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7628308 |
Method of replenishing an oxidation suppressing element in a solder bath
The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then...
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7617965 |
Method for measuring loads on a friction stir welding tool
An apparatus and method are provided for measuring loads on a rotating friction stir welding tool of a friction stir welding machine. The apparatus includes a frame that can be connected to the...
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7597234 |
Method for mounting a flip chip on a substrate
The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding...
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7591409 |
Semiconductor device bonding apparatus and method for bonding semiconductor device using the same
The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a...
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7591408 |
Camera-assisted adjustment of bonding head elements
The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an...
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7581666 |
Wire-bonding method for wire-bonding apparatus
A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several...
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7549566 |
Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method
A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at...
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7543732 |
Evaluation method and evaluation apparatus for spot welded portion
A technique for evaluation of the strength of a spot welded portion of a panel is provided. A stress value at the welded portion of the panel is calculated by a stress analysis according to a FEM...
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7537150 |
Apparatus and method for measuring loads on a friction stir welding tool
An apparatus and method are provided for measuring loads on a rotating friction stir welding tool of a friction stir welding machine. The apparatus includes a frame that can be connected to the...
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7520538 |
Orbital tube welding purge adaptor
A purge gas introduction system for an orbital tube welding setup is provided, configured to inject high purity inert purge gas to the interior volume of a tube or tubular component. An o-ring is...
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7516878 |
Bump formation method and bump forming apparatus for semiconductor wafer
A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the...
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7478741 |
Solder interconnect integrity monitor
An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across...
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7461771 |
Method of treating and probing a via
A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely...
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7458496 |
Wire bonder and method of operating the same
Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a...
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7427517 |
Stacking apparatus and method for stacking integrated circuit elements
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move...
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7419085 |
Optical processing apparatus
The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing...
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7416104 |
Rotational fill techniques for injection molding of solder
A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a...
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7413106 |
Method for fixing a miniaturized component to a carrier plate
The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a...
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7392927 |
Combinatorial production of material compositions from a single sample
A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality...
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7392924 |
Automated ball mounting process and system with solder ball testing
An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature...
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7389698 |
Nutplate bond strength tester unit
A bond strength tester unit is provided for testing adhesive bond strength of a nutplate or the like attached to a substrate, such as by adhesive bonded attachment to a blind side of the substrate...
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7380697 |
Welding condition monitoring device
A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an...
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7375304 |
System and method providing automated welding notification
The present invention relates to a system and method that provide for automated notification to entities (e.g., individuals, groups of individuals, computers, systems . . . ) of welding system...
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7370785 |
Wire bonding method and apparatus
A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position...
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7337939 |
Bonding apparatus
A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said...
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7330582 |
Bonding program
With an assumption that the three data of the position (X 1 , Y 1 ) of the first positioning pattern 202 and position (X 2 , Y 2 ) of the second positioning pattern 212 of the reference chip ...
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7324684 |
Bonding apparatus
With an assumption that the three data of the position (X 1 , Y 1 ) of the first positioning pattern 202 and position (X 2 , Y 2 ) of the second positioning pattern 212 of the reference chip ...
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7324683 |
Bonding pattern discrimination device
Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar...
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7321681 |
Bonding pattern discrimination program
Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar...
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7307238 |
Determining quality of a stick electrode
A method of measuring the quality of a stick electrode used in forming the root bead of a pipe joint, which electrode has a wire diameter, a length substantially greater than 12 inches and an upper...
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7304268 |
Method for rating stick electrodes for pipe welding
Stick welding electrode rating and ranking procedures are provided for determining stackability performance of stick electrodes for pipe welding operations. The rating technique involves...
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7296725 |
Feed devices and methods for injection molded solder systems
A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively...
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7246736 |
Supplying shielding gas
A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially...
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7224829 |
Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar...
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7217645 |
Method for manufacturing semiconductor device and electronic device and method for calculating connection condition
Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the...
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7213738 |
Selective wave solder system
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and...
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7209583 |
Bonding method, bonding apparatus and bonding program
With an assumption that the three data of the position (X 1 , Y 1 ) of the first positioning pattern 202 and position (X 2 , Y 2 ) of the second positioning pattern 212 of the reference chip ...
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7191929 |
Method of measuring thickness of bonded ball in wire bonding
A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being...
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7163137 |
Method of manufacturing mounting boards
The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of...
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7159754 |
Apparatus and method for corrective soldering
The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints,...
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7159753 |
Wire body based welding representation
A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture...
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7137544 |
Apparatus and method for performing welding at elevated temperature
A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is...
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7132617 |
Method and system for assessing quality of spot welds
A system and method for assessing the quality of spot weld joints between pieces of metal includes an ultrasound transducer probing a spot weld joint. The ultrasound transducer transmits ultrasonic...
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7131565 |
Feed devices and methods for injection molded solder systems
A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively...
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7129442 |
Welding machine
A welding machine that includes a welding torch assembly, a first rotary head, a second rotary head, a fixture, a processor and a memory subsystem. The first rotary head is configured to receive...
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7124928 |
Optical component installation and train alignment process utilizing metrology and plastic deformation
A micro-optical train manufacturing process includes a step of characterizing the position of optical components on an optical bench, typically using a metrology system. These optical components...
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7100814 |
Method for preparing integrated circuit modules for attachment to printed circuit substrates
A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer...
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7093744 |
Recognition device, bonding device, and method of manufacturing a circuit device
The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during...
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7086576 |
Machine for constructing the side wall of a cylindrical tank
The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This...
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7080771 |
Method for checking the quality of a wedge bond
A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is...
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