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7578889 |
Methodology for cleaning of surface metal contamination from electrode assemblies
Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications...
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7314575 |
Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk
A method for manufacturing a glass substrate for a magnetic disk comprises mirror surface polishing and cleaning of a glass substrate, wherein polishing agent of which the principal component is...
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7306681 |
Method of cleaning a semiconductor substrate
A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first...
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7060631 |
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
The invention encompasses a semiconductor processing method of cleaning a surface of a copper-containing material by exposing the surface to an acidic mixture comprising Cl − , NO 3 − and F...
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6936183 |
Etch process for etching microstructures
A two-step method of releasing microelectromechanical devices from a substrate is disclosed. The first step comprises isotropically etching a silicon oxide layer sandwiched between two...
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6902626 |
Method for roughening copper surface
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period...
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6893578 |
Selective etchant for oxide sacrificial material in semiconductor device fabrication
An etching composition and method is disclosed for removing an oxide sacrificial material during manufacture of semiconductor devices including micromechanical, microelectromechanical or...
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6793838 |
Chemical milling process and solution for cast titanium alloys
The present invention relates to a chemical milling solution and a chemical milling process for removing a desired depth of material from metal parts. The milling solution contains nitric acid,...
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6706121 |
Device and method for the treatment of semiconductor wafers
In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned...
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6666987 |
Liquid etchant and method for roughening copper surface
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period...
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6656294 |
Method of reducing elution of lead in lead-containing copper alloy, and drinking water service fittings made of lead-containing copper alloy
It is an object of the present invention to provide a processing method for preventing elution of lead in a lead-containing copper alloy to prevent lead from eluting from a faucet metal, etc. made...
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6605230 |
Solutions and processes for removal of sidewall residue after dry etching
The present invention relates to a novel process for removing sidewall residue after dry-etching process. Conventionally, after dry-etching, photoresist and sidewall residues are removed by ozone...
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6589439 |
Composition for selective etching of oxides over metals
A composition for selective etching of oxides over a metal. The composition contains water, hydroxylammonium salt, carboxylic acid, a fluorine containing compound, and optionally, a base. The pH of...
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6540931 |
Removal of copper kiss from pickling high copper alloys
When iron group, especially high nickel, metal alloys that contain substantial amounts of copper are pickled, a displacement coating of copper that is called a “copper kiss” often forms on the...
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6123865 |
Method for improving etch uniformity during a wet etching process
A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by...
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6083413 |
Metals removal process
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5620558 |
Etching of copper-containing devices
The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper...
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5554254 |
Post contact layer etch back process which prevents precipitate formation
A process for preventing the formation of precipitates on a substrate surface after a contact layer (e.g., tungsten layer) etch back. The process involves removing the precursor chemicals of the...
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5431774 |
Copper etching
A dry etch for metals such as copper using π-acids in an energetic environment such as a plasma, laser, or afterglow reactor (102) or by using ligands forming volatiles at low temperature within a...
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5328552 |
Leadframe processing for molded package arrangements
A method for processing a leadframe for use with a molded package is disclosed. In particular, the method is suited for arrangements where direct wirebond attachment sites are exposed through the...
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5106454 |
Process for multilayer printed circuit board manufacture
Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a...
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5049234 |
Methods for removing stringers appearing in copper-containing multi-layer printed wiring boards
Copper-containing multilayer substrates are etched, and stringers formed in the plated through-holes in these substrates are simultaneously removed by treatment with an aqueous composition...
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4915781 |
Stabilized hydrogen peroxide compositions
The present invention is directed to a hydrogen peroxide solution stabilized by ##STR1## wherein X is a linking group and Y is a metal cation or H which compound is soluble in hydrogen peroxide. In...
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4875973 |
Hydrogen peroxide compositions containing a substituted aminobenzaldehyde
The invention is directed to a hydrogen peroxide solution stabilized by a substituted aminobenzaldehyde compound which is soluble in hydrogen peroxide. The stabilized hydrogen peroxide solution...
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4875972 |
Hydrogen peroxide compositions containing a substituted oxybenzene compound
The present invention is directed to a hydrogen peroxide solution stabilized by a substituted oxybenzene compound which is soluble in hydrogen peroxide. In a second aspect of the invention, a...
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4725374 |
Process and apparatus for etching copper base materials
A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride...
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4687545 |
Process for stripping tin or tin-lead alloy from copper
A two step process is described for selectively stripping tin or tin-lead alloys from a copper substrate without significant loss of copper from the substrate. In a first step the substrate coated...
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4581102 |
Copper-base alloy cleaning solution
The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. The cleaning solution...
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4510018 |
Solution and process for treating copper and copper alloys
A solution and process for cleaning, deoxidizing and brightening copper or copper alloys comprising immersion of the copper or copper alloy in a solution comprising an aqueous mixture of sulfuric...
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4424097 |
Metal stripping process and composition
A stripper, for the removal of tin and tin compounds, in particular copper metal-resists in contact switches, comprises an aqueous solution of 5 to 20% v/v hydrochloric acid, 2.5 to 6.0 g/l copper...
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4319955 |
Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
An improved ammoniacal alkaline etchant solution and method of reducing etchant undercut for use in etching copper and copper-containing alloy traces on substrates having resist-coated areas and...
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4220706 |
Etchant solution containing HF-HnO.sub.3 -H.sub.2 SO.sub.4 -H.sub.2 O.sub.2
An etchant solution for multilayered metal layers comprising an aqueous solution of from 0.5 to 50 percent by weight of nitric acid, from 0.03 to 1.0 percent by weight of hydrofluoric acid, from...
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4175011 |
Sulfate-free method of etching copper pattern on printed circuit boards
In printed circuit board manufacture, a copper pattern on the board is slightly etched and then a tin/lead layer is plated onto the etched copper pattern. The etching step is free of sulfate...
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3986970 |
Solution for chemical dissolution treatment of tin or alloys thereof
A solution for chemical dissolution treatment (for example, pickling, etching, chemical milling, chemical polishing or leaching) of tin or its alloys which comprises an aqueous solution of an acid,...
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3945865 |
Metal dissolution process
Evolution of NOx fumes during dissolution of metal values in mineral acid solutions of nitric acid can be eliminated by the addition of small quantities of hydrogen peroxide to the acid solution.
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3939089 |
Etching solutions for copper and copper alloys and etching process using the same
This invention provides etching solutions for copper and copper alloys comprising a mixed aqueous solution of a peroxysulfate with a purine compound and a halogen compound added as the catalyst....
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3936332 |
Copper and copper alloy etching solutions and process
This invention provides cooper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There...
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3520746 |
METAL ETCH COMPOSITIONS
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3056709 |
Etched filler containing polytetrafluoroethylene bearing material
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2946683 |
Presensitized printing plate and method for preparing same
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3556883 |
Title is not available
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3600245 |
Title is not available
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