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7413992 Tungsten silicide etch process with reduced etch rate micro-loading  
The embodiments provides an improved tungsten silicide etching process with reduced etch rate micro-loading effect. In one embodiment, a method for etching a layer formed on a substrate is...
7402257 Plasma state monitoring to control etching processes and across-wafer uniformity, and system for performing same  
The present invention is generally directed to plasma state monitoring to control etching processes and across-wafer uniformity, and a system for performing same. In one illustrative embodiment,...
7399711 Method for controlling a recess etch process  
A method of controlling a recess etch process for a multilayered substrate having a trench therein and a column of material deposited in the trench includes determining a first dimension from a...
7396481 Etching method of organic insulating film  
This invention relates to a method for etching an organic insulating film used in the production of semiconductor devices. A sample to be etched on which a low dielectric constant organic...
7393459 Method for automatic determination of substrates states in plasma processing chambers  
A method for automatic determination of a state of a substrate in a plasma processing chamber is provided. Substrate reflectance data is collected in a processing chamber prior to processing to be...
7378003 Thin-film magnetic recording head manufacture using selective imaging  
A focused particle beam system, according to one embodiment of the invention, precisely shapes a pole-tip assembly formed by a multi-layer device having a first layer with a first structural...
7377992 Method and apparatus for detecting end point  
A mask layer and a to-be-processed layer are irradiated with light to measure interference light formed of reflected lights from the mask layer and reflected lights from the to-be-processed layer....
7361286 Method of detecting etching end-point  
A method of detecting an etching end-point includes the steps of: forming a mask on a pattern area of an etching object; forming an etching indicator on an etching area of the etching object, which...
7354524 Method and system for processing multi-layer films  
A method of processing multi-layer films, the method including: (1) processing a plurality of layers according to selected parameters, (2) determining a plurality of optical characteristics each...
7335315 Method and device for measuring wafer potential or temperature  
The present invention attracts a wafer 6 , placed on a susceptor 5 , toward the susceptor 5 by the electrostatic attractive power of an electrostatic chuck electrode 7 , varies the output...
7329361 Method and apparatus for fabricating or altering microstructures using local chemical alterations  
A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure.
7306746 Critical dimension control in a semiconductor fabrication process  
A method for controlling a critical dimension in an etched structure comprises the steps of: forming a hard mask above a substrate, measuring a critical dimension of the hard mask, and using the...
7297560 Method and apparatus for detecting endpoint  
The present invention presents a method for detecting an endpoint of an etch process for etching a substrate in plasma processing system ( 1 ) comprising: etching the substrate; measuring at least...
7297287 Method and apparatus for endpoint detection using partial least squares  
An apparatus and method for detection of a feature etch completion within an etching reactor. The method includes determining a correlation matrix by recording first measured data regarding a first...
7279114 Method for stabilizing etching performance  
The invention is directed to an etching method for patterning a first material layer over a second material layer to expose a portion of the second material layer. The etching method comprises...
7241397 Honeycomb optical window deposition shield and method for a plasma processing system  
An optical window deposition shield including a backing plate having a through hole, and a honeycomb structure having a plurality of adjacent cells configured to allow optical viewing through the...
7232526 Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing  
A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light...
7229566 Position detecting method and apparatus  
A two-dimensional image of an alignment mark 30 is acquired by an alignment scope 15 at step S 61 , and the two-dimensional image acquired at step S 61 is converted to a light-intensity signal...
7217371 Optical control interface between controller and process chamber  
The present invention relates to interfacing new sensors to incumbent controls. In particular, it relates to optically interfacing a new sensor, such as a spectrometer with plasma generator, to an...
7204934 Method for planarization etch with in-situ monitoring by interferometry prior to recess etch  
A method for processing recess etch operations in substrates is provided including forming a hard mask over the substrate and etching a trench in the substrate using the hard mask, and forming a...
7199053 Method for detecting end-point of chemical mechanical polishing process  
Disclosed is a method for detecting an end-point of a CMP process of a semiconductor device. More specifically, when all polishing processes are performed using a nitride film as a polishing...
7189332 Apparatus and method for detecting an endpoint in a vapor phase etch  
Processes for the removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the ability to accurately determine the...
7187523 Method of marking sintered body and method for manufacturing magnetic head wafer  
A method of marking a sintered body includes the step of preparing the sintered body by sintering a mixture of first and second types of powder particles. The first type of powder particles is made...
7182878 Methods for etch loading planar lightwave circuits  
This relates to optical devices such as planar light-wave components/circuits which are designed to have a high waveguide pattern density effecting a higher etch selectivity and overall improved...
7175875 Method and apparatus for plasma processing  
The apparatus for processing an in-process substrate by generating a plasma have a processing chamber with an observation window, in which the in-process substrate is disposed; plasma generating...
7169440 Method for removing photoresist and etch residues  
A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step...
