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7578889 |
Methodology for cleaning of surface metal contamination from electrode assemblies
Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications...
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7563315 |
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper...
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7550092 |
Chemical mechanical polishing composition
A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue...
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7547642 |
Micro-structure manufacturing method
A method of manufacturing a micro-structure includes dry-etching a sacrificial layer provided to a silicon substrate to form structures the sacrificial layer reacting with etching gas to generate...
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7456114 |
Microetching composition and method of using the same
The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic...
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7404910 |
Etching solution, etched article and method for etched article
An etching solution which contains hydrogen fluoride (HF) and exhibits an etching rate ratio: etching rate for a boron-glass film (BSG) or boron-phosphorus-glass film (BPSG)/etching rate for a...
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7393461 |
Microetching solution
The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal...
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7368065 |
Implants with textured surface and methods for producing the same
Compositions and methods are provided for preparing a metal substrate having a uniform textured surface with a plurality of indentations with a diameter in the nanometer and micrometer range. The...
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7357879 |
Etching solution, method of etching and printed wiring board
There is provided an etching solution comprised of a cupric chloride solution and a high-concentration triazole type compound added to the cupric chloride solution and capable of forming an...
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7341958 |
Integrated process for thin film resistors with silicides
The formation of devices in semiconductor material. In one embodiment, a method of forming a semiconductor device is provided. The method comprises forming at least one hard mask overlaying at...
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7306681 |
Method of cleaning a semiconductor substrate
A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first...
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7303993 |
Chemical mechanical polishing compositions and methods relating thereto
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the...
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7285229 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the...
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7258808 |
High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and...
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7189336 |
Etchant, method for roughening copper surface and method for producing printed wiring board
An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer...
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7163897 |
Method for assaying elements in a substrate for optics, electronics, or optoelectronics
The invention provides a method of assaying at least one element in a material including silicon. The method includes the steps of decomposing a portion of the material with an etching agent to...
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7153445 |
Method for roughening copper surfaces for bonding to substrates
The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion...
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7108795 |
Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper...
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7087183 |
Method of using an etchant solution for removing a thin metallic layer
A method for removing a thin metallic layer using an etchant solution is provided for essentially eliminating undercutting in a thin metallic layer such as a seed layer in a magnetic recording...
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7067068 |
Method for preventing lead from dissolving from a lead-containing copper-based alloy
A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a...
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7063800 |
Methods of cleaning copper surfaces in the manufacture of printed circuit boards
The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide...
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7060631 |
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
The invention encompasses a semiconductor processing method of cleaning a surface of a copper-containing material by exposing the surface to an acidic mixture comprising Cl − , NO 3 − and F...
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7037350 |
Composition for chemical-mechanical polishing and method of using same
A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge,...
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6902626 |
Method for roughening copper surface
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period...
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6899818 |
Method and composition for removing sodium-containing material from microcircuit substrates
A method and composition for removing sodium-containing materials such as photoresist from microcircuit substrate material utilizes 1,2-Diaminocyclohexanetetracarboxylic Acid in an organic solvent.
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6899814 |
Creating a mask for producing a printing plate
In order to simplify the sequence of creating a mask, in particular for producing a printing plate, and at the same time to improve the quality of the printing plate produced by means of a mask,...
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6893578 |
Selective etchant for oxide sacrificial material in semiconductor device fabrication
An etching composition and method is disclosed for removing an oxide sacrificial material during manufacture of semiconductor devices including micromechanical, microelectromechanical or...
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6861369 |
Method of forming silicidation blocking layer
Disclosed is a method of manufacturing a semiconductor device. First, a silicidation blocking layer is formed on a semiconductor substrate by a plasma enhanced chemical vapor deposition process....
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6818142 |
Potassium hydrogen peroxymonosulfate solutions
A solution comprising potassium hydrogen peroxymonosulfate containing an elevated level of KHSO 5 and having a weight ratio of SO 5 to SO 4 of greater than 1.0:1, and its use in microetching...
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6793838 |
Chemical milling process and solution for cast titanium alloys
The present invention relates to a chemical milling solution and a chemical milling process for removing a desired depth of material from metal parts. The milling solution contains nitric acid,...
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6730605 |
Redistribution of copper deposited films
A method to redistribute solid copper deposited by PVD on a wafer topography. The deposited copper is solubilized in a fluid for redistribution. The copper redistribution prevents inherent...
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6706121 |
Device and method for the treatment of semiconductor wafers
In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned...
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6666987 |
Liquid etchant and method for roughening copper surface
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period...
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6656294 |
Method of reducing elution of lead in lead-containing copper alloy, and drinking water service fittings made of lead-containing copper alloy
It is an object of the present invention to provide a processing method for preventing elution of lead in a lead-containing copper alloy to prevent lead from eluting from a faucet metal, etc. made...
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6652993 |
Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones...
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6652659 |
Low species buffered rinsing fluids and method
A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing...
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6649077 |
Method and apparatus for removing coating layers from alignment marks on a wafer
A method and an apparatus for removing coating layers from the top of alignment marks on a wafer situated in a spin processor are described. The method may be carried out by first providing a spin...
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6558733 |
Method for etching a micropatterned microdepot prosthesis
An implantable prosthesis, for example a stent, is provided having one or more micropatterned microdepots formed in the stent. Depots are formed in the prosthesis via chemical etching and laser...
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6540931 |
Removal of copper kiss from pickling high copper alloys
When iron group, especially high nickel, metal alloys that contain substantial amounts of copper are pickled, a displacement coating of copper that is called a “copper kiss” often forms on the...
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6521052 |
Surface treatment
A simple surface treatment process is provided which offers a high performance surface for a variety of applications at low cost. This novel surface treatment, which is particularly useful for...
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6464893 |
Process for preparation of thin metallic foils and organic thin-film-metal structures
Controlled chemical etching of rotating metal substrates has been shown to be a feasible and economic method for the reproducible production of thin, reactive metallic foils such as copper foils....
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6444140 |
Micro-etch solution for producing metal surface topography
Metal surfaces, particularly copper surfaces, which are oxidatively micro-etched to increase surface area through the use of molybdenum. The micro-etch solutions contain a proton source, e.g., a...
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6436300 |
Method of manufacturing electronic components
A method of manufacturing electronic components includes disposing a top metal layer ( 502 ) comprised of solder over a bottom metal layer ( 201, 202 ) comprised of titanium or tungsten, and...
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6372027 |
Process for promoting adhesion between an inorganic substrate and an organic polymer
The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of...
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6342164 |
Pinhole-free dielectric films
A method for producing a pinhole-free dielectric film comprising applying a photopolymer to a first dielectric surface of a dielectric film having pinholes, exposing a second and opposing surface...
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6322955 |
Etching method
Multicurved copper films having fine-line elements suitable for radome applications can be improved by cutting the elements with reproducible precision to close tolerance (typically line widths of...
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6261466 |
Composition for circuit board manufacture
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an...
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6245251 |
Method for production of slide fastener or stringers thereof
Coupling elements of a slide fastener or stringer thereof manufactured by cutting and forming a multiplicity of coupling elements from a linear material of copper or a copper alloy and fixing the...
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6197210 |
Process for treating brass components to substantially eliminate leachabale lead
A process for the treatment of brass components to reduce leachable lead therefrom when the components are exposed to water which includes the steps of first cleaning the brass components with a...
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6156221 |
Copper etching compositions, processes and products derived therefrom
The present invention is a persulfate etchant composition especially useful for dissolving copper during fabrication of microelectronic packages. The etchant is characterized by its ability to...
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