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7601270 |
Microfabricated elastomeric valve and pump systems
A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion...
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7531101 |
Method for eliminating punctual defects comprised in an electrochemical device
A method of eliminating, using a beam of laser radiation, defects lying within a laminate formed from at least a first substrate and from at least a second substrate. The laminate incorporates,...
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7527741 |
Microreactor including magnetic barrier
Means for enabling plating on sites of complex configuration, etching for fine complex pattern, etc. through reduction of the viscosity resistance brought about by walls of fine liquid channel of...
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7516549 |
Nozzle plate producing method
A method for producing a nozzle plate comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from a same side as a liquid droplet ejecting surface under an...
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7507346 |
Method for manufacturing electronic component, and electronic component
A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection...
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7502605 |
Sub-millimeter wavelength camera
The invention relates to an imaging device to be used with millimeter and/or sub-millimeter radiation comprising at least a pair of substrates, at least one of which is patterned on at least one...
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7470373 |
Optical interference display panel
An optical interference display panel is disclosed that has a substrate, an optical interference reflection structure, and an opaque protection structure. The optical interference reflection...
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7462292 |
Silicon carbide imprint stamp
A method of fabricating a silicon carbide imprint stamp is disclosed. A mold layer has a cavity formed therein. A spacer is formed in the cavity to reduce a first feature size of the cavity. A...
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7410590 |
Transferable micro spring structure
A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or...
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7402254 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed...
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7372145 |
Bonded assembly having improved adhesive bond strength
A bonded assembly is provided. The bonded assembly comprises: (a) a first substrate having a plurality of etched trenches defined in a first bonding surface; and (b) a second substrate having a...
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7346981 |
Method for fabricating microelectromechanical system (MEMS) devices
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate...
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7307020 |
Membrane 3D IC fabrication
General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and...
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7255768 |
Anodic bonding structure, fabricating method thereof, and method of manufacturing optical scanner using the same
Provided are an anodic bonding structure, a fabricating method thereof, and a method of manufacturing an optical scanner using the same. Provided anodic bonding structure having a substrate and a...
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7229564 |
Method for manufacturing bipolar plate and direct methanol fuel cell
A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes...
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7214326 |
Increased capacity leadframe and semiconductor package using the same
In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers...
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7186349 |
Fluid ejection device and method of fabricating the same
A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the...
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7159969 |
Composite ink jet printhead and relative manufacturing process
The composite printhead ( 1 ) is made up of an active module ( 7 ), consisting of a thin plate ( 8 ) of silicon, on which a plurality of chambers ( 14 ) is produced, housing corresponding heating...
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7157014 |
Method for producing a high resolution detector array
A method for producing a high resolution detector array so as to provide very high packing fraction, i.e. the distance between scintillator elements is minimized so the detector efficiency will be...
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7144517 |
Manufacturing method for leadframe and for semiconductor package using the leadframe
In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer,...
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7114541 |
Method for producing a 3-D micro flow cell and a 3-D micro flow cell
A 3D micro flow cell is fabricated by forming a first spacer on a substrate to define the flow channel of the cell extending between inlet and outlet openings. A second spacer, comprising a pasty...
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7083739 |
Transfer body and method using the same
There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting...
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RE39143 |
Method for making a wafer-pair having sealed chambers
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited...
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7041227 |
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials
A process for permitting defects or stresses in a structure to be revealed, including (a) securing by molecular bonding of a face of a first element containing crystalline material with a face of a...
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6993818 |
Multi-fixture assembly of cutting tools
Multiple cutting blades ( 56 ) are fabricated from a wafer ( 130 ). This wafer ( 130 ) is disposed on a blade handle mounting fixture ( 224 ) such that a blade handle ( 24 ) maybe mounted on each...
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6959490 |
Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head
Disclosed are a method f manufacturing a silicon device and a method of manufacturing a liquid jet head, which are capable of surely preventing damage of a piezoelectric element in manufacturing....