7135123 Method and system for integrated circuit backside navigation  
The backside navigation method of the present invention includes milling a fiducial opening through the substrate of an integrated circuit. The milling process is stopped when the fiducial opening...
7118926 Method of optimizing seasoning recipe for etch process  
A method for optimizing a seasoning recipe for a dry etch process. The method includes setting a critical value of reproducibility, a main etch recipe, and a preliminary seasoning recipe. A test...
7115211 Endpoint detection using laser interferometry  
A method and system for determining an endpoint in a (near) real-time environment using statistical process control. By utilizing such control, an endpoint of a semiconductor process (e.g., an...
7112288 Methods for inspection sample preparation  
Methods are provided for delineating different layers and interfaces for inspection of a semiconductor wafer, wherein a sectioned portion of a wafer is subjected to a reactive ion etch process...
7105080 Vacuum treatment system and method of manufacturing same  
Method for manufacturing a workpiece by a vacuum treatment process includes providing a vacuum treatment system with first second parts in a vacuum chamber. Either a sensor or an adjusting element...
7094613 Method for controlling accuracy and repeatability of an etch process  
Embodiments of the invention generally relate to a method for etching in a processing platform (e.g. a cluster tool) wherein robust pre-etch and post-etch data may be obtained in-situ. The method...
7084051 Manufacturing method for semiconductor substrate and manufacturing method for semiconductor device  
A purpose of the invention is to provide a manufacturing method for a semiconductor substrate in which a high quality strained silicon channel can easily be formed without sacrificing the...
7077971 Methods for detecting the endpoint of a photoresist stripping process  
Methods for detecting the endpoint of a photoresist stripping process provide O for reaction with the photoresist for a wafer to be stripped of photoresist. NO is also supplied for reaction with O...
7074342 Method of manufacturing optical crystal element of laser  
A method of manufacturing an optical crystal element of a laser device includes measuring an initial thickness of a crystal substrate formed of YAG or YVO 4 ; introducing a mixture of a fluorine...
7049633 Method of measuring meso-scale structures on wafers  
A method of measuring at least one parameter associated with a portion of a sample having formed thereon one or more structures with at least two zones each having an associated zone reflectance...
7033518 Method and system for processing multi-layer films  
A method of etching multi-layer films, the method including: (1) etching a plurality of layers according to etching parameters, (2) determining a plurality of optical characteristics each...
7018553 Optical monitoring and control system and method for plasma reactors  
A method of adjusting plasma processing of a substrate in a plasma reactor having an electrode assembly. The method includes the steps of positioning the substrate in the plasma reactor, creating a...
7014787 Etching method of organic insulating film  
This invention relates to a method for etching an organic insulating film used in the production of semiconductor devices. A sample to be etched on which a low dielectric constant organic...
7005305 Signal layer for generating characteristic optical plasma emissions  
A technique is provided that may be used to improve optical endpoint detection in a plasma etch process. A semiconductor structure is manufactured that includes at least one electrical device. The...
7001530 Method for detecting the end point by using matrix  
A method for detecting the end point of plasma etching process by using matrix comprises a step of detecting a beginning matrix including emitting intensities and/or other plasma parameters of at...
7001529 Pre-endpoint techniques in photoresist etching  
A method for controlling a photoresist etch step in a plasma processing chamber is disclosed. The photoresist etch step being configured to etch back a photoresist layer deposited on a substrate...
6982175 End point detection in time division multiplexed etch processes  
An improved method for determining endpoint of a time division multiplexed process by monitoring an identified region of a spectral emission of the process at a characteristic process frequency....
6982043 Scatterometry with grating to observe resist removal rate during etch  
Disclosed are a system and method for monitoring a patterned photoresist clad-wafer structure undergoing an etch process. The system includes a semiconductor wafer structure comprising a substrate,...
6967109 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units  
A method and apparatus for measuring a potential difference for plasma processing with a plasma processing apparatus that processes a sample by introducing a gas into a vacuum chamber and generates...
6939811 Apparatus and method for controlling etch depth  
An apparatus and method for etching a feature in a wafer with improved depth control and reproducibility is described. The feature is etched at a first etching rate and then at a second etching...
6939433 Sample processing apparatus and sample processing system  
It is an object of the invention to provide a vacuum processing device and a vacuum processing system capable of improving the accuracy for the function of estimating the result of processing of...
6934032 Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process  
A system and methodology for monitoring and/or controlling a semiconductor fabrication process is disclosed. Scatterometry and/or ellipsometry based techniques can be employed to facilitate...
6911157 Plasma processing method and apparatus using dynamic sensing of a plasma environment  
At least one control parameter such as power supplied to a plasma, process pressure, gas flow rate, and radio frequency bias power to a wafer is changed for an extremely short time as compared with...
6908567 Contaminant removal by laser-accelerated fluid  
A method for removing a particle from a substrate includes forming a layer of a fluid on a surface of an optical element and positioning the optical element in proximity to a location of the...
Matches 1 - 50 out of 328 1 2 3 4 5 6 7 >