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5200016 Semiconductor device manufacturing apparatus  
In a semiconductor device manufacturing apparatus for performing an etching operation with a reaction gas, in which three electrodes, namely, upper, intermediate and lower electrodes, are arranged...
5199163 Metal transfer layers for parallel processing  
A structure and process for forming dense multi-layer thin film structures wherein individual layers of thin film wiring which can be pre-inspected and then laminated one on top of the next to...
5200361 Process for preparing a semiconductor device using hydrogen fluoride and nitrogen to remove deposits  
A process for preparing a semiconductor device includes the steps of forming a lower wiring of aluminum or an aluminum alloy on a semiconductor substrate, coating said lower wiring with an...
5190892 Method for forming pattern using lift-off  
A method is for forming a pattern from a film which is deposited with a low directivity. A resist pattern is formed on a substrate. A first film is deposited with low directivity, and then a...
5177856 Method of making a shield for a printed circuit board  
An improved shielding assembly for a circuit board. This assembly is formed by providing a substantially flat piece of metal that will be used to form a shield assembly. A template is obtained...
5169678 Laser ablatable polymer dielectrics and methods  
The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified...
5153051 Multilayer thermoplastic substrate  
A manufacturing process for a multilayer thermoplastic printed circuit substrate (200) begins with a thermoplastic core substrate (202) having a printed circuit pattern (204) on a surface (202A)...
5145555 Method of manufacturing a magnetic head  
A method of manufacturing a magnetic head including the steps of forming a plurality of almost V-shaped parallel grooves in a surface of a substrate; forming a soft magnetic thin film larger in...
5127990 Method of fabricating an electronic micro-component self-sealed under vacuum, notably diode or triode  
The disclosure concerns the making of microcomponents belonging to the family of vacuum tubes of the diode, triode and electroluminescent component type. The goal thereof is notably to resolve...
5089361 Mask making process  
A method for making lithographic masks using a soda lime glass substrate that is useful particularly in the manufacture of near submicron and submicron integrated circuits. The problem of "mouse...
5083958 Field emitter structure and fabrication process providing passageways for venting of outgassed materials from active electronic area  
Outgassed materials liberated in spaces between pointed field emitter tips and an electrode structure during electrical operation of a field emitter device are vented through passageways to a pump...
5084132 Non-moire' shielded window forming method  
A shielded substrate is disclosed which has a randomly oriented, non-linear conductive pattern formed on at least one surface of the substrate. The conductive pattern provides excellent EMI/RFI...
5082718 Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit  
A method for deposition of an insulating layer on a conductive layer of the multi layer structure of a connection board of a VLSI circuit and a connection board formed by the method. The formation...
5057186 Method of taper-etching with photoresist adhesion layer  
In a two-step etching process for making tapered contact openings in a dieletric, a thin layer of a material is interposed to serve as an adhesive between the dielectric and a photoresist layer...
5049234 Methods for removing stringers appearing in copper-containing multi-layer printed wiring boards  
Copper-containing multilayer substrates are etched, and stringers formed in the plated through-holes in these substrates are simultaneously removed by treatment with an aqueous composition...
5047114 Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials  
A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are...
5043184 Method of forming electrically conducting layer  
A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being...
5043043 Method for fabricating side drive electrostatic micromotor  
An electrostatic micromotor employs a side drive design. The stator operates in a plane above a substract and a moveable member lies and moves in the plane of the stator. An electrostatic field of...
5024722 Process for fabricating conductors used for integrated circuit connections and the like  
A process for defining conductors on a integrated circuit substrate which includes selectively dry etching through a metal layer on the substrate using plasma reactants including conductor...
4997521 Electrostatic micromotor  
An electrostatically driven microactuator is micromachined in a monolithic process. Sacrificial layers are placed between a moving element and stator structural layers. Removal of the sacrificial...
4992138 Method and apparatus for constructing a foil matrix for a solar cell  
Solar spheres are formed of semi-conductor spheres of P-type interior having an N-type skin are pressed between a pair of aluminum foil members forming the electrical contacts to the P-type and...
4991287 Method for fabricating printed circuit boards  
A process for fabricating a printed circuit board includes the steps of producing data in a printing-scan format representative of a designed area circuit pattern; with such data, printing a mask...
4987101 Method for providing improved insulation in VLSI and ULSI circuits  
An improved VLSI and ULSI structure and a method of forming the same are provided. The structure starts with a base member having a plurality of supports formed thereon and extending upwardly...
4959119 Method for forming through holes in a polyimide substrate  
Hole formation in a polyimide substrate employs a carbon dioxide laser.
