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6099745 Rigid/flex printed circuit board and manufacturing method therefor  
In a rigid/flex circuit board and fabricating process, patterns of electrical traces are formed by etching conductive layers on outer surfaces of a flexible multi-layer circuit structure. A...
6092280 Flexible interface structures for electronic devices  
A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least...
6090301 Method for fabricating bump forming plate member  
A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is...
6068782 Individual embedded capacitors for laminated printed circuit boards  
A method of fabricating individual, embedded capacitors in multilayer printed circuit boards is disclosed. The method is compatible with standard printed circuit board fabrication. The capacitor...
6059879 Method of forming semiconductor wafers, methods of treating semiconductor wafers to alleviate slip generation, ingots of semiconductive material, and wafers of semiconductive material  
The invention encompasses methods of treating semiconductive material wafers and ingots to alleviate slippage within monocrystalline lattices of the wafers and ingots. The invention further...
6059983 Method for fabricating an overcoated printed circuit board with contaminant-free areas  
A method of fabricating an overcoated printed circuit board having a clean area free of contamination from the overcoating material. A metal-clad substrate is etched to form first and second...
6045712 Micromachined reflector antenna method  
A method of manufacturing a micromachined reflector antenna onto a substrate firstly etches a reflector aperture surface defining a dish cavity in an oxide layer and secondly rotates a hinge over...
6045714 Method for forming flat surface vias in integrated circuit substrates  
Conductive vias in integrated circuit ceramic greensheets are formed with essentially flat exposed surfaces by applying an adherent in situ mask material to the greensheet prior to punching via...
6040002 Etching resist composition, pattern forming method making use of the same, printed-wiring board and its production  
An etching resist composition containing at least a polymeric compound having an acid value of not less than 35, a base, and water, and having a viscosity of 10 centipoises or below.
6039889 Process flows for formation of fine structure layer pairs on flexible films  
Processes for forming conductive vias between circuit elements formed on either side of a flexible substrate are disclosed. In one embodiment, the inventive process starts with a flexible film...
6022808 Copper interconnect methodology for enhanced electromigration resistance  
Copper interconnects with enhanced electromigration are formed by filling a via/contact hole and/or trench in a dielectric layer with undoped Cu. A Cu layer containing a dopant element, such as...
6014805 Method of fabricating a hybrid printed circuit board  
A method of fabricating a hybrid printed circuit board on a dielectric substrate is disclosed. The method comprises the step of masking a first pattern on a first side of the dielectric substrate,...
6013417 Process for fabricating circuitry on substrates having plated through-holes  
Circuitry is formed on a substrate having at least one plated through-hole employing two different photoresist materials. A first photoresist is applied on a conductive layer located on a...
6007730 Method of manufacturing diamond heat sink  
A diamond polycrystal body having metal films on its upper and lower surfaces is cut in the vertical direction using a laser to form a diamond polycrystal body piece having upper and lower...
5997754 Method of fabricating multi-layered wiring  
A wiring layer 36A is formed by sputtering, reflowing and patterning of an Al alloy layer on insulating layers 32 and 34 covering the surface of a semiconductor substrate 30. A silicon oxide layer...
5972795 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method and apparatus for producing a wafer
 
A method and an apparatus for producing a wafer from a crystalline ingot, wherein the method supplies an etching gas, having a high etching property for at least one constituent of the crystalline...
5970376 Post via etch plasma treatment method for forming with attenuated lateral etching a residue free via through a silsesquioxane spin-on-glass (SOG) dielectric layer  
A method for forming a via through a dielectric layer within a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then...
5945259 Method for lead frame etching  
A lead frame etching method, which is used for a semiconductor device assembling process and prevents a sharp-edged portion formed on each lateral end of a lead frame material. The method includes...
5928526 Method for manufacturing a substrate having an irregular shape  
A method and apparatus for a substrate having an irregular shape is provided. Using a laser, a first series of laser drilled wells, having a first spacing, are made in the substrate material to...
5925259 Lithographic surface or thin layer modification  
A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the...
5925577 Method for forming via contact hole in a semiconductor device  
A method of plasma etching photoresist and sidewall polymer with an etch gas mixture comprising a fluorine containing gas (CF4 or NF3) and H2 O demonstrating very aggressive ashrate of photoresist...
5922216 Method for manufacturing sharp waveguide branches in integrated optical circuits  
A method for manufacturing branching-off or intersecting channel-shaped waveguides on or in a substrate, which substrate encloses a light-guiding layer, and on which substrate there is applied an...
5919538 Method of manufacturing TAB tapes and laminated body for producing the same  
A method of manufacturing TAB tapes comprising the steps of (1) to (5): (1) laminating a protection film-covered adhesive layer on the entire surface of at least one face of a base film except...
