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7622048 |
Sacrificial substrate for etching
A method of etching a silicon substrate is described. The method includes bonding a first silicon substrate to a sacrificial silicon substrate. The first silicon substrate is etched. A pressure is...
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7588657 |
Pattern-free method of making line gratings
In accordance with the invention, substrate-supported linear arrays are formed by the steps of adhering a thin layer of polymer between a pair of substrates and separating the substrates...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7534361 |
Methods for making laminated member for circuit board, making circuit board and laminating flexible film
The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a...
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7516545 |
Method of manufacturing printed circuit board having landless via hole
Disclosed is a method of manufacturing a printed circuit board having a landless via hole. Specifically, this invention provides a method of manufacturing a printed circuit board having a landless...
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7511375 |
Semiconductor device carrier unit and semiconductor socket provided therewith
In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
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7501035 |
Method of manufacturing replica diffraction grating
A method of manufacturing a replica diffraction grating includes the steps of: forming a metal thin film on a grating surface of a master diffraction grating, adhering a replica substrate to the...
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7479455 |
Method for manufacturing semiconductor wafer
A method may involve mounting a first supporting plate on an active surface of a wafer using an adhesive. A portion of the back surface of the wafer may be backlapped. A second supporting plate may...
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7476328 |
Method of manufacturing printed circuit board
A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth...
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7413670 |
Method for forming wiring on a substrate
A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate...
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7402254 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed...
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7361284 |
Method for wafer-level package
A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and...
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7297285 |
Manufacturing process of emboss type flexible or rigid printed circuit board
A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is...
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7229564 |
Method for manufacturing bipolar plate and direct methanol fuel cell
A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes...
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7217370 |
Wiring board and process for producing the same
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a...
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7214282 |
Electromagnetic-wave shielding and light transmitting plate, manufacturing method thereof and display panel
An electromagnetic-wave shielding and light transmitting plate 1 having an antireflection film 3 , an electromagnetic-wave shielding film 10 , a transparent substrate 2 , and a near-infrared...
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7128844 |
Metal/ceramic circuit board and method for producing same
A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10 , and a resist 14 having a predetermined shape is formed on the metal layer 12 ....
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7077969 |
Miniature microdevice package and process for making thereof
The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group...
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7048867 |
Method of increasing the area of a useful layer of material transferred onto a support
The invention relates to a method of increasing the area of a useful layer of material coming from a source substrate and which is effectively transferred onto a support substrate. The dimensions...
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7041227 |
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials
A process for permitting defects or stresses in a structure to be revealed, including (a) securing by molecular bonding of a face of a first element containing crystalline material with a face of a...
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6969471 |
Process for manufacturing printed circuit boards with protected spaces between tracks
It comprises the steps of: a) arranging a dielectric substrate ( 1 ) with at least one conducting plate ( 2 ) joined by an adhesive ( 8 ) to at least one of its sides; b) removing areas of said...
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6908565 |
Etch thinning techniques for wafer-to-wafer vertical stacks
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include etching away unsupported portions of a wafer to be thinned in the...
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6908561 |
Polymide-to-substrate adhesion promotion in HDI
Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of...
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6904674 |
Process for manufacturing a printed wiring board
A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner...
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6890445 |
Process for packaging electronic devices using thin bonding regions
In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity...
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6858151 |
Metal/ceramic bonding article and method for producing same
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least...
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6750148 |
Method of manufacturing wireless suspension blank
A method of manufacturing a wireless suspension blank wherein three-layered laminate formed of a metallic layer having a spring property and a conductive layer laminated on the metallic layer...
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6729023 |
Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having...
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6706564 |
Method for fabricating semiconductor package and semiconductor package
A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a...
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6645389 |
Method of demetallizing a web in an etchant bath and web suitable therefor
A variety of etching bath-based demetallizing processes for making various products involve immersing a web of metal-containing material in a bath of aqueous etchant. The metal-containing material...
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6638438 |
Printed circuit board micro hole processing method
A PC board micro hole processing method using plasma technique to etch the substrate of the PC board, and then using chemical etching technique to remove residual material such as glass fibers.
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6613241 |
MEMS elements with integrated porous membranes and method of making the same
The invention is a method of introducing porous membranes into MEMS elements by supporting the membranes by frames to form an heterostructure. This is achieved by attaching to a structured or...
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6608250 |
Enhanced interface thermoelectric coolers using etched thermoelectric material tips
A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes an electrical conductor thermally coupled to a cold plate and a thermoelement...
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6585905 |
Leadless plastic chip carrier with partial etch die attach pad
A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad....
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6582616 |
Method for preparing ball grid array board
Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a...
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6579565 |
Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof
A multilayered circuit board is produced by: a. laminating a copper foil conductor layer and a nickel foil or nickel plating etch-stopping layer by simultaneously press-bonding the nickel and...
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6572781 |
Microelectronic packaging methods and components
A sheet including lead regions with conductors and a main region surrounding the lead regions is formed on the front surface of a microelectronic element such as a wafer, or assembled thereto, so...
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6572780 |
Methods for fabricating flexible circuit structures
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a...
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6533950 |
Non-homogeneous laminate material for suspension with flexure motion limiter
An integrated lead suspension is formed from a laminate of three materials in a variety of configurations having from three to five layers. The materials are stainless steel, polyimide and copper....
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6521139 |
Composition for circuit board manufacture
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer are disclosed. The composition includes hydrogen peroxide,...
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6500350 |
Formation of thin film resistors
A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a...
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6500349 |
Manufacture of printed circuits using single layer processing techniques
A continuous process for forming multilayer circuit structures which includes applying and curing a film forming polymer onto the matte side of a copper foil. The opposite (shiny) side of the foil...
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6475703 |
Method for constructing multilayer circuit boards having air bridges
A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to...
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6475629 |
Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device
Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified...
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6475401 |
Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process
The invention pertains to a new type of process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process.
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6468439 |
Etching of metallic composite articles
A process for the etching of multiple layers of at least two different metals comprisies: forming a resist pattern over a first layer of metal, said resist pattern having a pattern of openings...
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6454878 |
Cladded material construction for etched-tri-metal circuits
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation...
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6426011 |
Method of making a printed circuit board
A method of making a printed circuit board whereby a fine wiring pattern can be formed. A through hole is formed in a substrate, both surfaces of the substrate being covered with copper foil. The...
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6417108 |
Semiconductor substrate and method of manufacturing the same
A method of manufacturing a semiconductor substrate can effectively prevent a chipping phenomenon and the production of debris from occurring in part of the insulation layer and the semiconductor...
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6383254 |
Treatment solution and treatment method for reducing copper oxides
There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the...
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