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7608538 |
Formation of vertical devices by electroplating
The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete...
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7273535 |
Insoluble anode with an auxiliary electrode
A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of...
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7252750 |
Dual contact ring and method for metal ECP process
A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge...
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7025860 |
Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the...
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6905588 |
Packaging deposition methods
The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a...
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6887364 |
Method for manufacturing a multiple walled tube
A method for manufacturing a multiple walled tube comprising a rolling of a plated metal strip through at least two complete revolutions to form a tube having at least a double wall which has a...
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6884334 |
Vertically configured chamber used for multiple processes
The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a...
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6881318 |
Dynamic pulse plating for high aspect ratio features
A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After...
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6848977 |
Polishing pad for electrochemical mechanical polishing
The present invention provides a polishing pad for electrochemical mechanical polishing of conductive substrate. The pad comprises a plurality of grooves formed in a polishing surface of the...
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6838149 |
Abrasive article for the deposition and polishing of a conductive material
An abrasive article is described. The article is suitable for the deposition and mechanical polishing of a conductive material, and comprises: a polishing layer having a textured surface comprising...
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6793797 |
Method for integrating an electrodeposition and electro-mechanical polishing process
A method for alternately electrodepositing and electro-mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor...
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6706166 |
Method for improving an electrodeposition process through use of a multi-electrode assembly
A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing...
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6652726 |
Method for reducing wafer edge defects in an electrodeposition process
A method for reducing or avoiding semiconductor wafer peripheral defects and contamination during and following electrodeposition including providing a wafer chuck assembly sealably attached to a...
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6645549 |
Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards
A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution...
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6585875 |
Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology
A process for cleaning an electrically conducting surface ( 3 ) by arranging for the surface to form the cathode of an electrolytic cell in which the anode ( 1 ) is maintained at a DC voltage in...
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6582579 |
Methods for repairing defects on a semiconductor substrate
The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the...
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6551483 |
Method for potential controlled electroplating of fine patterns on semiconductor wafers
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are...
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6518182 |
Via-filling process
A process of performing via-filling efficiently and by a simple procedure is disclosed. The via-filling process comprises providing a substrate having blind via-holes, making the substrate...
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6350362 |
Method and device for regulating the concentration of substances in electrolytes
A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally...
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6279502 |
Resist developing method by magnetic field controlling, resist developing apparatus and method of fabricating semiconductor device
A semiconductor device is fabricated by the steps of coating an underlayer formed on a semiconductor substrate with chemically amplified resist, exposing the resist to light, bringing the resist...
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6143155 |
Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly
Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a...
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6132586 |
Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor...
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5958604 |
Electrolytic process for cleaning and coating electrically conducting surfaces and product thereof
An electrolytic process for metal-coating the pre-cleaned surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell with a cathode...
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5700366 |
Electrolytic process for cleaning and coating electrically conducting surfaces
An electrolytic process for simultaneously cleaning and metal-coating the surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell...
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5269904 |
Single tank de-oxidation and anodization process
The invention is a single-bath electrolytic de-oxidation and anodization process in which a workpiece surface such as an aluminum surface is electrolytically de-oxidized and then anodized to form...
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4671858 |
Method for making anode foil for an aluminum electrolytic capacitor
The present invention relates, in an aluminum electrolytic capacitor using aluminum foil as its electrode, to a method for producing safely an anode foil having a high surface-area-enlarging factor...
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4462871 |
Epitaxial thinning process
A method is described for thinning an epitaxial layer (16) of a wafer (12) that is to be used in producing diodes having a specified breakdown voltage and which also facilitates the thinning...
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4318217 |
Method of manufacturing an infra-red detector device
In the manufacture of an infra-red detector device, at least a portion of a surface of a body of mercury cadmium telluride is subjected to a conversion treatment to produce a surface layer, after...
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4294670 |
Precision electroplating of metal objects
A layer of metal of predetermined uniform thickness is electroplated onto the surface of a metal object by the use of a special composite anode having an under body of electrically conductive but...
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4263113 |
Electrochemical removal of surface copper from aluminum foil
Copper on the surface of etched aluminum foil is electrochemically removed by low-voltage anodization in an electrolytic bath containing up to 5% sodium potassium tartrate or ammonium dihydrogen...
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4132609 |
Method of and apparatus for electrolytic treatment of metal
An electrolytic process and a cathode structure for use in the process for treatment of an elongated strip of metal as the strip is passed between an anode immersed in an acidic anolyte solution...
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4050996 |
Electochemically exchanging a steel surface with a pure iron surface
A process for exchanging a surface layer of a moving steel strip with an iron layer of different composition (e.g., pure iron). The strip is anodically polarized in an iron-ion-containing...
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3989604 |
Method of producing metal strip having a galvanized coating on one side
A method for producing galvanized metal sheet or strip material having a zinc coating on one side only. The method includes utilizing the strip as a bipolar electrode and electrolytically removing...
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3964914 |
Electromarking solution
This invention is directed to an aqueous halogen-free electromarking solution which possesses the capacity for marking a broad spectrum of metals and alloys selected from different classes. The...
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3620934 |
METHOD OF ELECTROLYTIC TINNING SHEET STEEL
A method of electrolytic tinning sheet steel in which a sheet of steel is bjected to degreasing in an alkaline bath, pickling in an acid bath in which the sheet steel is polarized as the cathode,...
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3619386 |
ELECTRODEPOSITION PROCESS USING A BIPOLAR ACTIVATING MEDIUM
A bipolar activating medium having a metallic surface through which protrudes a plurality of small, dynamically hard, nonconductive particles held in spaced relationship to one another is insulated...
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3616343 |
ELECTROCHEMICAL MACHINING METHOD
1. A process for the electrochemical machining of an electrochemically machinable conductive metallic workpiece comprising the steps of: Spacedly juxtaposing said workpiece with an...
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3471336 |
ELECTROCHEMICAL CELL
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3293919 |
Ultrasonic angular displacement system
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2944946 |
Catalytic element and method of manufacturing such elements
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