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7377416 |
Ultrasonic welding horn for welding a seam in an imaging receptor belt
In ultrasonic welding of a seam, such as for creation of an imaging belt, an ultrasonic welding horn is applied to an overlap area. The welding horn has a contact surface within a certain set of...
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7370786 |
Bonding method and bonding apparatus
Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and...
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7367486 |
System and method for forming solder joints
Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a...
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7367108 |
Method of bonding flying leads
A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a...
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7360675 |
Wire bonder for ball bonding insulated wire and method of using same
An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical...
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7357217 |
Faceplate cover
The present invention provides an improved method and apparatus for manufacturing communication devices. A cover is attached to a surface of a faceplate that includes at least one opening, to...
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7350685 |
Method of mounting electronic component
The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the...
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7341175 |
Bonding of light emitting diodes having shaped substrates
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the...
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7320205 |
Method for manufacturing filter canisters and tracking quality assurance
An assembly line for manufacturing filter canisters is disclosed. The method for assembling filter canisters provides a unique serial number for each canister and a database that associates the...
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7314157 |
Wire bond with improved shear strength
A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a...
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7311239 |
Probe attach tool
A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a...
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7309400 |
Methods of improving uniformity in additive manufacturing processes
This invention improves upon existing approaches by providing a method for improving the uniformity of additive manufacturing processes of the type wherein material increments are consolidated to...
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7306132 |
Bonding apparatus
A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is...
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7299964 |
Method and apparatus to create electrical junctions for information routing in textile structures
Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation...
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7296335 |
Method of detaching of magnetic head slider from head gimbal assembly
A method is provided for reworking a head gimbal assembly (HGA). An ultrasonic probe is used to stress the connection between the slider component of an HGA to remove the slider from its mounting...
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7294217 |
Electrical interconnect structures for integrated circuits and methods of manufacturing the same
Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is...
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7284686 |
Mounting method of bump-equipped electronic component and mounting structure of the same
In a mounting method for mounting a bump-equipped electronic component 5 with a plurality of metallic bumps 6 on a substrate 2 with a plurality of electrodes 3, during the process of...
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7261230 |
Wirebonding insulated wire and capillary therefor
An improved method of bonding an insulated wire ( 14 ) that has one end connected to a first bond pad ( 16 ) to a second bond pad ( 18 ) includes moving a tip of a capillary ( 20 ) holding the bond...
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7225965 |
Multiple probe power systems and methods for ultrasonic welding
An ultrasonic welding probe power supply for powering more than one ultrasonic welding probe with power is provided. The power supply is adapted to provide power only to one welding probe at a...
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7219419 |
Component mounting apparatus including a polishing device
Component ( 3 ) is pressed onto a circuit board ( 4 ) so that their respective metal interconnects ( 5 ), ( 6 ) are in close contact with each other, and ultrasonic vibration is applied to the...
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7213741 |
Lead wire bonding method
After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are...
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7191929 |
Method of measuring thickness of bonded ball in wire bonding
A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being...
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7190072 |
RFID-chip having RFID-tag or magnifying electrode
When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the...
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7188759 |
Methods for forming conductive bumps and wire loops
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of...
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7188414 |
Method of assembling a flat electrical cable
A flat electrical cable and a modular rotary anvil for assembling a flat electrical cable wherein the flat cable includes an upper and lower layer. The upper layer has ribs protruding along its...
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7168165 |
Fabrication of electrical medical leads employing multi-filar wire conductors
During fabrication of an electrical medical lead, a cut end of a stranded wire conductor is subjected to electrical current sufficient to heat and weld the strands together upon discharge of a high...
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7156281 |
Bonding device and bonding tool
A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a...
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7152775 |
Magnetic source and ferromagnetic device for ultrasonic welding
There is provided an ultrasonic welding apparatus that includes a magnetic source and a ferromagnetic device to apply pressure to at least one component being joined during the ultrasonic welding...
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7150388 |
Method of bonding and bonding apparatus for a semiconductor chip
A method of bonding and a bonding apparatus for a semiconductor chip uses ultrasonic vibration but can improve the bonds between electrode terminals of a semiconductor chip and a substrate. In a...
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7137547 |
Process for forming electrical/mechanical connections
A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier;...
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7137543 |
Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers
The present invention is directed to an integrated flexure mount scheme for dynamic isolation of ultrasonic transducers for use with a wire bonding machine. The transducer has a body of a generally...
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7134588 |
Bonding tool for ultrasonic bonding and method of ultrasonic bonding
Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material,...
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7134198 |
Method for manufacturing electric element built-in module with sealed electric element
A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring...
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7134190 |
Wire harness manufacturing machine
The present invention is an automated wire harness machine ( 40 ) capable of manufacturing a wire harness ( 42 ) unique in-part due to the automation process. The novel wire harness is generally a...
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7128255 |
Magnetic head, and device and method for manufacturing the same
The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a...
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7124504 |
Method and device for connecting conductors
A method and device for making multiple connections between electrical conductors surrounded by external insulators in overlapping flexible cables by ultrasonic welding. Overlapping conductors to...
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7122087 |
Method of manufacturing RFID
There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the...
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7108167 |
Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method
A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical...
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7090111 |
Fused loop of filamentous material and apparatus for making same
A welding apparatus that includes a first member having a first suture-contacting surface, a second member having a second suture-contacting surface, and a device for moving the first member...
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7085699 |
Wire bonding simulation
Embodiments of the present invention may provide ways and uses for correlating actual wire bonding machine adjustment parameters to inputs needed for FEA simulations in modeling actual wire bonding...
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7073700 |
Process and apparatus for applying brazing material to a metallic structure through the use of vibration
A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing...
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7066374 |
Sonic weld sunroof trim ring
A method of installing trim rings to headliner trims systems in motor vehicles comprising a trim ring, a headliner, and a sonic horn and stack. The sonic horn vibrates to bond/weld headliner to...
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7065858 |
Method for welding components of a disk drive head suspension
A method of affixing head suspension components to one another using an edge weld formed at the edge of one head suspension assembly component positioned in an overlapping fashion relative to...
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7056594 |
Friction stir welding method and structure body
This invention provides a configuration of a joint that allows a satisfactory welded joint to be formed with reduced deformation of the joint region when two-face structures (panels) are...
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7017791 |
Ultrasonic bonding method and device
In an ultrasonic bonding method that bonds a material to a bonding surface by the application of ultrasonic vibration, both side faces of the material in the direction of ultrasonic vibration are...
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7000822 |
Wire bond integrity test system
An improved bond integrity test system is provided by eliminating the spring loaded wire spool cover which contributes to particulate matter, and by addition of a second contact diverter in the...
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6991148 |
Process for manufacturing multilayer flexible wiring boards
The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer,...
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6962068 |
Nut insert installation system and method of use
A system is disclosed for installing an insert within an aperture in a workpiece, the workpiece having a first side and a second side. The insert is the type in which a portion of the insert...
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6945446 |
Wire bonding method and apparatus
A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a...
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6935551 |
Ultrasonic bonding method of coated electric wires and ultrasonic bonding apparatus using same
Intersected portions (C) of coated electric wires 20 and ( 21 ) are sandwiched and pressurized between a horn-side chip ( 11 ) and an anvil-side chip ( 12 ) (sandwiching step). Ultrasonic...
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