in solutions containing phosphorus. Residual phosphorus trapped in the plated nickel layer reduces solderability with respect to Pb-Sn...
|
|
|
4577398 |
Method for mounting a semiconductor chip
A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The...
|
|
|
4558346 |
Highly reliable hermetically sealed package for a semiconductor device
A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip...
|
|
|
4542401 |
Semiconductor device with sprayed metal layer
A semiconductor device has a sprayed metal layer formed by a method such as plasma spraying on a metal substrate of a material such as aluminum, and a semiconductor element attached to the sprayed...
|
|
|
4540115 |
Flux-free photodetector bonding
A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250° C., using a gold-tin eutectic solder which has a melting point of 280° C., is disclosed. The...
|
|
|
4529836 |
Stress absorption matrix
An apparatus for interfacing materials and absorbing disparate thermal expansions thereof utilizes a woven wire mesh to support a predetermined thickness of a first soft solder which absorbs...
|
|
|
4513905 |
Integrated circuit metallization technique
A process in the manufacture of integrated circuits in which a barrier layer of Cr or Ti is deposited in a partial atmosphere of N 2 in an Ar sputtering gas on a layer of Si so that the N 2 is...
|
|
|
4504007 |
Solder and braze fluxes and processes for using the same
In a soldering process for joining a plurality of metal components wherein a flux is employed to promote the process, the improvement comprises using as a flux in the process a flux consisting...
|
|
|
4500029 |
Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly
An electrical assembly includes a conductor pattern, a non-metallic substrate, and a eutectic alloy situated between and bonding together the conductor pattern and the substrate. The conductor...
|
|
|
4498096 |
Button rectifier package for non-planar die
An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature,...
|
|
|
4493143 |
Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered
A semiconductor member is attached to a base by placing a wafer of solder material on the base, placing a carrier member having a through capillary hole on the solder wafer, placing the...
|
|
|
4487638 |
Semiconductor die-attach technique and composition therefor
A method of attaching semiconductor die to a package substrate and a composition for such die attach is disclosed, which method and composition comprise the combination of a low and a high-melting...
|
|
|
4475682 |
Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant
Disclosed is a process for substantially reducing the series resistance of a solar cell having a thick film metal contact assembly thereon while simultaneously removing oxide coatings from the...
|