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5030373 |
Surface-treating agents for copper and copper alloy
An aqueous solution containing 0.1 g/l or more of piperidine or a derivative, 100-500 g/l of sulfuric acid, 10-50 g/l of hydrogen peroxide and 0.5 g/l or more of phosphoric acid is used for...
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5024725 |
Method for self-inducted repair of circuit shorts and near-shorts
An automatic method to repair circuit shorts and near-shorts present in narrow bridges or remnants of bridges between circuit lines. By applying a voltage across a pair of lines, certain electrical...
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5022955 |
Apparatus and method for self-induced repair of circuit shorts and near-shorts
An automatic method and apparatus for the repair of circuit shorts and near-shorts present in narrow bridges or remnants of bridges between circuit lines. By applying a voltage across a pair of...
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5019288 |
Cleaning composition for copper and copper alloys and method of manufacture thereof
An acidic solution for use as a cleaning composition for copper and copper alloys includes a solution of from about 1-20 weight percent hydrochloric acid and approximately 80-99 weight percent of...
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5013395 |
Continuous regeneration of acid solution
A method of continuously regenerating a metal containing acid solution enhanced with a salt-free material. The metal dissolved in a bulk metal containing acid solution is continuously oxidized by...
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4997516 |
Method for improving adherence of copper foil to resinous substrates
The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses...
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4981553 |
Copper etching bath and method of using
Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in...
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4976808 |
Process for removing a polyimide resin by dissolution
When a TAB tape is manufactured from a substrate which has been prepared by forming an electrolessly plated cooper layer on a polyimide resin, and heat treated at a temperature of 120° C. to 420°...
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4975216 |
Short-chain alkane sulfonic acids in cleaning preparations and disinfectants
Short-chain alkane sulfonic acids containing from 1 to 4 carbon atoms or mixtures thereof as sole acid component of cleaning preparations and/or disinfectants, optionally together with other...
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4973380 |
Process for etching copper base materials
A process for etching copper or a copper base material with an aqueous solution consisting essentially of peroxydisulfuric acid, up to about 500 ppm of a halide addition and the balance water is...
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4964945 |
Lift off patterning process on a flexible substrate
A method of providing patterned, thin-film materials on flexible substrates by depositing a first, etchable, integral mask onto a substrate, depositing a second pattern material over the mask...
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4957653 |
Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
A composition for stripping tin or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, and an inroganic...
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4956035 |
Composition and process for promoting adhesion on metal surfaces
The adhesion of organic chemicals to metal surfaces is enhanced by treating the metal surface with a composition comprising an etching component, a quaternary ammonium cationic surfactant, and a...
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4952275 |
Copper etching solution and method
A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.
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4938838 |
Method of reducing the emission of NO.sub.x gas from a liquid containing nitric acid
A method of reducing, by the addition of hydrogen peroxide, the emission of NO x gas in the treatment of a nitric acid-containing liquid is disclosed. In the method the redox potential of the...
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4917758 |
Method for preparing thin copper foil-clad substrate for circuit boards
A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an...
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4913768 |
Process for producing electrical conductor boards
Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are...
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4904339 |
Vertical spray etch reactor and method
Vertical spray etch reactor and method in which a nitric acid etching solution is sprayed onto an upright workpiece in the form of low impact, large drops to produce a gentle sheeting flow of the...
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4904340 |
Laser-assisted liquid-phase etching of copper conductors
A process for laser-assisted liquid phase etching of copper conductors which includes the use of a solution of sulfuric acid and hydrogen peroxide in contact with an integrated circuit substrate...
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4880495 |
Regeneration of copper etch bath
This invention relates to a copper etching process which involves contacting the copper with an aqueous etching solution comprising sulfuric acid and a peroxide to which is added less than about...
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4880496 |
Method and device for submicron precision pattern generation
A method and device for creating patterns on a wide variety of substrates. The dimensions are variable in a wide range, from sub-microscopic and upwards. The device can also be used for...
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4878991 |
Simplified method for repair of high density interconnect circuits
A simplified method of gaining access to, for the purpose of replacing, a defective integrated circuit chip situated in a high density interconnect (HDI) circuit (10) comprises heating the HDI...
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4875972 |
Hydrogen peroxide compositions containing a substituted oxybenzene compound
The present invention is directed to a hydrogen peroxide solution stabilized by a substituted oxybenzene compound which is soluble in hydrogen peroxide. In a second aspect of the invention, a...
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4859281 |
Etching of copper and copper bearing alloys
A copper etching composition and an improved method for copper etching utilizing the composition, the composition includes an aqueous solution of a strong acid, a stabilized hydrogen peroxide, and...
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4849124 |
Copper etching solution
An aqueous copper etching solution is disclosed, containing customary acid etching means based upon iron chloride, copper chloride or peroxide compounds, characterized by an additional content of...
