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7581666 Wire-bonding method for wire-bonding apparatus  
A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several...
7549566 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method  
A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at...
7546682 Methods for repairing circuit board having defective pre-soldering bump  
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided,...
7523848 Method and apparatus for measuring the size of free air balls on a wire bonder  
A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed...
7520043 Method of securing a tube in a bore through a spherical wall, and a device for depositing welding material in a facing  
An annular facing is machined in an inside surface of the spherical wall around the periphery of a zone where the wall has a bore for securing the tube passing therethrough. A first welding...
7478741 Solder interconnect integrity monitor  
An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across...
7464851 Wire bonding method and apparatus therefor  
Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is...
7441688 Methods and device for controlling pressure in reactive multilayer joining and resulting product  
The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the...
7428843 Multi-function digital pressure measuring device  
A multi-function digital pressure measuring device and welding torch having an outlet nozzle with first and second gas inlets with valves. The pressure measuring device having a body with a first...
7380697 Welding condition monitoring device  
A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an...
7370785 Wire bonding method and apparatus  
A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position...
7357290 Workpiece support structures and system for controlling same  
In accordance with one aspect of the present exemplary embodiment, set forth is a welding system including a plurality of adjustable welding support structures positioned in relationship to each...
7353976 Wire bonder  
A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At...
7337939 Bonding apparatus  
A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said...
7318011 Facial characteristic based generation of fillet weld bead representation  
A computing environment is provided with the ability to contribute to generate a representation for a fillet weld bead to be used to fillet weld a number components of an article of manufacture...
7296727 Apparatus and method for mounting electronic components  
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the...
7296725 Feed devices and methods for injection molded solder systems  
A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively...
7219419 Component mounting apparatus including a polishing device  
Component ( 3 ) is pressed onto a circuit board ( 4 ) so that their respective metal interconnects ( 5 ), ( 6 ) are in close contact with each other, and ultrasonic vibration is applied to the...
7216793 Friction stir welding travel axis load control method and apparatus  
A friction stir welding (FSW) travel axis load control method and apparatus for controlling a travel axis load applied to a FSW setup during the joining of workpieces by FSW. The method and...
7170036 Apparatus and method for heating and cooling an article  
An apparatus for heating and cooling an article is provided. The apparatus comprises an enclosure having top, bottom, and side walls and an entrance and an exit. A first belt system comprising one...
7161351 Hidden feature characterization using a database of sensor responses  
Quasistatic sensor responses may be converted into multiple model parameters to characterize hidden properties of a material. Methods of conversion use databases of responses and, in some cases,...
7159754 Apparatus and method for corrective soldering  
The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints,...
7159753 Wire body based welding representation  
A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture...
7140529 Wire bonding method and apparatus  
A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the...
7131565 Feed devices and methods for injection molded solder systems  
A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively...
7121449 Method and device for applying material to a workpiece  
In order to apply solder material ( 20 ) to a workpiece ( 1 ), compressed gas is guided through a bore hole ( 5 ) of a capillary ( 3 ). A pressure sensor ( 13 ) situated in the bore hole ( 5 )...
7100814 Method for preparing integrated circuit modules for attachment to printed circuit substrates  
A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer...
7086576 Machine for constructing the side wall of a cylindrical tank  
The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This...
7083077 Method and contact point for establishing an electrical connection  
A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact...
7080771 Method for checking the quality of a wedge bond  
A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is...
7080770 Method and system of inertia friction welding  
A method and system of inertia friction welding that enables the production of inertia friction welds in which the final upset can be controlled to an operator specified target. The method utilizes...
7075036 Electronic part compression bonding apparatus and method  
An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure...
7058154 Systems and methods for managing assets using an interactive database  
The disclosed invention is a system and a method utilizing a web-based interactive database to automate the process for managing internal components of a plant. The system captures all essential...
7025245 Magnetic welder  
A magnetic welding and joining device is provided. The device has a separable induction coil that can be selectively coupled to provide an induction coil to be positioned around workpieces that are...
7004372 Method for determining optimum bond parameters when bonding with a wire bonder  
A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With...
7004370 Device and method for determining parameters of a welding system  
The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area ( 18, 21, 22 ) is subjected to the action of ultrasonic...
6997370 Optical pickup device  
A method for assembling an optical disk apparatus involves disposing first and second short-cutting terminals at different faces of a housing and in parallel with a laser diode of the apparatus. In...
6997368 Fiber alignment process using cornercube offset tool  
A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a...
6983872 Substrate alignment method and apparatus  
The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing...
6942139 Robotic cylinder welding  
A first embodiment of the present application is directed to a method and system used to weld a cylindrical workpiece. A substantially cylindrical workpiece is loaded into a workpiece support, and...
6935551 Ultrasonic bonding method of coated electric wires and ultrasonic bonding apparatus using same  
Intersected portions (C) of coated electric wires 20 and ( 21 ) are sandwiched and pressurized between a horn-side chip ( 11 ) and an anvil-side chip ( 12 ) (sandwiching step). Ultrasonic...
6931932 Device for measuring the amplitude of the tip of an oscillating capillary  
A device for measuring the oscillation amplitude of the tip of a capillary by means of a light beam comprises a light source and an opto-receiver and two apertured diaphragms that are arranged...
6929168 Method for determining optimum bonding parameters for bonding with a wire bonder  
A method for finding optimum bond parameters for a bond force F B and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a...
6929167 Control of hot rolled product cross section under localized temperature disturbances  
A method of rolling a continuous welded billet having weld joints at successive locations along the billet and wherein the continuous welded billet is advanced through roll pairs of successive roll...
6889888 Spatial integration of pipeline datasets  
This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and...
6827247 Apparatus for detecting the oscillation amplitude of an oscillating object  
Apparatus for detecting the oscillation amplitude of an oscillating object ( 3 ) includes an optical radiation source ( 9 ) and a detector ( 10 ) including first and second optical radiation...
6824040 Method and apparatus for linear vibration welding  
The method of controlling a linear vibration welding apparatus, in accordance with the invention, may comprise the steps of: fastening a first workpiece portion in a fixed position; fastening a...
6799712 Conveyor oven profiling system  
A system is disclosed for determining optimal process settings for a conveyor oven, such as a reflow oven used to reflow solder paste on a PCB assembly. According to a disclosed embodiment, an...
6793125 Solder shaping process and apparatus  
A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently...
6783054 System for controllably conducting welding operations adjacent flammable materials and method of welding adjacent flammable materials  
A system ( 10 ) for conducting welding adjacent flammable materials ( 12 ) on a platform ( 11 ) is disclosed having a chamber ( 13 ) defining an interior space ( 16 ). The system also includes a...
Matches 1 - 50 out of 429 1 2 3 4 5 6 7 8 9 >