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7615164 |
Plasma etching methods and contact opening forming methods
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
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7547570 |
Method for forming thin film photovoltaic interconnects using self-aligned process
Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that...
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7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
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7540969 |
High thermal conducting circuit substrate and manufacturing process thereof
A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching...
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7534361 |
Methods for making laminated member for circuit board, making circuit board and laminating flexible film
The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a...
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7531100 |
Method of making a fuel cell component using an easily removed mask
A method of making a fuel cell component using a mask, which is removed after further processing to yield a surface with variable properties.
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7524429 |
Method of manufacturing double-sided printed circuit board
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad...
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7523539 |
Method of manufacturing a probe
In a probe manufacturing method, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without damaging the probe. A...
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7517805 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method of in-situ ash strip to eliminate memory effect and reduce wafer damage
An in-situ ashing method for stripping a photoresist layer following a fluorocarbon based etch that transfers a pattern through a dielectric layer is disclosed. The method is especially effective...
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7511375 |
Semiconductor device carrier unit and semiconductor socket provided therewith
In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
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7507346 |
Method for manufacturing electronic component, and electronic component
A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection...
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7476328 |
Method of manufacturing printed circuit board
A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth...
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7442318 |
Method of making thermal print head
A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor...
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7434311 |
Printed wiring board manufacturing method
This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both...
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7431860 |
Etching process
A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the...
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7407595 |
Optical member, manufacturing method of the optical member, waveguide substrate, and photo-electric integrated substrate
A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by...
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7404908 |
Printed wiring board manufacturing method
According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and...
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7403095 |
Thin film resistor structure and method of fabricating a thin film resistor structure
A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is...
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7402529 |
Method of applying cladding material on conductive lines of MRAM devices
A method of fabricating a cladding region for use in MRAM devices includes the formation of a conductive bit line proximate to a magnetoresistive memory device. The conductive bit line is immersed...
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7371452 |
Conductive patterned sheet utilizing multi-layered conductive conduit channels
Disclosed is an article comprising a polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material...
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7361605 |
System and method for removal of photoresist and residues following contact etch with a stop layer present
In processing an integrated circuit structure including a contact arrangement that is initially covered by a stop layer, a first plasma is used to etch to form openings through an overall...
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7358184 |
Method of forming a conductive via plug
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive...
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7356923 |
Rigid flex interconnect via
A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7347951 |
Method of manufacturing electronic device
A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the...
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7320173 |
Method for interconnecting multi-layer printed circuit board
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer,...
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7316783 |
Method of wiring formation and method for manufacturing electronic components
A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film...
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7300882 |
Etching method and semiconductor device fabricating method
An etching method for plasma-etching a low-k film, wherein the plasma etching is conducted under an etching gas atmosphere including a fluorocarbon gas, O 2 gas and Ar gas, and under the...
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7297285 |
Manufacturing process of emboss type flexible or rigid printed circuit board
A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is...
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7287325 |
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing
Disclosed are a damascene and dual damascene processes both of which incorporate the use of a release layer to remove trace amounts of residual material between metal interconnect lines. The...
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7285229 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the...
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7279428 |
Method of preventing photoresist residues
A method to prevent photoresist residues formed in an aperture is provided. The method includes using a halogen-containing plasma treatment before the aperture is filled with a photoresist. Due to...
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7261829 |
Method for masking a recess in a structure having a high aspect ratio
A method for selective masking is described. In this case, a filling material is applied to a structure which, as a function of the aspect ratio of the structure, forms cavities when the aspect...
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7256136 |
Self-patterning of photo-active dielectric materials for interconnect isolation
In accordance with the objectives of the invention a new method is provided for the creation of an interconnect pattern. The invention provides for a layer of Photo-Active Dielectric (PAD) to be...
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7255803 |
Method of forming contact openings
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
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7255801 |
Deep submicron CMOS compatible suspending inductor
A new method is provided for the creation of an inductor. Layers of pad oxide, a thick layer of dielectric and an etch stop layer are successively created over the surface of a substrate. The...
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7250370 |
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
A method of lowering the dielectric constant of an organosilicon low k dielectric layer while improving the hardness and thermal stability is provided. A deposited layer of carbon doped oxide, HSQ,...
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7217883 |
Manufacturing a solar cell with backside contacts
A solar cell involving a silicon wafer having a basic doping, a light-receiving front side and a backside, which is provided with an interdigital semiconductor pattern, which interdigital...
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7217370 |
Wiring board and process for producing the same
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a...
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7192531 |
In-situ plug fill
A method for forming damascene features in a dielectric layer over a barrier layer over a substrate is provided. A plurality of vias are etched in the dielectric layer to the barrier layer with a...
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7189435 |
Nanofabrication
Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is...
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7185429 |
Manufacture method of a flexible multilayer wiring board
A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is...
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7155819 |
System for making a conductive circuit on a substantially non-conductive substrate
A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and...
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7138170 |
Terminated conductive patterned sheet utilizing conductive conduits
Disclosed is an article comprising a polymer sheet containing a plurality of integral polymer conduit channels containing a transparent conductive material in which two or more such channels...
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7138064 |
Semiconductor device and method of manufacturing the same
The present invention relates to a method of manufacturing a semiconductor device. In the method, an etching-back layer consisting of aluminum or copper is formed on a base substrate and a...
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7135119 |
Method for making a multilayer module with high-density printed circuits
The invention concerns a method for making a multilayer module with high-density printed circuits, which consists in: preparing a substrate ( 1 ) with double-sided printed circuits ( 3 ) whereon is...
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7122131 |
Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same
The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the...
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7112286 |
Thin film resistor structure and method of fabricating a thin film resistor structure
A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is...
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7112285 |
Conductive core substrate fabrication
Methods are provided for fabricating plated through hole conductive core substrate which eliminate the secondary step of producing a through hole in the dielectric material plugging the core...
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7101502 |
Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings...
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