AcclaimIP-ad

Match Document Document Title
9031684 Multi-factor advanced process control method and system for integrated circuit fabrication  
A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the...
9017563 Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid  
Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method...
9012130 Method of fabricating capacitive touch panel  
The present disclosure relates to a method of fabricating a capacitive touch pane where a plurality of groups of first conductive patterns are formed along a first direction, a plurality of groups...
8999179 Conductive vias in a substrate  
A method of forming a conductive via in a substrate includes forming a via hole covered by a dielectric layer followed by an annealing process. The dielectric layer can getter the mobile ions from...
8986980 Fabricate self-formed nanometer pore array at wafer scale for DNA sequencing  
A technique is provided for a structure. A substrate has a nanopillar vertically positioned on the substrate. A bottom layer is formed beneath the substrate. A top layer is formed on top of the...
8986554 Method of forming patterns  
A method of forming patterns includes forming a photoresist film on a substrate. The photoresist film is exposed with a first dose of light to form a first area and a second area in the...
8980676 Fabrication of window cavity cap structures in wafer level packaging  
A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a...
8974678 Methods using block co-polymer self-assembly for sub-lithographic patterning  
Block copolymers can be self-assembled and used in methods as described herein for sub-lithographic patterning, for example. The block copolymers can be diblock copolymers, triblock copolymers,...
8970242 Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe  
Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality...
8968583 Cleaning process for microelectronic dielectric and metal structures  
A method for cleaning a dielectric and metal structure within a microelectronic structure uses an oxygen containing plasma treatment, followed by an alcohol treatment, in turn followed by an...
8961760 Micromechanical solid-electrolyte sensor device and corresponding production method  
A micromechanical solid-electrolyte sensor device includes a micromechanical carrier substrate having a front side and a back side. The micromechanical solid-electrolyte sensor device also...
8945404 Self-formed nanometer channel at wafer scale  
A mechanism is provided for fabricating nanochannels for a nanodevice. Insulating film is deposited on a substrate. A nanowire is patterned on the film. Insulating material is deposited on the...
8926848 Through hole forming method  
Provided are a method of forming a through hole, which can inhibit misalignment between central axes of holes in both surfaces of a substrate, which is free from metal contamination, and which...
8920662 Nozzle plate manufacturing method, nozzle plate, droplet discharge head manufacturing method, droplet discharge head, and printer  
A nozzle plate manufacturing method that offers excellent protection against discharge liquid and that enables a nozzle plate having high nozzle-hole accuracy to be manufactured with good yield....
8901007 Addition of carboxyl groups plasma during etching for interconnect reliability enhancement  
The present disclosure is directed to a method of manufacturing a semiconductor structure in which a low-k dielectric layer is formed over a semiconductor substrate. Features can be formed...
8894868 Substrate containing aperture and methods of forming the same  
A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a...
8884516 Traveling wave electron device with membrane-supported slow wave circuit  
A traveling wave device includes a slow wave circuit supported by a dielectric membrane. The dielectric membrane can have a thickness substantially smaller than a wavelength of operation of the...
8877071 Angle control of multi-cavity molded components for MEMS and NEMS group assembly  
A method of making a mold includes forming spaced mold cavities in a mold body. The mold cavities include geometrically similar portions, but have respective depths below an initial reference...
8872040 Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof  
A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a...
8865009 Processes for producing substrate with piercing aperture, substrate for liquid ejection head and liquid ejection head  
The invention provides a process for producing a substrate with a piercing aperture, the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a...
8858810 Method of producing a suspension board with circuit  
A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a...
8845909 Process of fabricating heat dissipation substrate  
A process of fabricating a heat dissipation substrate is provided. A metal substrate having an upper surface, a lower surface, first recesses located on the upper surface and second recesses...
8834728 Method and system for providing an energy assisted magnetic recording writer having a self aligned heat sink and NFT  
A method provides an EAMR transducer. The EAMR transducer is coupled with a laser and has an ABS configured to reside in proximity to a media during use. The method includes providing an NFT using...
8828247 Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same  
Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at...
8828246 Method of fabricating micro-devices  
A new and novel method utilizing current nano-technological processes for fabricating a range of micro-devices with significantly expanded capabilities, unique functionalities at microscopic...
