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7618510 |
Imprinting polymer film on patterned substrate
A method of applying a pattern on a topography includes first applying a polymer film to an elastomer member, such as PDMS, to form a pad. The pad is then applied to a substrate having a varying...
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7615164 |
Plasma etching methods and contact opening forming methods
The invention includes etching and contact opening forming methods. In one implementation, a plasma etching method includes providing a bottom powered plasma chamber that includes a plasma...
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7615162 |
Printed wiring board and method for manufacturing the same
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film...
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7608196 |
Method of forming high aspect ratio apertures
A plasma etch process for etching a dielectric material employing two primary etchants at low flows and pressures, and a relatively low temperature environment within the etch chamber. The two...
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7608192 |
Image sensor and method for fabricating the same
An image sensor and a method for fabricating the same are provided. The image sensor includes a first conductive type substrate including a trench formed in a predetermined portion of the first...
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7603772 |
Methods of fabricating substrates including one or more conductive vias
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers...
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7600303 |
BAW resonator bi-layer top electrode with zero etch undercut
A method of fabricating a BAW piezoelectric resonator, the method comprising the steps of providing a bottom electrode and a piezoelectric layer coupled to the bottom electrode. A bottom metal...
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7597813 |
Element substrate and method of manufacturing the same
A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing...
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7596862 |
Method of making a circuitized substrate
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
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7596851 |
Method of manufacturing a quartz resonator
The shape of a crotch portion of a tuning fork of a quartz piece is controlled such that main surfaces of two sheets of original plates, which are made of quartz crystal and the main surfaces...
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7591956 |
Method and composition for selectively stripping nickel from a substrate
A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an...
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7585759 |
Technique for efficiently patterning an underbump metallization layer using a dry etch process
By patterning the underbump metallization layer stack on the basis of a dry etch process, significant advantages may be achieved compared to conventional techniques involving a highly complex wet...
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7585420 |
Carbon nanotube substrates and catalyzed hot stamp for polishing and patterning the substrates
The present invention is generally directed to catalyzed hot stamp methods for polishing and/or patterning carbon nanotube-containing substrates. In some embodiments, the substrate, as a carbon...
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7585419 |
Substrate structure and the fabrication method thereof
A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the...
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7578909 |
Method of forming CNT containing wiring material and sputtering target material used for the method
A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then...
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7566404 |
Method of fabricating a thin film transistor
An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid...
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7563380 |
Electrode assembly for the removal of surface oxides by electron attachment
An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that...
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7563315 |
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper...
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7562429 |
Suspended device and method of making
A substrate defining a cavity comprising a wide, shallow first portion and a narrow, deep second portion is provided. The first portion of the cavity extends into the substrate from the front side...
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7560037 |
Surfactant-enhanced protection of micromechanical components from galvanic degradation
A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate....
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7550092 |
Chemical mechanical polishing composition
A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue...
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7544304 |
Process and system for quality management and analysis of via drilling
A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in...
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7540968 |
Micro movable device and method of making the same using wet etching
A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7528682 |
Electronic apparatus having display portion and oscillator and manufacturing method of the same
In an electronic apparatus comprising a digital display portion and first and second oscillators comprising first and second oscillating circuits, each of the first and second oscillating circuits...
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7524429 |
Method of manufacturing double-sided printed circuit board
The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad...
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7524427 |
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments...
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7523549 |
Dimensionally stabilized flexible circuit fabrication method and product
A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal...
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7514013 |
Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
The present invention relates to methods for forming thermoelectric and thermodiodic devices including a monolayer of multiple conductive material units with a first surface including a composite...
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7507346 |
Method for manufacturing electronic component, and electronic component
A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection...
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7502605 |
Sub-millimeter wavelength camera
The invention relates to an imaging device to be used with millimeter and/or sub-millimeter radiation comprising at least a pair of substrates, at least one of which is patterned on at least one...
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7476328 |
Method of manufacturing printed circuit board
A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth...
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7459201 |
Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by...
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7455884 |
Atomic layer deposition with point of use generated reactive gas species
A method for atomic layer deposition providing a dispenser unit used to prevent mixing of a precursor gas and an input gas. From the dispenser unit a flow of the input gas is provided over a...
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7455874 |
Method for the fabrication of a biosensor comprising an enzyme electrode arrangement
The present invention relates to an enzyme electrode arrangement comprising a substrate with a surface roughness in the range of 20 nm to 10 microns, a metal electrode, an ultrathin semipermeable...
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7455786 |
Piezoelectric oscillating circuit, method for manufacturing the same and filter arrangement
In a method for manufacturing a piezoelectric oscillating circuit in thin film technology, wherein the oscillating circuit includes a predetermined natural frequency and a plurality of layers,...
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7442318 |
Method of making thermal print head
A method of manufacturing a thermal print head includes a conductor layer formation step, a first measurement step, a conductor layer splitting step and a second measurement step. In the conductor...
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7437933 |
Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof
Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of...
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7435352 |
Method of forming solder resist pattern
A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a...
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7434719 |
Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and...
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7429334 |
Methods of fabricating interferometric modulators by selectively removing a material
Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of...
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7427360 |
Process and ink for making electronic devices
A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink...
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7422696 |
Multicomponent nanorods
Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the...
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7419609 |
Method for quantifying over-etch of a conductive feature
The invention provides a method for quantifying over-etch of a conductive feature. In one embodiment, this method includes forming a conductive feature over a substrate, the conductive feature...
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7413671 |
Method of fabricating a printhead integrated circuit with a nozzle chamber in a wafer substrate
A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is...
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7410592 |
Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate
The stamp ( 10 ) for a lithographic process, such as patterning a surface layer, of the invention has a stamp body ( 5 ) with at least a first recess ( 11 ) formed therein, which recess defines a...
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7396478 |
Multiple internal seal ring micro-electro-mechanical system vacuum packaging method
A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal...
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7396475 |
Method of forming stepped structures employing imprint lithography
The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the...
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7387738 |
Removal of surface oxides by electron attachment for wafer bumping applications
The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second...
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7384566 |
Fabrication method for printed circuit board
A fabrication method for PCBs. The method includes providing a substrate having a layout area and a periphery area around the layout area on a surface, forming a patterned wiring layer, having a...
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