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6953530 |
Forming method of ink jet print head substrate and ink jet print head substrate, and manufacturing method of ink jet print head and ink jet print head
The invention provides a forming method of an ink jet print head substrate and an ink jet print head substrate, and a manufacturing method of an ink jet print head and an ink jet print head, in...
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6908565 |
Etch thinning techniques for wafer-to-wafer vertical stacks
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include etching away unsupported portions of a wafer to be thinned in the...
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6908561 |
Polymide-to-substrate adhesion promotion in HDI
Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of...
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6890445 |
Process for packaging electronic devices using thin bonding regions
In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity...
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6885887 |
Method of constructing a capacitor stack for a flat capacitor
In one aspect, a method of manufacturing a capacitor includes disposing one or more conductive layers of a first electrode stack in a recess of an alignment mechanism, where the recess is...
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6881644 |
Smoothing method for cleaved films made using a release layer
A method for treating a film of material, which can be defined on a substrate, e.g., silicon. The method includes providing a substrate comprising a cleaved surface, which had a porous silicon...
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6872319 |
Process for high yield fabrication of MEMS devices
A MEMS fabrication process eliminates through-wafer etching, minimizes the thickness of silicon device layers and the required etch times, provides exceptionally precise layer to layer alignment,...
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6810577 |
Method of manufacturing a dielectric waveguide
The present invention provides a method of efficiently manufacturing a dielectric waveguide with high reliability and precision. In the method, a resist material is formed on the outer surface of a...
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6808644 |
Capillary with glass internal surface
A process to form a capillary that is well insulated from its environment is described. Said process has two stages. The first stage, which is the same for both of the invention's two embodiments,...
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6806198 |
Gas-assisted etch with oxygen
Gas-assisted etching (GAE) for integrated circuit dies is enhanced via a method and system that enable halide-assisted etching of dies having copper material. According to an example embodiment of...
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6796019 |
Process for making a heater chip module
A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at...
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6793829 |
Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is...
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6736983 |
Method for producing microcomponents
Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The...
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6723251 |
Method for planarizing circuit board and method for manufacturing semiconductor device
A method for planarizing a circuit board, has a step of fixing a circuit board having wiring layers on both sides to a board having a flat surface through an adhesive layer, wherein said circuit...
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6706204 |
Method of fabricating and a device that includes nanosize pores having well controlled geometries
A method of fabricating nanosized holes with controlled geometries employs tools and methods developed in the microelectronics industry. The method exploits the fact that epitaxially grown film...
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6706203 |
Adjustable nanopore, nanotome, and nanotweezer
An adjustable nanopore is fabricated by placing the surfaces of two planar substrates in contact, wherein each substrate contains a hole having sharp corners and edges. A corner is brought into...
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6668445 |
Method of increasing tab bond strength using reactive ion etching
A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of...
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6656368 |
Nonstick layer for a micromechanical component
A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer...
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6625874 |
Method of making a thermal bend actuator
A method of forming a thermal bend actuator ( 6 ) is provided with upper arms ( 23, 25, 26 ) and lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23,...
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6624077 |
Integrated circuit waveguide
A method for forming an optical waveguide includes depositing a cladding material on a first substrate, forming a trench in the cladding material on the first substrate, and filling the trench with...
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6616854 |
Method of bonding and transferring a material to form a semiconductor device
A donor substrate ( 12 ) which is patterned to include a donor mesa ( 18 ) is bonded to a receiving substrate ( 20 ). In a one embodiment, a bulk portion of the donor substrate is removed while...
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6602431 |
Enhancements in sheet processing and lead formation
A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying...
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6599436 |
Formation of interconnections to microfluidic devices
A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical...
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6596183 |
Cutting-free method for making a hologram sticker and the structure of the sticker
A cutting-free method for making a hologram sticker includes the steps of adding a releasing layer on a base; plating a metal layer on the releasing layer; printing an epoxy layer with a...
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