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7213738 |
Selective wave solder system
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and...
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7086576 |
Machine for constructing the side wall of a cylindrical tank
The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This...
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6983872 |
Substrate alignment method and apparatus
The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing...
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6871771 |
Automated header brazing machine
A machine for determining the location of junction tubes along a header and automatically brazing them to the header. A chassis is employed to hold the junction tubes and header in the proper...
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6729530 |
Fiber alignment apparatus and process using cornercube offset tool
A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a...
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6699306 |
Control method for copper density in a solder dipping bath
This method controls a copper density in a dip solder bath holding a molten solder alloy containing at least copper as an essential composition thereof during a dip soldering step of one of a...
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6651866 |
Precision bond head for mounting semiconductor chips
The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably...
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6561407 |
Reflow soldering apparatus and method
The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high...
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6189765 |
Apparatus and method for detecting double wire bonding
The present invention is to provide an apparatus and a method for detecting a double bonding error that a wire ball is in contact with a wire loop previously formed between a pad and a lead, by...
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6169268 |
Method and apparatus for forming the ends of metallic tubes
A method and apparatus for forming constricted ends on tube products on an automatic continuous basis. The apparatus includes a feeding station including a spindle for supporting a metallic tube. A...
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6127657 |
Clamping soldering device
An air-operated soldering device includes a pair of air cylinders which are operable to clamp a workpiece between the cylinders and a base. A clip holder is then advanced against the workpiece by a...
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6027005 |
Method and apparatus for automatically welding frames
A method and apparatus for welding steel frames, which can be subsequently assembled together to form storage racks for holding and supporting inventory stored on pallets, in boxes, or in other...
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5467912 |
Reflow soldering apparatus for soldering electronic parts to circuit substrate
There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting...
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5375756 |
Apparatus for assembling and welding final end plugs to nuclear fuel-containing cladding tubes and inspecting the welds, all on an automated basis
In an automated final weld apparatus, a transporter conveys nuclear fuel-loaded cladding tubes successively to a check station to verify the presence of a plenum spring in the open end of each...
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5263631 |
Contact-making system for semiconductor wire connections
A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for...
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5143271 |
Device for assembling the parts intervening on a face-plate corresponding to an espagnolette or bolt lock for a swinging and tilting leaf
The invention relates to a device for assembling the parts intervening on a face-plate corresponding to an espagnolette or bolt lock for a swinging and tilting leaf. As a matter of fact, this...
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5062566 |
Automated carrier-strip splicer
A splicing machine for carrier strip is automated to lower the pathway of terminal strip over the splicing jaws and to sense the engagement of the strip by the movement of a guide bar within the...
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5011061 |
Wire bonding device
A wire bonding device is disclosed. The device has a capillary which causes a wire to make press-contact to a bonding face, a driving motor for raising and lowering the capillary, a storage, means...
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4877174 |
Tab device excise and lead form apparatus
Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame...
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4824006 |
Die bonding apparatus
A die bonding apparatus comprising a paste supply section having a needle for supplying paste onto a package to secure a semiconductor pellet, a driving section for moving the paste supply section...
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4807794 |
Method and equipment to solder printed-circuit assemblies
To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a...
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4786860 |
Missing wire detector
The absence of a wire (40) in proper position under the bonding tool (32) of an ultrasonic wire bonder is detected by energizing the bonder transducer (14) while the wire is pulled to break it...
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4771930 |
Apparatus for supplying uniform tail lengths
A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing...
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4720035 |
Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
Reflow bonding of electronic parts such as large scale integrated circuits onto a printed circuit board, especially on multi-layer printed circuit board, requires that bonding tips press down the...
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4598853 |
Open-center flexural pivot wire bonding head
A flexural pivot structure useful in a wire bonding machine bonding head (10) is disclosed and includes first and second leaf spring assemblies (39,41) which provide a pivot axis (PA) displaced...
