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7618898 |
Method and apparatus for forming contact hole
A method of forming a contact hole in an insulating film coating amorphous Si having an irregular surface formed on an insulating substrate, for connecting the amorphous Si to a conductor film...
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7618895 |
Method for etching doughnut-type glass substrates
A method for etching doughnut-type glass substrates, which comprises laminating a plurality of doughnut-type glass substrates each having a circular hole at its center so that the circular holes...
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7615164 |
Plasma etching methods and contact opening forming methods
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
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7615162 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7612484 |
High-deformation composite microresonator
An electromechanical resonator including a vibrating body, at least one excitation electrode, and at least one detection electrode. The vibrating body includes a first part made of a first material...
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7608196 |
Method of forming high aspect ratio apertures
A plasma etch process for etching a dielectric material employing two primary etchants at low flows and pressures, and a relatively low temperature environment within the etch chamber. The two...
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7585421 |
Method of producing a sheet comprising through pores and the application thereof in the production of micronic and submicronic filters
The method comprises the following steps:
preparing a sheet having thickness of 5 μm to a few tens of micrometers, suitable for being etched by a lithographic operation; making a mask on a...
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7585419 |
Substrate structure and the fabrication method thereof
A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the...
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7544304 |
Process and system for quality management and analysis of via drilling
A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in...
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7541286 |
Method for manufacturing semiconductor device using KrF light source
A semiconductor device manufacturing method using a KrF light source is disclosed. Embodiments relate to a method for manufacturing a semiconductor device including forming an oxide film over a...
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7540969 |
High thermal conducting circuit substrate and manufacturing process thereof
A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching...
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7540968 |
Micro movable device and method of making the same using wet etching
A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base...
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7534361 |
Methods for making laminated member for circuit board, making circuit board and laminating flexible film
The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a...
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7531100 |
Method of making a fuel cell component using an easily removed mask
A method of making a fuel cell component using a mask, which is removed after further processing to yield a surface with variable properties.
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7524429 |
Method of manufacturing double-sided printed circuit board
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad...
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7497960 |
Method for manufacturing a filter
A method for manufacturing a filter is provided which can easily manufacture the filter that has both excellent anti-corrosion properties and anti-abrasion properties. In the method, a first...
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7497959 |
Methods and structures for protecting one area while processing another area on a chip
Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased...
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7488428 |
Method for forming stacked via-holes in printed circuit boards
A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a...
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7442318 |
Method of making thermal print head
A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor...
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7431860 |
Etching process
A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the...
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7429335 |
Substrate passage formation
A method for forming an opening through a substrate includes removing a first portion of a first face of a substrate to form a first recessed surface oblique to the first face and removing a second...
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7422696 |
Multicomponent nanorods
Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the...
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7407596 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit...
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7407595 |
Optical member, manufacturing method of the optical member, waveguide substrate, and photo-electric integrated substrate
A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by...
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7403095 |
Thin film resistor structure and method of fabricating a thin film resistor structure
A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is...
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7399423 |
Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a...
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7396475 |
Method of forming stepped structures employing imprint lithography
The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the...
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7393457 |
Method for making a shadow mask for an opposed discharge plasma display panel
The present invention is to provide a method for making a shadow mask for an opposed discharge plasma display panel by etching one lateral surface of a metal slab to produce a plurality of parallel...
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7390422 |
Method for manufacturing printing plate
A method for manufacturing a printing plate is realizes a precise and fine pattern by minimizing a variation of etching critical dimension. The method includes forming a hard mask having an opening...
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7387740 |
Method of manufacturing metal cover with blind holes therein
An exemplary method of manufacturing a metal cover ( 1 ) with blind holes ( 3 ) therein includes: step ( 60 ), preparing a metal substrate; step ( 62 ), covering the metal substrate with a...
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7387739 |
Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
A plurality of penetrating holes are formed in a substrate, each of the penetrating holes connecting a first opening and a second opening larger than the first opening. An etching resistant film is...
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7361284 |
Method for wafer-level package
A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and...
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7358184 |
Method of forming a conductive via plug
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive...
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7323111 |
Angle control of multi-cavity molded components for MEMS and NEMS group assembly
A method of making a mold includes forming spaced mold cavities in a mold body. The mold cavities include geometrically similar portions, but have respective depths below an initial reference...
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7309641 |
Method for rounding bottom corners of trench and shallow trench isolation process
A method for rounding the bottom corners of a trench is described. In the method, an etching process is performed using a fluorocarbon compound with at least two carbon atoms, He and O 2 as an...
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7303648 |
Via etch process
Systems and techniques relating to etching vias in integrated circuit devices, in one implementation, include: providing a dielectric material and a conductive material, removing a first portion of...
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7297285 |
Manufacturing process of emboss type flexible or rigid printed circuit board
A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is...
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7279110 |
Method and apparatus for creating a phase step in mirrors used in spatial light modulator arrays
A method and apparatus for patterning an array of SLM mirrors with a phase step is disclosed. Additional embodiments of the present invention describe a method for processing a substrate, wherein...
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7261829 |
Method for masking a recess in a structure having a high aspect ratio
A method for selective masking is described. In this case, a filling material is applied to a structure which, as a function of the aspect ratio of the structure, forms cavities when the aspect...
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7257892 |
Method of manufacturing wiring board
A method of manufacturing a wiring board, including: providing a resin substrate on which is formed a metal layer including a first layer and a second layer formed on the first layer; forming an...
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7256136 |
Self-patterning of photo-active dielectric materials for interconnect isolation
In accordance with the objectives of the invention a new method is provided for the creation of an interconnect pattern. The invention provides for a layer of Photo-Active Dielectric (PAD) to be...
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7255803 |
Method of forming contact openings
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
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7255801 |
Deep submicron CMOS compatible suspending inductor
A new method is provided for the creation of an inductor. Layers of pad oxide, a thick layer of dielectric and an etch stop layer are successively created over the surface of a substrate. The...
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7253705 |
Air-gap type thin-film bulk acoustic resonator and fabrication method therefor
An air-gap type thin-film bulk acoustic resonator. The air-gap type thin-film bulk acoustic resonator has a substrate having a cavity formed on a predetermined portion of an upper surface thereof;...
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7250831 |
Filter comprising inductor, duplexer using the filter and fabricating methods thereof
A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected...
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7250370 |
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
A method of lowering the dielectric constant of an organosilicon low k dielectric layer while improving the hardness and thermal stability is provided. A deposited layer of carbon doped oxide, HSQ,...
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7235185 |
Method of protecting wafer front pattern and method of performing double-sided process
A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity...
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7217883 |
Manufacturing a solar cell with backside contacts
A solar cell involving a silicon wafer having a basic doping, a light-receiving front side and a backside, which is provided with an interdigital semiconductor pattern, which interdigital...
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7217370 |
Wiring board and process for producing the same
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a...
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7204933 |
Method of forming pillars in a fully integrated thermal inkjet printhead
Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of...
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