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7520416 |
Transparent window with non-transparent contact surface for a soldering bonding
A transparent pane, in particular a glass pane, having at least one electroconducting, non-transparent contact surface placed on one of its surfaces, to connect it by soldering to a connection...
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7482685 |
Ceramic circuit board, method for making the same, and power module
In a ceramic circuit board 1 prepared by integrally joining a circuit layer 4 composed of a clad member including a circuit plate 2 made of an Al plate and an Al—Si brazing material layer ...
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7478742 |
Method for brazing ceramic surfaces
A method for producing a brazed joint having at least one of a metal/ceramic joint and a ceramic/ceramic joint. The method includes forming bores in at least one ceramic surface to be brazed, and...
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7407083 |
Bonded silicon, components and a method of fabricating the same
A heat pipe housing assembly ( 22 ) includes a pair of silicon housing pieces ( 24, 26 ) and a bond joint ( 42 ) between the housings ( 24, 26 ), with the bond joint ( 42 ) preferably including a...
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7353979 |
Method of fabricating substrate placing stage
A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes...
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7299964 |
Method and apparatus to create electrical junctions for information routing in textile structures
Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation...
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7267187 |
Braze alloy and method of use for drilling applications
A down hole cutting tool includes a cutting element support structure. The cutting element support structure has at least one cavity formed therein. A cutting element is disposed in the cavity....
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7251873 |
Method of manufacturing surface acoustic wave device
Disclosed is a method of manufacturing a surface acoustic wave device comprising the steps of forming a drive electrode having a surface acoustic wave element function on a piezoelectric substrate...
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7159756 |
Method of soldering and solder compositions
The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an...
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7137546 |
Silicon tube formed of bonded staves
Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for...
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7128979 |
Circuit board, method of producing same, and power module
A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98%...
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7086577 |
Method of manufacturing a miniature X-ray device
An emitter for a miniature X-ray apparatus comprises an insulating shell, an anode, and a cathode. The insulating shell includes a conical brazing surface, brazed to a conical brazing surface on...
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7041180 |
Method for joining workpieces using soldering alloy
A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group...
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6991856 |
Methods of making and using freestanding reactive multilayer foils
Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered...
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6955286 |
Use of silver-copper-palladium brazing alloys
A compound arrangement comprising a first component of metal being brazed to a second component of metal. The first component has an external cylindrical surface touching an cylindrical internal...
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6907661 |
Method of joining a high-temperature material composite component
Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned...
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6877651 |
Method of joining ceramic or graphite to metal with an alloy having high nickel or cobalt content, alloys for joining the same, and products formed therewith
A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to...
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6827251 |
Method for joining
A substrate ( 101 ) is coated with an aqueous solution of boehmite (AlO(OH)) which is an aluminum hydroxide to form a coating film ( 102 ), and the property of the coating film ( 102 ) is modified...
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6820795 |
Joined article of a supporting member for a semiconductor wafer and a method of producing the same
A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting...
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6776329 |
Method for producing a heat-conducting connection between two work pieces
A method for producing a heat-conducting connection between two work pieces (1, 2) includes the steps of first producing a porous sintered layer (3), interposed between the two work pieces (1, 2)...
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6732914 |
Braze system and method for reducing strain in a braze joint
A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal...
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6732905 |
Vented cavity, hermetic solder seal
Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents...
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6698645 |
Method of producing fiber-reinforced metallic building components
A method of producing fiber-reinforced metallic building components having a complicated three-dimensional geometric shape includes the following steps. First, metal-coated SiC fibers are applied...
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6659329 |
Soldering alloy
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting...
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6616032 |
Brazing composition and method for brazing parts made of alumina-based materials with said composition
A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a...
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6601753 |
Void-free die attachment method with low melting metal
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the...
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6590774 |
Ignition apparatus for internal combustion engine with improved electrical insulation plate including beryllia
An ignition apparatus is provided for internal combustion engines to obtain higher reliability for the solder bonding parts. The ignition apparatus includes a molded case having an input-output...
