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6576345 Dielectric films with low dielectric constants  
Thin films possessing low dielectric constants (e.g., dielectric constants below 3.0) are formed on integrated circuits or other substrates. Caged-siloxane precursors are linked in such a way as...
6565759 Etching process  
A method for etching a pattern within a silicon containing dielectric layer upon a substrate employed within a microelectronics fabrication, employing a plasma activated reactive gas mixture, with...
6555015 Multi-layer printed circuit board and method of making same  
Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle...
6544860 Shallow trench isolation method for forming rounded bottom trench corners  
A method for forming a trench for a shallow trench isolation structure wherein the trench has rounded bottom corners. In one embodiment, the present invention performs a breakthrough etch to...
6531067 Method for forming contact hole  
The subject of the present invention is to keep the wiring resistance low and reduce the variation of the wiring resistance in one identical lot in semiconductor devices of a multi level...
6527964 Methods and apparatuses for improved flow in performing fluidic self assembly  
Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In...
6519822 Method for producing an electronic component  
A method for producing an electronic component includes placing an enclosed frame on a baseplate. A chip is provided to be fitted within the frame, forming a first given space between the chip and...
6518194 Intermediate transfer layers for nanoscale pattern transfer and nanostructure formation  
A method for using intermediate transfer layers for transferring nanoscale patterns to substrates and forming nanostructures on substrates. An intermediate transfer layer is applied to a substrate...
6514673 Rule to determine CMP polish time  
A simple method for calculating the optimum amount of HDP deposited material that needs to be removed during CMP (without introducing dishing) is described. This method derives from our...
6461528 Method of fabricating lateral nanopores, directed pore growth and pore interconnects and filter devices using the same  
Lateral pores in a thin metal film as well as fabricating branching and expanding ore arrays can be fabricated by a method of growing long pores laterally underneath a ask by use of stress...
6461527 Method for fabricating a flexible printed circuit board with access on both sides  
A method for fabricating a flexible printed circuit board with access on both sides includes the steps of applying a metallic conductor track sheet to a base sheet and patterning the metallic...
6454954 Desmear etchant and use thereof  
Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using...
6444136 Fabrication of improved low-k dielectric structures  
Fabrication of improved low-k dielectric structures is disclosed. Low-k dielectric structures are fabricated while overcoming the otherwise existing problems associated with the use of low-k...
6403146 Process for the manufacture of printed circuit boards  
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
6391213 Texturing of a landing zone on glass-based substrates by a chemical etching process  
A method for manufacturing a magnetic disk comprises the acts of a) applying a laser beam to at least a portion of a silica-containing substrate, thereby forming a set of bumps or ridges; b)...
6391210 Process for manufacturing a multi-layer circuit board  
A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling...
6379572 Flat panel display with spaced apart gate emitter openings  
A method is provided for manufacturing a flat panel display in which a baseplate has a conductive row electrode deposited on it followed by an insulator. A conductive gate electrode is deposited...
6375858 Method of forming nozzle for injection device and method of manufacturing inkjet head  
When a nozzle 21 with a stepwise cross-section, which is provided with a small cross-sectional nozzle portion 21a formed on the front side thereof and with a large cross-sectional nozzle portion...
6363712 Gas-driven microturbine  
A microturbine fabricated by a three-level semiconductor batch-fabrication process based on polysilicon surface-micromachining. The microturbine comprises microelectromechanical elements formed...
6360434 Circuit fabrication  
A method of forming a circuit includes forming a metallic circuit pattern on a base substrate. The circuit pattern has traces which are connected together by temporary bussing. A resist pattern...
6349456 Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes  
A method for manufacturing a microelectronic assembly to have aligned conductive regions and dielectric regions with desirable processing and dimensional characteristics. The invention is...
6344308 Method of manufacturing a flexible circuit board  
A flexible circuit board comprises a polyimide insulating layer 5 with land access holes 3 and a conductor circuit layer 4 provided thereon, and is produced by coating one surface of a conductor...
6329300 Method for manufacturing conductive pattern layer by two-step wet etching process  
In a method for manufacturing a conductive pattern layer, a conductive layer is deposited on a substrate, and an etching mask layer is coated onto the conductive layer. First, the conductive layer...
6316059 Method of providing a metal pattern on glass in an electroless process  
Metal patterns (15) can be provided on a glass substrate (1) in an electroless process by modifying the substrate with a silane layer (3), locally removing said layer with a laser or UV-ozone...