8828152 Passivated metal core substrate and process for preparing the same  
A substrate includes an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, a chromium conversion coating on at least a portion of the core, and an insulating coating on the chromium...
8808554 Method for making thermionic electron emission device  
A method for making a thermionic electron emission device. The method includes the following steps. First, an insulating substrate is provided. Second, a number of lattices are formed on the...
8790865 Method of fabricating capacitive touch panel  
The present disclosure relates to a method of fabricating a capacitive touch pane where a plurality of groups of first conductive patterns are formed along a first direction, a plurality of groups...
8790522 Chemical and physical templates for forming patterns using directed self-assembly materials  
A method includes forming a chemical guide layer above a process layer. A template having a plurality of elements is formed above the process layer. The chemical guide layer is disposed on at...
8785291 Post-gate shallow trench isolation structure formation  
Doped wells, gate stacks, and embedded source and drain regions are formed on, or in, a semiconductor substrate, followed by formation of shallow trenches in the semiconductor substrate. The...
8784673 Highly organized single-walled carbon nanotube networks and method of making using template guided fluidic assembly  
Methods for fabricating templates for nanoelement assembly and methods for fluid-guided assembly of nanoelements are provided. Templates are fabricated by plasma modification of surface...
8778197 Graphene windows, methods for making same, and devices containing same  
The present invention relates to graphene windows and methods for making same. One method comprises selecting a high purity metal foil, growing a layer of graphene on a first face of the metal...
8771528 Through-hole forming method and inkjet head  
A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the...
8768114 Opto-electric hybrid board and method of manufacturing same  
An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided....
8764996 Methods of patterning a material on polymeric substrates  
A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a...
8756804 Method of manufacturing printed circuit board  
Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a...
8747682 Pattern formation method and method for manufacturing semiconductor device  
According to one embodiment, a pattern formation method is disclosed. The method includes forming a plurality of regions on a foundation and the plurality of the regions correspond to different...
8742468 Systems, methods and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet  
Systems, methods and apparatus are provided through which in some embodiments a mass spectrometer micro-leak includes a number of channels fabricated by semiconductor processing tools and that...
8734659 Process for structuring silicon  
A process for etching a silicon-containing substrate to form structures is provided. In the process, a metal is deposited and patterned onto a silicon-containing substrate (commonly one with a...
8715514 Micro-electromechanical systems (MEMS) microphone and method of manufacturing the same  
Provided are a micro-electromechanical systems (MEMS) microphone and a method of manufacturing the same. A manufacturing process is simplified compared to a conventional art using both upper and...
8709266 Method of manufacturing substrate for liquid discharge head  
A method of manufacturing a substrate for a liquid discharge head having a supply port passing through a silicon substrate provided with an energy-generating element generating the energy used to...
8696917 Analyte sensor and fabrication methods  
Methods for fabricating analyte sensor components using IC- or MEMs-based fabrication techniques and sensors prepared therefrom. Fabrication of the analyte sensor component comprises providing an...
8668834 Protecting a mold having a substantially planar surface provided with a plurality of mold cavities  
A method of protecting a mold having at least one substantially planar surface provided with a plurality of mold cavities includes inserting a plurality of mandrels into respective ones of the...
8668833 Method of forming a nanostructure  
A method of forming a discrete nanostructured element at one or more predetermined locations on a substrate is presented. The method includes forming a mask member over the substrate. A window is...
8667675 Simultaneous and selective partitioning of via structures using plating resist  
Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via...
8668835 Method of etching self-aligned vias and trenches in a multi-layer film stack  
A multi-step etch process wherein elliptical via openings and trench openings are formed in a dielectric layer includes supporting a multi-layer film stack on a temperature controlled...
8652337 Self-formed nanometer channel at wafer scale  
A mechanism is provided for fabricating nanochannels for a nanodevice. Insulating film is deposited on a substrate. A nanowire is patterned on the film. Insulating material is deposited on the...
8647517 Producing method of suspension board with circuit  
A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal...
8641914 Methods of improving long range order in self-assembly of block copolymer films with ionic liquids  
Methods for fabricating arrays of nanoscaled alternating lamellae or cylinders in a polymer matrix having improved long range order utilizing self-assembling block copolymers, and films and...
8641913 Fine pitch microcontacts and method for forming thereof  
A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with...