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6554179 |
Reaction brazing of tungsten or molybdenum body to carbonaceous support
Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are...
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6541075 |
Method for forming a thermal barrier coating system
An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the...
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6440578 |
Adhesive compositions for bonding different members bonding method using the composition and composite members bonded by the bonding method
An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the...
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6439449 |
Assembling jig for sectional articles
An apparatus and method for positioning and soldering together multiple stanined glass sections is disclosed.
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6405918 |
Mechanical retention system for braze and solder joints
Brazing or soldering of pieces of low wettable materials ( 1, 3 ), such as single crystal silicon, is accomplished by sandwiching the brazing material ( 5 ) between the pieces and sealing the edges...
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6403233 |
Article comprising creep-resistant and stress-reducing solder
The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The...
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6367683 |
Solder braze alloy
The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a...
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6328198 |
Method of manufacturing joint body
This invention relates to a method of manufacturing joint body constructed of at lest one pair of substrates comprising a aluminum matrix composite which is made up of an aluminum or aluminum alloy...
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6322871 |
Method of treating ceramics for use as tips in saws and other tools or other structures
A method of processing a ceramic body, such as a saw tip so that the ceramic body can be bonded to a substrate, such as a saw blade. The ceramic body is desirably a cermet, and it is first cleaned,...
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6306511 |
Hybrid laminate and manufacturing method therefor
There is disclosed a hybrid laminate comprising: a substrate layer containing a compact of first powder; and a functional material layer being in contact with the substrate layer and containing a...
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6291806 |
Process for bonding workpieces
The process of bonding a first workpiece to a second workpiece is disclosed comprising the steps of fabricating a sintered bonding pad formed from a matrix of randomly oriented metallic fibers. The...
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6276592 |
Process for the production of a holding device for semiconductor disks and holding device produced by this process
A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting...
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6268069 |
Joined articles and a process for producing such joined articles
A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a...
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6223972 |
Method and apparatus for forming metal foil and solder assembled objects
A method and apparatus for constructing a metal foil and solder assembled object (10), is described. The apparatus includes a final mold (400) having a recessed final pattern (408). The sides...
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6216941 |
Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials
A method for forming high frequency connections between a fragile chip and a substrate is described, wherein metal is selectively deposited on a surface of a chip and a surface of a substrate, and...
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6213380 |
Bonding a diamond compact to a cemented carbide substrate
A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of...
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6199748 |
Semiconductor eutectic alloy metal (SEAM) technology for fabrication of compliant composite substrates and integration of materials
A method of semiconductor eutectic alloy metal (SEAM) technology for integration of heterogeneous materials and fabrication of compliant composite substrates takes advantage of eutectic properties...
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6196440 |
Method and tool for imprinting a pattern in a solder
A tool (40) for imprinting a pattern in a has a handle (42). A stamp (44), connected to the handle (42), has a pattern (54) formed on a face (52) of the stamp (44). The face (52) of the stamp (44)...
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6189766 |
Zero stress bonding of silicon carbide to diamond
A multi-layer structure including a first layer; a second layer, with a coefficient of thermal expansion different than a coefficient of thermal expansion of the first layer, a bulk modulus...
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6173886 |
Method for joining dissimilar metals or alloys
The present invention relates to an improved method for joining metals or alloys together. Specifically, the present invention relates to a method comprising the laser alloying of a first...
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6168069 |
Method of brazing titanium to stainless steel
Surprisingly, silver-copper-palladium brazing alloys, which have hitherto been used only for the brazing of components of the same material, are also very well suited for brazing directly titanium...
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6162551 |
Alloy used for joining to cemented carbide, and its composite material
A joining alloy of the invention is based on Co, Ni, or their alloy, and contains 1.0 to 2.3% by mass of C and 15.5 to 34.7% by mass of W. Using HIP, the joining alloy in the form of a casting or...
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6138897 |
Self-aligining end effector for friction soldering metals to glass plate
Method of aligning a metallic solderable object to a glass plate comprising loading a solderable object onto an end effector of a robotically supported spindle of a spindle assembly, handing a...
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