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8183496 |
Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
A method of forming a pattern (700) on a work piece (1260) includes placing a pattern mask (1210) over the work piece, placing an aperture (100, 500, 600, 1220) over the pattern mask, and placing...
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8183500 |
Orthogonal beam delivery system for wafer edge processing
A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge...
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RE43400 |
Laser segmented cutting, multi-step cutting, or both
UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned ...
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8178028 |
Laser patterning of nanostructure-films
A novel nanostructure-film patterning method is discussed, wherein a laser is employed to etch a nanostructure-film. The laser may be a solid state UV laser, and the nanostructure-film may be...
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8173038 |
Methods and systems for forming microstructures in glass substrates
A method for forming microstructure cavities in a glass substrate includes directing a first laser pulse onto the glass substrate thereby forming a first microstructure cavity having a tapered...
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8168921 |
Method and system for marking a material using a laser marking system
A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system...
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8164025 |
Method and system for marking a material using a laser marking system
A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system...
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8158493 |
Laser-based material processing methods and systems
Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a...
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8153923 |
Method for producing a hole
There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small...
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8138450 |
Method for cutting workpiece
A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the...
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8134099 |
Laser working method, laser working apparatus, and its manufacturing method
An object to be processed 1 is irradiated with a laser light L modulated by a reflection type spatial light modulator 203 such that aberration of the laser light L converged inside the object 1...
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8129658 |
Systems for thin film laser scribing devices
Methods and related systems for fabricating a solar-cell assembly are provided. An example method comprises forming a series of layers and scribing a series of aligned interconnect lines in the...
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8124911 |
On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed...
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8124910 |
Laser marked CATV filter
A CATV filter assembled inside a housing has the housing marked by a laser system with indicia relating to specific characteristics of the filter. The housing is thus not mechanically deformed...
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8124000 |
Substrate manufacturing method including protrusion removing step
A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate (2) is scanned...
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8108998 |
Laser cutting method
At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is...
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8110777 |
Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser
The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts...
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8106329 |
Laser processing of conductive links
A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and...
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8101247 |
Sub-micron laser direct write
A method of directing a pulse of laser energy though a workpiece. The workpiece has: a substrate that transmits the laser energy; focusing elements on a surface of the substrate proximal to the...
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8097087 |
Method of cleaning support plate
A method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning...
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8093532 |
Laser machining of fired ceramic and other hard and/or thick materials
Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece....
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8084706 |
System and method for laser processing at non-constant velocities
A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output. The method includes the steps of relatively positioning the group of...
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8084712 |
Method and apparatus for laser marking objects
Methods and apparatus for laser marking individual objects with indicia at a marking station wherein a predetermined window exists during which each object can be marked as the objects are conveyed...
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8076776 |
Integrated circuit package having security feature and method of manufacturing same
An integrated circuit package comprises a package substrate (210, 410), an electrically insulating material (220, 420) adjacent to the package substrate, and a mark (230, 420) on the electrically...
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8071910 |
Laser processing apparatus
A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second...
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8052836 |
Laser-based methods of stripping fiber optic cables
Laser-based methods of stripping different types of fiber optic cables (100) are disclosed. The method includes directing a focused laser beam (202) onto the cable's protective cover (114). The...
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8051679 |
Laser separation of glass sheets
Methods of using a laser to separate a glass sheet is presented that employs an elongated and, preferably, asymmetrically-truncated laser beam. The methods allow glass sheets suitable for use in...
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8049135 |
Systems and methods for alignment of laser beam(s) for semiconductor link processing
A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The...
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8035901 |
Laser scoring with curved trajectory
Disclosed are systems and methods for scoring and separating a glass sheet along a curved trajectory using a laser and optics. The system includes a laser that generates a laser beam, a focusing...
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8030594 |
Color sensing for laser decoating
A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive...
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8026459 |
Laser surface treatment
A laser surface treatment for reducing reflection loss on the surface of an optical material is provided. A metal film is formed on the surface of the optical material, and then the metal film is...
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8008598 |
Method for forming staple pockets of a surgical stapler
A system and method for forming a staple pocket, e.g., on the anvil portion of a surgical stapler device. A laser-machining system may include a laser-emitting device that is configured to emit a...
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8008599 |
Method for manufacturing layered elements with incisions
A manufacturing method may include forming incisions through an incision layer that is secured to a transfer layer. After defining the incisions, the incision layer is secured to a substrate layer,...
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8003915 |
System and methods for producing tinted and non-tinted materials with non-discernable laser inscriptions
A system and method for inscribing marks, that will remain non-discernable after tinting, on materials in general, and on plastic ophthalmic lenses in particular. The system uses a laser, which...
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7989728 |
Method and device for producing a tear line in a vehicle interior trim part
A method and a device for producing a tear line in a vehicle interior trim part, in which a laser beam is guided along a tear line and a material ablation in the form of holes with a residual wall...
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7985942 |
Method of providing consistent quality of target material removal by lasers having different output performance characteristics
Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a...
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7984536 |
Method of manufacturing a piezoelectric resonator
To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere...
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7982160 |
Photonic clock stabilized laser comb processing
Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam...
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7977601 |
X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device...
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7977602 |
Laser ablation using multiple wavelengths
In laser micromachining and laser defect repair of a first material, a first set of one or more laser wavelengths is selected in accordance with the first material's absorption characteristics and...
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7968819 |
Microdissection apparatus and method
A microdissection apparatus includes a laser light source to emit laser light, and a laser light irradiation optical system to irradiate a sample with the laser light from the laser light source....
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7964820 |
Process for laser scribing
A method for accurately laser scribing lines on a panel utilising a laser beam scanner unit (13) including an optical system and a scanner lens. The unit (13) moves a laser beam (12) in a first...
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7964819 |
Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be...
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7955906 |
Methods and systems for thermal-based laser processing a multi-material device
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or...
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7955905 |
Methods and systems for thermal-based laser processing a multi-material device
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or...
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7947920 |
Arrangement and method for forming one or more separated scores in a surface of a substrate
The present invention is directed to an arrangement for forming one or more separated scores in a surface of a substrate. The arrangement comprises a laser for providing a laser beam, optical...
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7947575 |
Laser machining
A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses 81 at the substrate do not overlap but are...
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7947921 |
Electric wire insulation center stripping method and device
An insulated electric wire having a conductive core and an insulation jacket is center stripped by cutting a pattern in one side of the insulation jacket with a laser beam, and then cutting a...
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7923658 |
Laser micromachining methods and systems
A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the...
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7919191 |
Pigmented images on stone
A method of creating a pigmented image on a monument stone substrate includes positioning the stone relative to a laser engraving apparatus, masking the stone substrate in an image area in which...
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