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9027822 Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate  
An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder...
9027821 Process for direct bonding two elements comprising copper portions and portions of dielectric materials  
A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the...
9010616 Low void solder joint for multiple reflow applications  
A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation....
8991681 Die bonder and bonding method  
A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an...
8939347 Magnetic intermetallic compound interconnect  
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic...
8887980 Method of soldering portions plated by electroless Ni plating  
When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA...
8832933 Method of fabricating a semiconductor test probe head  
A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a...
8820612 Injection molded solder process for forming solder bumps on substrates  
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a...
8820611 Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste  
The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps:...
8794501 Method of transferring a light emitting diode  
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a...
8794498 Electronic component device and method for producing the same  
In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for...
8794499 Method for manufacturing substrate  
In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting...
8789744 Reflow solderable, surface mount optic mounting  
Reflow solderable, surface mount LED optic mounting devices are provided. Embodiments that include turnings (e.g., made on a swiss turning machine) and stampings (e.g., made with a progressive...
8752754 Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board  
Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The...
8499998 Component built-in circuit substrate and method of producing the same  
A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of...
8496159 Injection molded solder process for forming solder bumps on substrates  
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a...
8492242 Dry flux bonding device and method  
Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated...
8485417 Planar RF electromechanical switch  
A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the...
8485416 Bonding process and bonded structures  
A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops....
8448838 Solder ball loading mask, apparatus and associated methodology  
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a...
8439251 Wiring method and device  
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at...
8333315 Method for connecting conducting wire to electric heating film  
A method for connecting a conducting wire to an electric heating film is provided. The method includes: first, opening a groove on an electric heating film carrier; then, placing one end of a...
8240545 Methods for minimizing component shift during soldering  
Methods for minimizing component shift during soldering are described. One such method includes forming a pedestal pad having a preselected shape on a substrate, forming at least one intervening...
8177878 Bonding material with exothermically reactive heterostructures  
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first...
8167192 Manufacturing method for ceramic heater  
Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a...
8157157 Solder ball loading mask, apparatus and associated methodology  
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a...
8096463 Wiring method and device  
To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one...
8069561 Method for manufacturing a metal-ceramic substrate  
A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate...
7935430 Bonding structure of substrate and component and method of manufacturing the same  
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the...
7900808 Soldering method and system thereof  
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the...
7861914 Self-assembly of components  
A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one...
7816999 Single-pole double-throw MEMS switch  
MEMS switches of varying configurations provide individually acutatable contacts. The MEMS switches are sealed by an improved anodic bonding technique.
7753253 Dispensing device and mounting system  
A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing...
7750462 Microelectromechanical systems using thermocompression bonding  
Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well...
7735718 Layered products for fluxless brazing of substrates  
A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or...
7724791 Method of manufacturing laser diode packages and arrays  
A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and...
7719108 Enhanced reliability semiconductor package  
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor...
7674651 Mounting method for semiconductor parts on circuit substrate  
A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps,...
7635077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby  
A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having...
7556189 Lead-free bonding systems  
Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This...
7547611 Process and device for bonding wafers  
The invention relates to a process and a device for bonding at least two substrates (1, 2), in particular semiconductor substrates or wafers, having the following features: a) a lower pressure...
7428979 Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process  
A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux...
7278564 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus  
The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that...
7128256 Z-interconnections with liquid crystal polymer dielectric films  
A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an...
7101781 Integrated circuit packages without solder mask and method for the same  
This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder...
7067200 Joined bodies and a method of producing the same  
A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are...
7066376 Methods for manufacturing a tactile sensor using an electrically conductive elastomer  
The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically...
7041180 Method for joining workpieces using soldering alloy  
A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group...
6959853 Fluxless brazing method and method for manufacturing layered material systems for fluxless brazing  
A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer...
6918530 Bonded member comprising different materials, and production method thereof  
A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base...