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7126078 |
Sub-micron adjustable mount for supporting a component and method
An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip...
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7036225 |
Process for treating coil end upon winding of coil
A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of...
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6936785 |
Welding construction and a welding method using the same
A welding construction ( 10 ) includes a weldable portion ( 11 a ) formed by bending a leading end of an electrically conductive plate ( 11 ). This weldable portion ( 11 a ) is formed with a tip (...
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6898849 |
Method for controlling wire balls in electronic bonding
A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses...
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6896170 |
Wire bonder for ball bonding insulated wire and method of using same
A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced...
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6857552 |
Method and apparatus for making smart card solder contacts
A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna...
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6818861 |
Discharge electrode for a wire bonding apparatus
A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore...
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6784394 |
Ball formation method and ball forming device used in a wire bonding apparatus
A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends...
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6770833 |
Micro-welding electrode
A micro-welding electrode which is installed in a welding machine and applied to the electronics industry and spot electric welding industry. The micro-welding electrode includes two integrated...
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6737603 |
SW micro welder for directly welding enameled wires
This invention deals with a spot electrical welding machine which is technically applied to the electronics industry and micro-electronic industry. A spot electrical welder optimally directly welds...
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6715658 |
Ultra fine pitch capillary
A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered...
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6671952 |
Method of lead wire connection
A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member...
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6660956 |
Method of and apparatus for monitoring a ball forming process
A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball...
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6552293 |
Metallic members joining method and reflow soldering method
In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements...
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6520399 |
Thermosonic bonding apparatus, tool, and method
A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm...
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6495787 |
Electrical connection system between an electrochemical cell and a printed circuit
An electrical connection system between an electrochemical cell and a printed circuit having a copper layer, the system comprising at least one connection piece welded to the cell, wherein the...
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6354479 |
Dissipative ceramic bonding tip
Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present...
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6337453 |
Method and apparatus for arc-forming a bonding wire ball with attenuated electro-magnetic interference
An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means...
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6215083 |
Welded wire termination device and method
A welded wire termination for use in thermally and mechanically stressful environments is provided by forming a wire termination tab on a conductive pad to define a tubule for receiving a wire,...
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6198064 |
Terminal for electric wire welding and welding torch suitable for electric wire welding to the terminal
A pad piece is unitedly formed on a wrapping terminal to be contacted by an electrode probe and positioned to be opposed to a welding torch, and the electrode probe is held by the welding torch to...
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6172318 |
Base for wire bond checking
A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe...
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6156990 |
Long-wearing impervious conductive wire clamp
A wire bonding machine having a wire clamp comprised of a platinum group metal such as iridium, rhodium, ruthenium, or osmium so as to minimize corrosion due to micro sparking.
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6137075 |
Method and apparatus for producing an electrical bond between conductors and electrical connector contacts
A method and apparatus for producing an electrical bond between a conductor and an electrical connector contact. The apparatus generally comprises a power source and a weld head. The power source...
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6064026 |
Method for producing an electrical bond between conductors and electrical connector contacts
A method for producing an electrical bond between a contact element of an electrical connector and a conductor, the contact element having a portion that is bifurcated such that the conductor is...
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6062462 |
Apparatus and method for making predetermined fine wire ball sizes
A method and apparatus for making small ball size ratio air balls for use with fine pitch bonding tools includes programming an automatic wire bonder to make a predetermined diameter ball on a fine...
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5988482 |
Discharge abnormality detection device and method for use in wire bonding apparatus
A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied...
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5957371 |
Method and apparatus for forming a ball in wire bonding
In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes...
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5797388 |
Wire-bonding apparatus and method using a covered wire
In a wire-bonding machine and method that uses a covered wire, discharge electrodes comprise a pair of discharge electrodes for covering-film removal, in which the upper and lower surfaces of...
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5763849 |
Wire bonding apparatus
In a wire bonding apparatus comprising a torch electrode for melting an end of a metallic thin wire to form a ball thereof, a high voltage detecting circuit for detecting a voltage between the...
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5676856 |
Electric discharge apparatus for cleaning electrode on workpiece and method thereof
A voltage is applied between a first cleaning electrode that in contact with an electrode on a workpiece such as a printed circuit board or a chip, and a second cleaning electrode located in the...
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5628922 |
Electrical flame-off wand
A electrical flame-off (EFO) wand 200 for emitting an electrical discharge to form a length of bonding wire into a ball comprising a stainless steel tube mounting section 305 for mounting, a...
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5616257 |
Wire bonding method and apparatus
An electrode used in a wire bonding method and apparatus for applying an electric discharge to an end of a bonding wire so as to form a ball at the end of the bonding wire. The electrode is...
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5601740 |
Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires
The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by...
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5463197 |
Apparatus and method for forming wire bonding ball
A ball forming apparatus free from parameter variations introduced in setting spark discharge control parameters wherein the variations may be largely of operator-dependent or apparatus-dependent...
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5360958 |
Welding apparatus having coaxial welding electrodes
A resistance welding apparatus for welding a wire to a metallic pad of an integrated circuit. The welding apparatus has coaxial welding electrodes with the outer electrode being in the form of a...
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5263631 |
Contact-making system for semiconductor wire connections
A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for...
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5214259 |
Method and apparatus for forming a ball at a bonding wire end
In a method and apparatus for making uniform size balls at the end of bonding wires, a constant current circuit is installed between a high voltage power source and a discharge electrode so that a...
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5181646 |
Lead frame holding apparatus for use in wire bonders
A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer...
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5178742 |
Method of and apparatus for forming a micromelt structure on an electrically-conductive probe tip
A micromelt structure is provided on a probe tip by contacting the probe tip with a foil of the material from which the micromelt structure is to be formed and passing an electric current through...
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5138127 |
Pressure welding with closed loop force control
A parallel-gap welder applies a precisely controlled force to the weld head (40) by means of a solenoid (60) having a plunger (72) aligned with the axis of the welding electrodes (50,52). To...
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5115111 |
Dual tip rotating welding electrode
Two parallel elongated closely spaced electrodes for welding electronic circuit components are mounted for limited rotation about an axis extending generally longitudinally of the electrodes to...
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5110032 |
Method and apparatus for wire bonding
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical...
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5095187 |
Weakening wire supplied through a wire bonder
A technique for weakening an interconnection wire provided on a contact on an electronic component, in which the wire is weakened by means of an arc which is created between the wire and an...
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5002217 |
Bonding method and bonding apparatus
A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding...
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4999472 |
Electric arc system for ablating a surface coating
An electrical arc system for ablating a portion of a surface coating from an electrically conductive wire along a selected cut-off line within a tolerance on the order of 0.001 of an inch. The arc...
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4976393 |
Semiconductor device and production process thereof, as well as wire bonding device used therefor
The present invention concerns a semiconductor device and a process for producing semiconductor device, as well as a wire bonding device used therefor. In accordance with the present invention, a...
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4955523 |
Interconnection of electronic components
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the...
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4925085 |
Bonding means and method
An improved means and method for bonding closely spaced parallel wires for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means is provided located...
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4909427 |
Bonding wire ball formation
A ball bonding apparatus is provided with a "flame off" electrode which is positioned, during flame off, around and above the capillary tool so that the spark for melting the wire passes in close...
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4849600 |
Constant temperature welding method
A method for welding two pieces includes juxtaposing the pieces and monitoring the temperature of the region to be welded. Energy is applied at a time rate sufficient to raise the temperature of...
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