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9027822 |
Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder... |
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9027821 |
Process for direct bonding two elements comprising copper portions and portions of dielectric materials
A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the... |
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9010616 |
Low void solder joint for multiple reflow applications
A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation.... |
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8991681 |
Die bonder and bonding method
A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an... |
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8939347 |
Magnetic intermetallic compound interconnect
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic... |
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8887980 |
Method of soldering portions plated by electroless Ni plating
When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA... |
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8832933 |
Method of fabricating a semiconductor test probe head
A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a... |
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8820612 |
Injection molded solder process for forming solder bumps on substrates
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a... |
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8820611 |
Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste
The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps:... |
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8794501 |
Method of transferring a light emitting diode
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a... |
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8794498 |
Electronic component device and method for producing the same
In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for... |
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8794499 |
Method for manufacturing substrate
In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting... |
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8789744 |
Reflow solderable, surface mount optic mounting
Reflow solderable, surface mount LED optic mounting devices are provided. Embodiments that include turnings (e.g., made on a swiss turning machine) and stampings (e.g., made with a progressive... |
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8752754 |
Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board
Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The... |
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8499998 |
Component built-in circuit substrate and method of producing the same
A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of... |
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8496159 |
Injection molded solder process for forming solder bumps on substrates
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a... |
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8492242 |
Dry flux bonding device and method
Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated... |
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8485417 |
Planar RF electromechanical switch
A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the... |
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8485416 |
Bonding process and bonded structures
A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops.... |
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8448838 |
Solder ball loading mask, apparatus and associated methodology
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a... |
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8439251 |
Wiring method and device
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at... |
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8333315 |
Method for connecting conducting wire to electric heating film
A method for connecting a conducting wire to an electric heating film is provided. The method includes: first, opening a groove on an electric heating film carrier; then, placing one end of a... |
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8240545 |
Methods for minimizing component shift during soldering
Methods for minimizing component shift during soldering are described. One such method includes forming a pedestal pad having a preselected shape on a substrate, forming at least one intervening... |
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8177878 |
Bonding material with exothermically reactive heterostructures
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first... |
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8167192 |
Manufacturing method for ceramic heater
Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a... |
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8157157 |
Solder ball loading mask, apparatus and associated methodology
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a... |
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8096463 |
Wiring method and device
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one... |
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8069561 |
Method for manufacturing a metal-ceramic substrate
A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate... |
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7935430 |
Bonding structure of substrate and component and method of manufacturing the same
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the... |
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7900808 |
Soldering method and system thereof
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the... |
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7861914 |
Self-assembly of components
A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one... |
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7816999 |
Single-pole double-throw MEMS switch
MEMS switches of varying configurations provide individually acutatable contacts. The MEMS switches are sealed by an improved anodic bonding technique. |
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7753253 |
Dispensing device and mounting system
A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing... |
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7750462 |
Microelectromechanical systems using thermocompression bonding
Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well... |
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7735718 |
Layered products for fluxless brazing of substrates
A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or... |
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7724791 |
Method of manufacturing laser diode packages and arrays
A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and... |
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7719108 |
Enhanced reliability semiconductor package
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor... |
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7674651 |
Mounting method for semiconductor parts on circuit substrate
A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps,... |
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7635077 |
Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having... |
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7556189 |
Lead-free bonding systems
Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This... |
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7547611 |
Process and device for bonding wafers
The invention relates to a process and a device for bonding at least two substrates (1, 2), in particular semiconductor substrates or wafers, having the following features: a) a lower pressure... |
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7428979 |
Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux... |
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7278564 |
Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that... |
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7128256 |
Z-interconnections with liquid crystal polymer dielectric films
A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an... |
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7101781 |
Integrated circuit packages without solder mask and method for the same
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder... |
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7067200 |
Joined bodies and a method of producing the same
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are... |
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7066376 |
Methods for manufacturing a tactile sensor using an electrically conductive elastomer
The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically... |
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7041180 |
Method for joining workpieces using soldering alloy
A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group... |
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6959853 |
Fluxless brazing method and method for manufacturing layered material systems for fluxless brazing
A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer... |
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6918530 |
Bonded member comprising different materials, and production method thereof
A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base... |