|
Match
|
Document |
Document Title |
|
|
8173033 |
Manufacturing method of a nano filter structure for breathing
In a nano filter structure for breathing and a manufacturing method of the nano filter structure, a semiconductor process technology is used for manufacturing a nano filter structure comprising a...
|
|
|
8166635 |
Manufacturing method of electrode, electric storage device, and intermediate laminate member
In a current collector laminating step, a current-collector laminate unit 30 composed of current-collector materials 31 and 32 and a film material 33 is formed. Resist layers 34 having a...
|
|
|
8158521 |
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
A method of lowering the dielectric constant of an organosilicon low k dielectric layer while improving the hardness and thermal stability is provided. A deposited layer of carbon doped oxide, HSQ,...
|
|
|
8156645 |
Method of manufacturing a multilayer printed wiring board with copper wrap plated hole
Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to...
|
|
|
8128993 |
Anisotropic nanotube fabric layers and films and methods of forming same
Methods for forming anisotropic nanotube fabrics are disclosed. In one aspect, a nanotube application solution is rendered into a nematic state prior to its application over a substrate. In another...
|
|
|
8123965 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic...
|
|
|
8123966 |
Piezoelectric electronic component, process for producing the same, and communication apparatus
A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to...
|
|
|
8123967 |
Method of producing an article having patterned decorative coating
A method for producing an article having a decorative coating includes depositing at least a first coating layer onto at least a portion of a substrate using a physical or chemical vapor deposition...
|
|
|
8075788 |
Fabrication method of printed circuit board and printed circuit board machining apparatus
A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist...
|
|
|
8062539 |
Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same
A method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy...
|
|
|
8062734 |
Article comprising conductive conduit channels
Disclosed is an article comprising a layer of nonconductive polymeric material comprising a plurality of integral polymer conduit channels containing a substantially transparent conductive material.
|
|
|
8052881 |
Method of manufacturing multilayer printed circuit board having buried holes
A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive...
|
|
|
8052882 |
Method of manufacturing wiring substrate
A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is...
|
|
|
8043519 |
Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a...
|
|
|
7972460 |
Method of manufacturing printed circuit board
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a...
|
|
|
7972521 |
Method of making reliable wafer level chip scale package semiconductor devices
The present invention relates to a method of making a robust wafer level chip scale package and, in particular, a method that prevents cracking of the passivation layer during solder flow and...
|
|
|
7954234 |
Method of manufacturing a wiring board
In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the...
|
|
|
7931818 |
Process of embedded circuit structure
A process of an embedded circuit structure is provided. A complex metal layer, a prepreg, a supporting board, another prepreg and another complex metal layer are laminated together, wherein each of...
|
|
|
7927499 |
Substrate having blind hole and method for forming blind hole
A substrate having a blind hole and a method for forming the blind hole. The method includes: (a) providing a substrate having a lower dielectric layer, a copper layer, and an upper dielectric...
|
|
|
7921799 |
Pattern forming apparatus and manufacturing apparatus using the same
A pattern forming apparatus comprises a surface treatment system and an ink jet system 14, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a...
|
|
|
7922919 |
Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points
Various embodiments of the present invention are directed to crossbar array designs that interfaces wires to address wires, despite misalignments between electrical components and wires. In one...
|
|
|
7922918 |
Method of manufacturing circuit board used for switch device
There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life...
|
|
|
7910910 |
Phase-change memory cell and method of fabricating the phase-change memory cell
A memory cell (and method of fabricating the memory cell) includes a stencil layer having a first opening, a phase-change material layer formed on a first electrode layer, and an electrically...
|
|
|
7910010 |
Ink jet head having an electrostatic actuator and manufacturing method of the same
An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a...
|
|
|
7892441 |
Method and apparatus to change solder pad size using a differential pad plating
A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper...
|
|
|
7867405 |
Process for producing microfluidic arrangements from a plate-shaped composite structure
A process for producing a multiplicity of microfluidic arrangements from a plate-shaped composite structure and an atomiser which is provided with such nozzle arrangements is proposed. Each...
|
|
|
7849581 |
Nanopore electrode, nanopore membrane, methods of preparation and surface modification, and use thereof
Provided are fabrication, characterization and application of a nanodisk electrode, a nanopore electrode and a nanopore membrane. These three nanostructures share common fabrication steps. In one...
|
|
|
7836590 |
Manufacturing method for printed circuit board
A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on...
|
|
|
7820363 |
Process for forming a solder mask, apparatus thereof and process for forming electric-circuit patterned internal dielectric layer
In a process for forming a solder mask, a photoimageable ink is coated on a carrier film to form a photoimageable ink layer on the carrier film. The photoimageable ink layer is dried to form a...
|
|
|
7802361 |
Method for manufacturing the BGA package board
Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is...
|
|
|
7802360 |
Methods for filling holes in printed wiring boards
The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the...
|
|
|
7799604 |
Semiconductor device having multilayer printed wiring board and manufacturing method of the same
A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support...
|
|
|
7795147 |
Semiconductor storage device and method for fabricating the same
The semiconductor storage device comprises memory cell transistors formed on a semiconductor substrate 10; first insulation films 42 covering the top surfaces and the side surfaces of gate...
|
|
|
7718347 |
Method for making an improved thin film solar cell interconnect using etch and deposition process
The present invention provides a method of forming interconnects in a photovoltaic module. According to one aspect, a method according to the invention includes processing steps that are similar to...
|
|
|
7718078 |
Manufacturing method of circuit board
A manufacturing method of a circuit board is provided. Firstly, a substrate board having a plurality of through holes is provided. Next, a first metal layer is electro-less plated on the surface of...
|
|
|
7704548 |
Method for manufacturing wiring board
A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and...
|
|
|
7696005 |
Method for manufacturing an electronic module in an installation base
This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1)...
|
|
|
7691275 |
Use of step and flash imprint lithography for direct imprinting of dielectric materials for dual damascene processing
In some embodiments, the present invention is directed to methods that involve the combination of step-and-flash imprint lithography (SFIL) with a multi-tier template to simultaneously pattern...
|
|
|
7674390 |
Zeolite—sol gel nano-composite low k dielectric
A method for forming a sol gel-zeolite composite dielectric material is herein described. Zeolite particles may be dispersed in a sol creating a liquid sol-zeolite colloid. The liquid sol-zeolite...
|
|
|
7666320 |
Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor
There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly...
|
|
|
7615164 |
Plasma etching methods and contact opening forming methods
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
|
|
|
7547570 |
Method for forming thin film photovoltaic interconnects using self-aligned process
Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that...
|
|
|
7543375 |
Process for filling via hole in a substrate
A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via...
|
|
|
7540969 |
High thermal conducting circuit substrate and manufacturing process thereof
A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching...
|
|
|
7534361 |
Methods for making laminated member for circuit board, making circuit board and laminating flexible film
The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a...
|
|
|
7531100 |
Method of making a fuel cell component using an easily removed mask
A method of making a fuel cell component using a mask, which is removed after further processing to yield a surface with variable properties.
|
|
|
7524429 |
Method of manufacturing double-sided printed circuit board
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad...
|
|
|
7523539 |
Method of manufacturing a probe
In a probe manufacturing method, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without damaging the probe. A...
|
|
|
7517805 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method of in-situ ash strip to eliminate memory effect and reduce wafer damage
An in-situ ashing method for stripping a photoresist layer following a fluorocarbon based etch that transfers a pattern through a dielectric layer is disclosed. The method is especially effective...
|
|
|
7511375 |
Semiconductor device carrier unit and semiconductor socket provided therewith
In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
|