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8152043 |
Ultrasonic horn
An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis...
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8148253 |
Electronic component soldering structure and electronic component soldering method
In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are...
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8083121 |
Paste for soldering and soldering method using the same
In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed...
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8052026 |
Ultrasonic horn
An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis...
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8047420 |
Method for producing a welded joint between electrical conductors by means of an ultrasonic welding method
A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression...
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8042721 |
Ultrasonic device having exponential horn sleeve portion
An ultrasonic device includes a coupler, a mounting sleeve and an exponential horn form by both the coupler and the mounting sleeve. A flange is located on the mounting sleeve for support at a node...
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7982320 |
Arrangement for solder bump formation on wafers
An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a...
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7896219 |
Method and apparatus for ultrasonic welding of terminals
A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost...
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7797831 |
Method for manufacturing recording apparatus
There is provided a method for manufacturing a recording apparatus which includes an actuator, a flexible flat cable connected to the actuator, and a circuit element mounted on the flexible flat...
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7789287 |
Method of bonding
The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a...
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7624906 |
Ultrasonic brazing of aluminum alloy and aluminum matrix composite
A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase,...
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7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit...
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7568607 |
Apparatus and method for welding a pour spout fitment to a container
Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an...
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7299964 |
Method and apparatus to create electrical junctions for information routing in textile structures
Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation...
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7261230 |
Wirebonding insulated wire and capillary therefor
An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire...
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6994153 |
Heat discharger suitable for application to heat pipes
One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink....
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6761302 |
Device mounting method
When a substrate electrode (6) formed on a semiconductor substrate (5) and a device electrode (14) formed on an optical device (13) are joined to each other by solder to mount the device (13) on...
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6726086 |
Liquid phase diffusion bonding to a superalloy component
A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding...
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6709769 |
Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board
A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of ...
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6691909 |
Sonotrode for ultrasonic welding apparatus
An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is...
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6662992 |
Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided...
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6659329 |
Soldering alloy
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting...
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6620722 |
Bumping process
A process of forming a solder bump on a semiconductor device including vibrating a solder reservoir carrier in a vertical direction while pressure and heat are applied to the solder reservoir. An...
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6534195 |
Connection structure for metallic members and connecting method therefor
Sn—Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn—Ag alloy is used as a solder, the first metallic member and the second metallic member are con...
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6471111 |
Method and apparatus for acoustic pressure assisted wave soldering
A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic...
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6467679 |
Wire bonding method
A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor...
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6409072 |
Chemical microreactors and method for producing same
Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to...
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6371356 |
Manufacturing method of a magnetic head with use of a capillary having a recess
A magnetic head includes a metal plate having a conductive pattern, and a slider having a head element and a connecting terminal electrically connected to the head element, and fixed on the metal...
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6367683 |
Solder braze alloy
The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a...
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6257480 |
Jet soldering method and apparatus
In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in...
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6198599 |
Magnetic head with bonded balls having a capillary mark
A magnetic head includes a metal plate having a conductive pattern, and a slider having a head element and a connecting terminal electrically connected to the head element, and fixed on the metal...
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6176416 |
Method of making low-profile wire connection
A method of making low profile wire connection comprising steps of: connecting a wire to a first bonding point, moving a capillary straight up a first length, moving the capillary away from a...
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6173878 |
Device for connecting metallic materials
The invention relates to a device for connecting metallic materials, in particular electrical conductors such as flexible cables, by means of a transducer (10) which generates ultrasonic...
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6152348 |
Device for the application of joint material deposit
Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device...
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6148515 |
Method of bonding aluminum members
The method of the present invention comprises the steps of: providing a first aluminum member and a second aluminum member to be bonded to each other; forming a zinc alloy soldering layer on the...
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6138897 |
Self-aligining end effector for friction soldering metals to glass plate
Method of aligning a metallic solderable object to a glass plate comprising loading a solderable object onto an end effector of a robotically supported spindle of a spindle assembly, handing a...
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6138894 |
Method for coupling a circuit component to a substrate
A technique is utilized for coupling a circuit component to a substrate. The circuit component, such as a die, includes a plurality of contacts on one of its surfaces. The contacts may take the...
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6095396 |
Bonding load correction method and wire bonding apparatus
A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values...
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6095401 |
System and method for supression of bubble generation during ultrasonic welding of a printer cartridge
A system and method for suppression of air bubble generation in the ink supply and nozzles of an ink-containing printer cartridge when ultrasonic welding is performed on the ink-containing printer...
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6047876 |
Process of using an active solder alloy
A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active,...
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6027009 |
Connection structure of wire and terminal, connecting method therefor and a terminal
A soldering material (28) is joined to a surface (13a) of a terminal (13). The terminal (13) is incorporated in a groove (18) of a connector housing (11) so that a covered wire (19) is made into...
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5993931 |
Hermetic solder lid closure
A method for leak testing of a hermetic package closure comprises the steps of: creating a pocket in a lid; plating the lid; placing solder in the pocket; melting the solder in the pocket; drilling...
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5992725 |
Apparatus and method for producing electronic elements
An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an...
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5921460 |
Method of soldering materials supported on low-melting substrates
A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method...
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5831252 |
Methods of bonding titanium and titanium alloy members by high frequency heating
Target members of titanium or a titanium alloy with melting point M are bonded together by first forming a bonding layer with melting point J lower than M on at least one of the bonding surfaces...
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5821494 |
Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
A method of making a solder connection between a slider pad and a suspension pad is provided by forming a solder bump on the solder pad at the slider level, affixing the slider to the suspension so...
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5759707 |
Flux-coated metal components
Metal structures, e.g. coolers or heat exchangers, can be produced by placing together metal components coated with solder, dipping them into a slurry of a flux, and soldering them by heating....
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5634586 |
Single point bonding method
A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of...
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5493069 |
Method of ultrasonically welding together two conductors
An improved method of ultrasonically welding together two conductors having differing lateral dimensions comprising selecting a welding capture fixture having lateral sides spaced apart by a...
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5492263 |
Method for wire bonding an aluminum wire to a lead of an electronics package
A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together...
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