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4583674 |
Apparatus for applying stripes of solder to opposite sides of circuit boards
Printed circuit boards 10 having connector terminals 14 and 16 overlaying contact pads 17 and 18 are loaded into fixtures 22 which are conveyor 31 advanced through a pair of solder applying...
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4558596 |
Apparatus for detecting missing wires
Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop...
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4511075 |
Welding nuclear reactor fuel rod end plugs
Apparatus for applying a vacuum to a nuclear fuel rod cladding tube's interior through its open end while girth welding an inserted end plug to its other end. An airtight housing has an orifice...
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4485959 |
Means for welding intercell connections
An apparatus for welding through-the-partition intercell connections in a lead-acid battery container wherein each partition has at least two spaced apertures therein for making such intercell...
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4485957 |
Wire bonder
A wire bonder is frequently used for assembling the electronic parts of a semiconductor device or the like and exhibits an effect in the electric connections of the aforementioned electronic parts...
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4446358 |
Preheater for use in mass soldering apparatus
An improved preheater for use in mass soldering apparatus employing a bank of quartz lamp heaters mounted in parabolic reflectors and including switching means for switching the quartz heaters on...
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4363434 |
Continuous soldering installation
A soldering installation (1) is provided for run-through and shuttle operation, in particular for the run-through soldering of printed circuit boards on a soldering machine. It is equipped with a...
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4358044 |
Apparatus for soldering solder on ceramic substrate
An apparatus for soldering a solder on a difficultly solderable substrate comprises a vibration tip which is rotatably held and is mounted on an ultrasonic oscillation mechanism and is slidably...
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3990620 |
Installation for the automatic feed of welding wires
An installation for the automatic feed of welding wires for a welding torch provided for the treatment of workpieces, in which means are provided to weld together the welding wires supplied in rod...
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3909933 |
Method for transferring and bonding articles
A substrate to which electrical circuit elements, such as integrated circuit (IC) chips, are to be bonded to bond sites on a surface thereof, is positioned on a substrate support table which is...
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3882596 |
Method of flux-free soldering of aluminum-containing workpieces in a controlled atmosphere
A furnace for flux-free soldering of aluminum-containing workpieces in a controlled atmosphere has a furnace chamber through which workpieces to be soldered are made to travel. The furnace chamber...
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3747184 |
SYSTEM FOR FORMING BUILDING FRAME STRUCTURES
A system for forming building framing structures comprising means for carrying elongated stud members along, and disposed transversely of, a predetermined path, the opposite ends of the stud...
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3738560 |
SEMICONDUCTOR DIE BONDER
In a die bonder for use in bonding semiconductor dice to bonding pads, a plurality of dice to be bonded to bonding pads are placed in a first horizontal plane on a movable pedestal beneath a second...
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3731867 |
VACUUM DIE SENSOR APPARATUS AND METHOD FOR A SEMICONDUCTOR DIE BONDING MACHINE
Sensing apparatus for determining whether or not a vacuum pickup mechanism for picking up a semiconductor die and transferring it to a lead to which it is to be bonded has picked up a die is...
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3596050 |
AUTOMATIC TORCH HEIGHT CONTROL
The height control apparatus of the present invention automatically maintains a desired spacing between a torch and the surface of a workpiece by detecting variations in capacitance between a plate...
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RE11297 |
Title is not available
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3480194 |
STRIP EDGE DETECTION FOR MACHINE FUNCTION INITIATING DEVICE
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3382575 |
Method of making electrical contacts from strip stock
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3266700 |
Pipeline welding assembly
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3209793 |
Apparatus for manufacturing steel skeleton for reinforced concrete
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3190525 |
Apparatus for aligning coil ends for joining
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3173594 |
Making helically welded tubes
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3132544 |
Positioning and splicing apparatus for positioning and splicing webs
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3122117 |
Flux applying means
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3112723 |
Automatic fluxing machine
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