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4824511 |
Multilayer circuit board with fluoropolymer interlayers
A multilayer circuit board consisting of multiple circuit layers supported on sheets of PTFE or PTFE containing a fibrous stiffening agent, said circuit-bearing sheets being joined in fixed...
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4818962 |
Waveguide obtained by selective etching method
The invention provides mainly a selective etching method for the total or partial chemical ablation at certain positions of a metal sheet, and a waveguide obtained by said method. Complete ablation...
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4767662 |
Copper etching process and product
Copper etching process and product particularly suitable for use in the manufacture of printed circuit boards. The copper is etched in a liquid etchant, and the crystal structure of the copper is...
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4741798 |
Installation for etching material
In an installation for etching material to be etched consisting at least partly of metal, preferably copper, oxidizing agent is added to the etching medium containing an acid, directly before the...
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4725374 |
Process and apparatus for etching copper base materials
A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride...
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4719693 |
Resistance element for wound-type variable resistors and method of making same
A resistance element causing less sliding noise for use in wound-type variable resistors and a method of making the same are disclosed. A resistance element obtained by winding a metallic...
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4714517 |
Copper cleaning and passivating for tape automated bonding
In the preparation of copper parts for the tape automated bonding of semiconductor devices, the copper parts are subjected to a mild organic acid. This treatment etches the copper, removes...
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4713144 |
Composition and method for stripping films from printed circuit boards
A composition and method for stripping solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board with a single application of the composition. An aqueous...
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4710263 |
Method of fabricating print head for thermal printer
A method of fabricating a print head for use in a thermal printer is similar to the additive (or lift-off) method of pattern transfer utilizing semiconductor fabrication technology except that a...
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4698124 |
Method of regenerating permanganate etch bath
A method is provided for regenerating the spent permanganate ions in an alkaline permanganate-containing etchant composition by adding to the composition an oxidizer selected from the group...
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4687545 |
Process for stripping tin or tin-lead alloy from copper
A two step process is described for selectively stripping tin or tin-lead alloys from a copper substrate without significant loss of copper from the substrate. In a first step the substrate coated...
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4670972 |
Method for making magnetic heads
In the manufacture of a magnetic head, a magnetic layer is sputtered or evaporated on a surface of a first substrate of glass or nonmagnetic material and a nonmagnetic material such as glass is...
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4636282 |
Method for etching copper and composition useful therein
A composition of matter comprising sulfuric acid and guanidine, aminoguanidine, or formylated aminoguanidine. The composition is useful in the preparation of sulfuric acid/hydrogen peroxide etching...
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4632727 |
Copper etching process and solution
Process and solution for etching copper, for example, to remove it from printed circuit boards. The etching is effected by an aqueous solution of nitric acid, a polymer which inhibits undercutting...
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4608319 |
Extended surface area amorphous metallic material
An extended surface area amorphous metallic article and process for preparation thereof, wherein a homogeneous amorphous metallic alloy is phase-separated to produce two interconnected, internally...
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4600480 |
Method for selectively plating plastics
A method for plating first selected surfaces of a platable plastic substrate without plating second selected surfaces is disclosed. The method comprises first electrolessly plating the substrate to...
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4576677 |
Method and apparatus for regenerating an ammoniacal etching solution
Ammoniacal etching solution containing metal ions as the result of etching is withdrawn from an etching bath and while part of it goes to an electrolysis cell for removal of metal ion, the...
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4544439 |
System for repairing electrical short circuits between parallel printed circuits
A system for cleaning a thru hole on a substantially planar electrical board. The electrical board has two major surfaces, upper and lower. A first gas and liquid transmission device is connected...
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4543153 |
Process and apparatus for etching copper masked by a nickel-gold mask
Process and apparatus for anisotropically etching copper through a nickel-gold mask on a circuit board. An electrical connection is made between the copper and the reactor wall or another...
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4525240 |
Dissolution of metals utilizing tungsten
Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of tungsten.
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4522683 |
Dissolution of metals utilizing tungsten-diol combinations
Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and combinations of catalytic amounts of tungsten and of certain diols.
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4497687 |
Aqueous process for etching cooper and other metals
Nitrogen dioxide process for etching copper and other metals, using water as a catalyst/solvent. In one disclosed embodiment, a film of water is formed on the surface of the metal, and the...
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4482425 |
Liquid etching reactor and method
Reactor and method for removing a material such as copper from a substrate such as a printed circuit board, utilizing a liquid etchant. The work to be etched is placed in a narrow channel, and the...
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4477324 |
Making metal eutectic fine wire arrays
Arrays of substantially parallel metallic wires of micron and sub-micron dimensions are made by directionally solidifying the components of a eutectic alloy system as a thin film and subsequently...
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4462861 |
Etchant with increased etch rate
A process for etching copper comprising contact of the copper with an etchant that is an aqueous solution of sulfuric acid, a peroxide and a low molecular weight carboxylic acid. The low molecular...
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