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7560016 Selectively accelerated plating of metal features  
To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the...
7560015 Process for electrolytic coating of a strand casting mould  
Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended...
7560014 Method for airfoil electroplating  
A method is provided for electroplating a high temperature coating onto an airfoil. The method includes providing a shield having a recess defining one or more walls conforming to the shape of at...
7553401 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating  
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow...
7544281 Uniform current distribution for ECP loading of wafers  
An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The...
7468124 Method and apparatus for copper corrosion prevention during wet clean  
A method and apparatus for cleaning a wafer with a metal exposed through an insulator, through the use of a wet cleaning tank in concert with a feedback system on the potential difference between...
7435323 Method for controlling thickness uniformity of electroplated layers  
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode...
7425256 Selective shield/material flow mechanism  
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode...
RE40218 Electro-chemical deposition system and method of electroplating on substrates  
The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the...
7332066 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece  
A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate...
7323094 Process for depositing a layer of material on a substrate  
An electroplating system ( 30 ) and process makes electrical current density across a semiconductor device substrate ( 20 ) surface more uniform during plating to allow for a more uniform or...
7285195 Electric field reducing thrust plate  
A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a...
7279084 Apparatus having plating solution container with current applying anodes  
A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model...
7252750 Dual contact ring and method for metal ECP process  
A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge...
7200920 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module  
The substrate ( 2 ) containing the via-hole ( 3 ) is inserted into an electrophoretic cell ( 1 ) and an electrode ( 6 ) (the “first electrode”) is placed on top of a first orifice of the...
7169283 Anodization device and anodization method  
In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be...
7160421 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece  
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical...
7115196 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece  
A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate...
7070686 Dynamically variable field shaping element  
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a...
7001497 Process and apparatus for positioning replacement anodes in electrolytic cells  
A spent anode is replaced with a new anode in an electrolysis cell having an anode bus bar and an anode rod contacting the bus bar. A desired distance (D 4 ) from the bus bar to a reference point...
6974530 Method and system for controlling ion distribution during plating of a metal on a workpiece surface  
The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment...
6953522 Liquid treatment method using alternating electrical contacts  
A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a...
6926813 Electrical contacting element made of an elastic material  
To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising...
6919011 Complex waveform electroplating  
A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex...
6919010 Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction  
A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. The current of a plating cell is provided from an azimuthally asymmetric anode, which is...
6916413 Electro-plating apparatus and method  
Electroplating station S has a head 1 with anode 2 , to one side of which there is located an electrically neutral wall 3 . The width of anode 2 is provided to accommodate the width of web 6...
6916412 Adaptable electrochemical processing chamber  
An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an...
6913681 Plating method and plating apparatus  
A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to...
6896786 Method and device for producing wear resisting surfaces  
A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through...
6896784 Method for controlling local current to achieve uniform plating thickness  
A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the...
6890413 Method and apparatus for controlling local current to achieve uniform plating thickness  
A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the...
6887364 Method for manufacturing a multiple walled tube  
A method for manufacturing a multiple walled tube comprising a rolling of a plated metal strip through at least two complete revolutions to form a tube having at least a double wall which has a...
6837978 Deposition uniformity control for electroplating apparatus, and associated method  
A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The...
6830673 Anode assembly and method of reducing sludge formation during electroplating  
A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by...
6827827 Metal plating apparatus and process  
In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of...
6818115 System and method for electrolytic plating  
The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a...
6811669 Methods and apparatus for improved current density and feature fill control in ECD reactors  
Apparatus and methods are disclosed for electroplating conductive films on semiconductor wafers, wherein field adjustment apparatus is located in a reservoir between a cathode and an anode to...
6802950 Apparatus and method for controlling plating uniformity  
The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and...
6793794 Substrate plating apparatus and method  
The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the...
6790332 Method for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses  
A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one...
6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode  
An apparatus for plating and planarizing metal on a substrate includes a plurality of dispensing segments, each having at least one hole for dispensing electroplating solution onto the substrate....
6773571 Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources  
The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating...
6767437 Electroplating apparatus and electroplating method  
In an electroplating apparatus, an electrolytic agent is filled into the portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and an...
6761812 Apparatus and method for electrochemical metal deposition  
In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative...
6755954 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements  
An apparatus for electrochemical treatment of a substrate, in particular for electroplating an integrated circuit wafer. An apparatus preferably includes dynamically operable concentric anodes and...
6733649 Electrochemical processing method  
A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger...
6706166 Method for improving an electrodeposition process through use of a multi-electrode assembly  
A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing...
6695961 Carrier serving to supply current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces  
The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The...
6685814 Method for enhancing the uniformity of electrodeposition or electroetching  
An apparatus and method for an electrodeposition or electroetching system. A thin metal film is deposited or etched by electrical current through an electrolytic bath flowing toward and in contact...
6669833 Process and apparatus for electroplating microscopic features uniformly across a large substrate  
A process and apparatus are provided for electroplating a film onto a substrate having a top side including a plating surface includes the following steps. Provide a plating tank with an...
Matches 1 - 50 out of 179 1 2 3 4 >