6310701 Method and apparatus for ablating high-density array of vias or indentation in surface of object  
An apparatus and process for ablating an array matrix of high-density vias in a flexible and rigid desired object. The apparatus contains a mirror based x, y scanning repeat positioning and/or a...
6293008 Method for producing foil circuit boards  
A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers...
6290860 Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby  
A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling...
6284661 Method and apparatus for producing a wafer  
A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly...
6281436 Encapsulated surface mounting electronic part  
An electronic element is mounted on a resin wiring substrate and a cover member is bonded to the wiring substrate so as to cover the electronic element and constitute an encapsulation region. The...
6280641 Printed wiring board having highly reliably via hole and process for forming via hole  
Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance...
6274198 Shadow mask deposition  
A method of depositing material on a substrate using a shadow mask. The mask includes a plurality of etched features which correspond to a plurality of features in the substrate. Spheres are...
6267817 Methods of forming semiconductor wafers, methods of treating semiconductor wafers to alleviate slip generation, ingots of semiconductive material, and wafers of semiconductive material  
The invention encompasses methods of treating semiconductive material wafers and ingots to alleviate slippage within monocrystalline lattices of the wafers and ingots. The invention further...
6264851 Selective seed and plate using permanent resist  
The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an...
6256121 Apparatus for ablating high-density array of vias or indentation in surface of object  
An imaging system for ablating an array matrix of high-density vias in a flexible and rigid desired object. The apparatus contains a mirror based x, y scanning repeat positioning and/or a single...
6245380 Method of forming bonding pad  
A method of forming bonding pad commences by forming a conformal barrier layer on a provided inter-metal dielectric layer. A first metal layer is formed on the barrier layer to partially fill the...
6214248 Method of forming hollow channels within a component  
A method of forming an internal channel within an article, such as a cooling channel in an air-cooled blade, vane, shroud, combustor or duct of a gas turbine engine. The method generally entails...
6207234 Via formation for multilayer inductive devices and other devices  
A method of creating a multilayer ceramic component of the present invention is used to spontaneously create vias between adjacent conductor layers in a multilayer inductive component. After a...
6197664 Method for electroplating vias or through holes in substrates having conductors on both sides  
A method for plating conductive material in through apertures and blind apertures of a substrate which has a conductive material on its upper and lower surfaces. In a typical configuration for...
6171971 Freestanding multilayer wiring structure  
A dielectric wiring structure and method of manufacture therefor. Successively formed wiring layers synergistically combine with subsequently formed sidewall supports spanning two or more layers...
6162996 Insulating foil circuit board with rigid and flexible sections  
The multilayer foil circuit board according to the invention has rigid (s) and flexible (f) areas and in the rigid areas has more foil layers than in the flexible areas. The foil circuit board...
6162365 Pd etch mask for copper circuitization  
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a...
6156217 Method for the purpose of producing a stencil mask  
A method for the purpose of producing a stencil mask, which comprises a sheet having structures in the form of orifices, wherein the method comprises the following sequence of steps:a) selecting a...
6150072 Method of manufacturing a shallow trench isolation structure for a semiconductor device  
A method for fabricating a shallow trench isolation structure involves several steps. The steps of an illustrative method include forming a first resist pattern on a substrate, etching the...
6146715 Method of fabricating organic electroluminescent display panel  
A method of fabricating an organic EL display panel accomplishes pixelation without using a shadow mask, and without exposing active EL elements to solvents from photoresist, or developing and...
6139762 Methods for manufacture of electronic devices  
The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and...
6132631 Anisotropic silicon nitride etching for shallow trench isolation in an high density plasma system  
An etchant mixture of carbon tetrafluoride and argon in a plasma etch chamber produces straight walled isolation trenches in a silicon nitride layer, the trenches having rounded bottoms and no...
6117347 Method of separating wafers into individual die  
A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a...
6117786 Method for etching silicon dioxide using fluorocarbon gas chemistry  
A semiconductor manufacturing process wherein deep and narrow 0.6 micron and smaller openings are plasma etched in doped and undoped silicon oxide. The etching gas includes fluorocarbon, oxygen...
6106735 Wafer stack and method of producing sensors  
A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and...
6103134 Circuit board features with reduced parasitic capacitance and method therefor  
A method for fabricating circuit board conductors with desirable processing and reduced self and mutual capacitance. The method generally entails forming a metal layer on a positive-acting...