5895740 Method of forming contact holes of reduced dimensions by using in-situ formed polymeric sidewall spacers  
A method of forming cavities in a non-conducting layer on a semiconductor device is provided which can be carried out by first providing a pre-processed semi-conducting substrate which has a...
5893980 Semiconductor device capacitor fabrication method  
A semiconductor device capacitor fabrication method comprises forming a first insulation film on a substrate and an undoped semiconductor layer on the first insulation film, patterning the undoped...
5881455 Method of fabricating through-holed wiring board  
A method of fabricating a through-holed wiring board comprising a step of forming a through hole in a ceramic wiring board with a laser beam, and a step of removing an alteration layer, defined on...
5876614 Method of wet etching aluminum oxide to minimize undercutting  
The method of wet etching an aluminum oxide substrate deposits a thin layer of titanium film or chromium film on the aluminum oxide surface prior to the application of the photo-resist coating to...
5863447 Method for providing a selective reference layer isolation technique for the production of printed circuit boards  
This invention describes a new process for the selective isolation of through holes in the production of a multi-layer printed circuit card which allows for substantially smaller holes through...
5855803 Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets  
A cavity pattern for a laminated structure such as a substrate for integrated circuitry is formed in a sheet of unfired low temperature cofired ceramic (LTCC) material also known as "green" tape....
5841102 Multiple pulse space processing to enhance via entrance formation at 355 nm  
A method for forming a through-via in a laminated substrate by laser drilling a through-via from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a...
5833759 Method for preparing vias for subsequent metallization  
The invention relates to a method for cleaning vias in electronic component substrates prior to metallization thereof.
5822850 Circuit devices and fabrication Method of the same  
A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin...
5802714 Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment  
The invention presents a method of finishing a printed circuit board by using a soluble chloride added to a soft etching solution, the soluble chloride provides a source of chloride ions that...
5800723 Process for fabricating flex circuits and product thereby  
A process (200) for fabricating a flex circuit (708, 806, 812, 818 or 824) using a fabrication process without the use of a photomask includes the steps of generating (412) an electronic image...
5801101 Method of forming metal wirings on a semiconductor substrate by dry etching  
Disclosed herein is, a method of forming a metal wiring on a semiconductor substrate dry etching a metal wiring film or a laminated structure film comprising a metal wiring film and a metal...
5770036 Method of maximizing anharmonic oscillations in deuterated alloys  
For a condensed matter system containing a guest interstitial species such as hydrogen or its isotopes dissolved in the condensed matter host lattice, the invention provides tuning of the...
5770035 Method for the electrolysis of aqueous solutions of hydrochloric acid  
The improved method for the production of chlorine from aqueous solutions of hydrochloric acid in a membrane electrolysis cell comprises a cathode compartment equipped with a gas diffusion cathode...
5753523 Method for making airbridge from ion-implanted conductive polymers  
Organic films are applied from solvent solution to a substrate, then are ion implanted to have resistivity in the kilohm/square to gigaohm/square range. The films are then patterned by standard...
5737818 Method for forming electrical contact to the optical coating of an infrared detector  
This is a system and method of forming an electrical contact to the optical coating of an infrared detector. The method may comprise: forming thermal isolation trenches 22 and contact vias 23 in a...
5731047 Multiple frequency processing to improve electrical resistivity of blind micro-vias  
A method of forming a blind-via in a laminated substrate by forming a first conductive layer. A dielectric layer is then formed on the first conductive layer. An exposed second conductive layer is...
5727977 Process for manufacturing a field-emission device  
A process for manufacturing of a field emission device (100, 200) including the steps of i) providing a substrate (101, 201), ii) forming a conductive row (106, 206), ii) forming a dielectric...
5709979 Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor  
A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many...
5690837 Process for producing multilayer printed circuit board  
In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured...
5688408 Multilayer printed wiring board  
A process for forming a multilayer printed wiring board comprising integrally laminating a plurality of insulating circuit boards having circuits formed on insulating substrates and interlaminar...
5683758 Method of forming vias  
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.
5679267 Dual etching of ceramic materials with an elevated thin film  
A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A shallow etch stop trench (46) is first ion...
5665525 Method for producing printed circuit boards  
A method for producing printed circuit boards (PCB), wherein a base material of a PCB, having copper claddings respectively on its opposed faces, is subject to the following subsequent processing...
5660738 Direct etch processes for the manufacture of high density modules  
The process of the manufacture of both the conductive layers and dielectric layers of multichip modules of the deposited variety is set forth with direct etch techniques being substituted for...
5653893 Method of forming through-holes in printed wiring board substrates  
Through-holes are formed in a printed circuit board substrate by chemical etching a metal foil clad circuit board having open positions in the metal foil where a hole is to be formed using...
5653892 Etching of ceramic materials with an elevated thin film  
A novel reticulated array comprises islands of ceramic (e.g. BST 40) which are fabricated from novel materials using unique methods of patterning. A front side optical coating (e.g. transparent...