4957601 Method of forming an array of apertures in an aluminum foil  
The disclosures relates to a method of forming an array of small apertures in an aluminum foil for receiving semiconductor spheres in said aperature. The apertures are formed by embossing the foil...
4956197 Plasma conditioning of a substrate for electroless plating  
A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The...
4948460 Method of producing head core slider for rigid magnetic disk drive, utilizing laser-induced etching  
A method of producing a magnetic head core slider including integrally formed slider body and yoke portion. The slider body has two parallel air bearing portions, while the yoke portion has a...
4946804 Aperture forming method  
A method of forming through-holes in a multi-level interconnect system in which a layer of photo-resist is spun over a masking layer prior to mask-etching so that when the photo-resist is exposed...
4943346 Method for manufacturing printed circuit boards  
A method for manufacturing printed circuit boards has a double etch process to form interconnection wiring. A metal layer is formed on the substrate. An etch resist layer is applied to the metal...
4940508 Apparatus and method for forming die sites in a high density electrical interconnecting structure  
The present invention is directed to a system for removing material from a structure. The system includes an excimer laser for removing material by ablative photodecomposition and means for...
4937226 Method for producing a small superconducting solenoid  
A large number of small superconducting solenoids are produced on a common substrate simultaneously. Two parallel slits (5) passing through a silicon wafer are dug in such manner that a core (10)...
4931134 Method of using laser routing to form a rigid/flex circuit board  
A method of fabricating a multilayer circuit board having rigid and flexible sections using Z-axis laser routing. A rigid superstructure is provided for lamination to a flexible circuit substrate,...
4894115 Laser beam scanning method for forming via holes in polymer materials  
The surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth. This is followed by a...
4889584 Method of producing conductor circuit boards  
A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically...
4853081 Process for removing contaminant  
Contaminant is removed from the interior of the holes in the vicinity of preselected locations by etching in a gaseous plasma wherein the sheath voltage is controlled in order to direct ions of...
4851080 Resonant accelerometer  
An accelerometer is provided by a sample mass suspended in a central area of a support by pairs of resonating arms. One pair of arms lies on one axis through the sample mass. Another pair of arms...
4849070 Process for fabricating three-dimensional, free-standing microstructures  
A sublimable layer is deposited on a substrate, holes are etched through sublimable layer, a thin-layer structure is deposited on portions of the remaining sublimable layer, and a thick structural...
4840702 Apparatus and method for plasma treating of circuit boards  
An apparatus and method for improved plasma treating of circuit boards is disclosed wherein a plasma treating zone and a gas resupply zone are established in a chamber, an actuating mechanism...
4830706 Method of making sloped vias  
Sloped vias are formed in a resinous layer made from a material which is curable in stages, which can be coated on a substrate prior to partial curing, which adheres to the substrate and which...
4790912 Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating  
A process is disclosed for selectively electrometallizing a non-conductive substrate such as the non-conductive surfaces of a circuit board and to directly effect through hole plating and/or form...
4783247 Method and manufacture for electrically insulating base material used in plated-through printed circuit panels  
Method and manufacture for electrically insulating base material used for perforated plated-through printed circiut panels with a metal core. The method includes applying a radiation-curable layer...
4755551 Electrodeposition resinous paint composition  
An electrodeposition resinous paint composition comprising (a) a modified alkyd resin, (b) a melamine resin, (c) a water-soluble silicone resin and (d) an inorganic filler, in which these...
4746399 Method for making metallic patterns  
The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas...
4720322 Plasma etching of blind vias in printed wiring board dielectric  
A method of plasma etching blind vias in printed wiring board dielectric which comprises the steps of providing a printed wiring board of organic material having a buried electrically conductive...
4717639 Process for preparation of a stencil or resist image  
Process for formation of a hardened, insoluble or crosslinked stencil or resist image on a substrate, e.g., having a metal surface such as copper, and modifying the substrate or image surface...
4714520 Method for filling a trench in an integrated circuit structure without producing voids  
A process is disclosed for filling a trench in an integrated circuit structure without forming a void in the trench which, in a preferred embodiment, comprises partially filling the trench with an...
4713259 Method for the glow-discharge-activated reactive deposition of electrically conductive material from a gaseous phase  
For the reactive deposition of tubular bodies of electrically conductive material from a flowing gas phase on a tubular substrate, a glow discharge 11 is produced between an inner electrode 6 and...
4710448 Method of fabricating ultra-thin flex cables  
A process is disclosed for forming ultra-thin electrical interconnection flex cables. A thin metallic foil ribbon is first coated on one side with a vapor deposited insulating material. The...
4683036 Method for electroplating non-metallic surfaces  
Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting...
4674180 Method of making a micromechanical electric shunt  
A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel...