|
Match
|
Document |
Document Title |
|
|
7523848 |
Method and apparatus for measuring the size of free air balls on a wire bonder
A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed...
|
|
|
7478741 |
Solder interconnect integrity monitor
An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across...
|
|
|
7471400 |
Measurement method and device for bead cutting shape in electric resistance welded pipes
To precisely measure bead cutting shapes of electric resistance welded pipes without being affected by difference in luminance level between cut and uncut portions in optical cutting images, an...
|
|
|
7461771 |
Method of treating and probing a via
A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely...
|
|
|
7419085 |
Optical processing apparatus
The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing...
|
|
|
7380697 |
Welding condition monitoring device
A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an...
|
|
|
7196294 |
Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during...
|
|
|
7159753 |
Wire body based welding representation
A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture...
|
|
|
7134591 |
Method of and apparatus for testing a wire bond connection
A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or...
|
|
|
7004372 |
Method for determining optimum bond parameters when bonding with a wire bonder
A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With...
|
|
|
7004370 |
Device and method for determining parameters of a welding system
The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area ( 18, 21, 22 ) is subjected to the action of ultrasonic...
|
|
|
6962281 |
Bonding apparatus and bonding method having process for judging bonding state
In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3 , and applying ultrasonic bonding to a work 11 ,...
|
|
|
6948369 |
Methods for ultrasonic inspection of spot and seam resistance welds in metallic sheets and a spot weld examination probe system (SWEPS)
An external focused ultrasonic beam, non-destructive, open-air, inspection method of sheet metal spot and seam weldments using a probe in combination with motion measurement of the probe over the...
|
|
|
6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
|
|
|
6935552 |
High-precision method and apparatus for evaluating creep damage
A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep...
|
|
|
6896171 |
EMAT weld inspection
A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or...
|
|
|
6892926 |
Toughness-optimized weld joints and methods for producing said weld joints
Methods for producing toughness-optimized weld joints are provided. A welding procedure that will provide adequate toughness for the center-weld of the weld-joint is developed and used, and a...
|
|
|
6889888 |
Spatial integration of pipeline datasets
This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and...
|
|
|
6859990 |
Characteristics evaluation method of intermediate layer circuit
The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for...
|
|
|
6857553 |
Method and apparatus for in-process sensing of manufacturing quality
A method for determining the quality of an examined weld joint comprising the steps of providing acoustical data from the examined weld joint, and performing a neural network operation on the...
|
|
|
6820794 |
Solderless test interface for a semiconductor device package
A solderless test interface ( 10 ) includes a thin, flexible, electrically insulative sheet ( 20 ) having metal plated through-holes ( 24 ) formed in the pattern of the external ball contacts ( 54...
|
|
|
6758385 |
Apparatus for performing a pull test
An apparatus for performing a pull test to determine the resistance of a bonded-wire loop extending between two bond contacts on a substrate to tensile force. The apparatus includes a traction hook...
|
|
|
6758384 |
Three-dimensional soldering inspection apparatus and method
A three-dimensional soldering inspection apparatus and method. The three-dimensional soldering inspection apparatus includes a lighting module provided with a plurality of light emitting devices, a...
|
|
|
6719184 |
Nondestructive inspection method
A rotary tool ( 140 ) is relatively moved against members ( 30, 30 ) to be welded so as to perform friction stir welding of said members, while blades ( 145 ) mounted on the rotary tool ( 140 ) and...
|
|
|
6715663 |
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method
The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the...
|
|
|
6678948 |
Method for connecting electronic components to a substrate, and a method for checking such a connection
A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper...
|
|
|
6667625 |
Method and apparatus for detecting wire in an ultrasonic bonding tool
An apparatus for detecting whether bonding wire supplied to an ultrasonic bonding tool of an ultrasonic bonding machine is present in a bore of the tool tip and providing an alarm signal if a wire...
|
|
|
6585146 |
Automated non-destructive weld evaluation method and apparatus
A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface...
|
|
|
6564987 |
Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device
A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on...
|
|
|
6564986 |
Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board
A method and assembly for testing multiple IC packages for solder joint fractures that occur in response to thermal cycling. A test PCB is fabricated with contact pads arranged to match a BGA IC...
|
|
|
6452502 |
Method and apparatus for early detection of reliability degradation of electronic devices
A circuit that senses changes in the electrical characteristics of one or more solder joints, and generates one or more signals based, at least in part, on the electrical characteristics that are...
|
|
|
6450392 |
Groove shape for single butt welding and inspection method of weld zone thereof
A groove shape and an inspection method capable of securely recognizing existence of a weld flaw of a single butt weld zone by a nondestructive inspection, such as a radiograph test or an...
|
|
|
6439447 |
Bump joining judging device and method, and semiconductor component production device and method
When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration...
|
|
|
6435399 |
Method of checking wirebond condition
A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is...
|
|
|
6367679 |
Detection of flux residue
Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the...
|
|
|
6365873 |
Apparatus for the concurrent inspection of partially completed welds
An apparatus for the concurrent inspection of partially completed welds is described in which is utilized in combination with a moveable welder for forming a partially completed weld, and an...
|
|
|
6332011 |
Ultrasonic examination of shroud weld from top of shroud flange ring
A method of inspecting the H1 weld between the shroud head flange and the upper shroud section utilizing ultrasonic scanning includes the steps of positioning a phased array ultrasonic probe on a...
|
|
|
6308881 |
Quality control method
A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes...
|
|
|
6302314 |
Method for examining bonded-metal by ultrasonic examination
A method for examining bonded-metal by ultrasonic examination, the method comprising a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a...
|
|
|
6293455 |
Method for producing a reliable BGA solder joint interconnection
A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over...
|
|
|
6271601 |
Wire bonding method and apparatus and semiconductor device
A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 μm, on its feed side, feed out and...
|
|
|
6247629 |
Wire bond monitoring system for layered packages
A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as...
|
|
|
6206267 |
Full coverage thermal couple
A process for profiling solder joints of circuit boards including solder bumps is provided using an arrangement with a thin tape element with length and width dimensions generally corresponding to...
|
|
|
6193132 |
Method for bonding semiconductor chip and device therefor
A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with...
|
|
|
6155117 |
Edge detection and seam tracking with EMATs
A method for detecting the location of an edge, interface, seam or other structure of a workpiece uses one or two electromagnetic acoustic transducers (EMATs) to transmit an ultrasonic wave along...
|
|
|
6145191 |
Method for mounting and testing integrated circuits on printed circuit boards
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto...
|
|
|
6142359 |
Method of connecting pipe-in-pipe structures
A method of forming a structural member by connecting end-to-end first and second tubular structures, with each tubular structure having an inner tubular member (1a, 1b) located within a...
|
|
|
6137860 |
Digital radiographic weld inspection system
Disclosed is a weld inspection system that utilizes an automated digital radiographic camera and control system to generate and review digital X-ray images of the weld seam. The weld inspection...
|
|
|
6096997 |
Method of assembling an igniter including infrared testing of heating element and welds
A method of assembling an igniter (24) for a gas generating composition (18) comprises providing a pair of spaced apart electrodes (40 and 42) and providing a heat ignitable material (46). A...
|
|
|
6072144 |
Apparatus for measuring the quality of spot welds
Apparatus (2) for measuring the quality of spot welds, comprising a housing (4); a fluid medium (6) in the housing (4); transmitter means (8) for transmitting at least one ultrasonic pulse through...
|