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7563352 |
Method and conveyorized system for electorlytically processing work pieces
In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3. x in a...
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7473328 |
Composite alloy having a three-dimensional periodic hierarchical structure and method of producing the same
A composite alloy has a three-dimensional periodic hierarchical structure having hard and soft metallic phases periodically arranged with a period having a length ranging from a nanometer scale to...
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7385290 |
Electrochemical reaction cell for a combined barrier layer and seed layer
Methods and apparatus for forming conductive interconnect layers useful in articles such as semiconductor chips, memory devices, semiconductor dies, circuit modules, and electronic systems. An...
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7371312 |
Using cell voltage as a monitor for deposition coverage
A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal...
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7270733 |
Method and apparatus for real time monitoring of industrial electrolytes
The present invention relates generally to any electrolyte and methods for monitoring the constituents contained therein. More specifically, the present invention relates to plating baths and...
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7236847 |
Systems and methods for closed loop defect reduction
Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An...
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7223328 |
Sensors for reducing gas molecules
Provided is a gas molecule sensor, characterized in that the sensing element is a polycrystalline tin oxide film having a thickness less than 1 μm. The sensing element is produced by electrolytic...
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7172683 |
Method of managing a plating liquid used in a plating apparatus
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a...
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7160421 |
Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical...
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7115196 |
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate...
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7020537 |
Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical...
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6969672 |
Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the...
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6937002 |
Method of using an array of electrodes for high throughput development and testing of materials
Methods and apparatus employ the use of arrays ( 301, 902 ) of two or more electronically-discrete electrodes ( 1, 2, 3 . . . ) to facilitate high-throughput preparation and testing of materials...
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6919012 |
Method of making a composite article comprising a ceramic coating
A ceramic coating is formed on a conductive article by immersing a first anodic electrode, including the conductive article, in an electrolyte comprising an aqueous solution of alkali metal...
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6911136 |
Method for regulating the electrical power applied to a substrate during an immersion process
A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying...
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6893551 |
Process for forming coatings on metallic bodies and an apparatus for carrying out the process
A process for forming oxide based dense ceramic composite coatings on reactive metal and allow bodies involves suspension of at least two reactive metal or alloy bodies in a non-metallic,...
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6893548 |
Method of conditioning electrochemical baths in plating technology
An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical...
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6884333 |
Electrochemical system for analyzing performance and properties of electrolytic solutions
The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a...
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6884332 |
Method and apparatus for treating an aqueous electroplating bath solution
A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of...
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6814848 |
Method for determining alloy phase in plating layer and method for evaluating sliding property of alloy galvanized steel plate
A method for determining a quantity of each of alloy phases in the plating layer includes subjecting each alloy phase in the plating layer to constant potential electrolysis in each of a plurality...
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6802950 |
Apparatus and method for controlling plating uniformity
The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and...
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6790331 |
ELECTRODEPOSITION COATING FILM THICKNESS CALCULATING METHOD, RECORDING MEDIUM STORED WITH FILM THICKNESS CALCULATING PROGRAM AND READABLE BY MEANS OF COMPUTER, AND ELECTRODEPOSITION COATING FILM THICKNESS SIMULATION APPARATUS
A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is...
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6773569 |
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives
A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an...
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6770184 |
Integrated de-ionized water pressure monitoring system for solder plating machines
The present invention provides a solder plating system with automatic monitoring of wash fluid pressure. The system automatically activates an alarm and/or initiates shutdown of a solder plating...
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6761812 |
Apparatus and method for electrochemical metal deposition
In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative...
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6752916 |
Electrochemical planarization end point detection
A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided...
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6752915 |
Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus
The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with...
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6746579 |
Electrolytic gold plating method and apparatus therefor
An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously...
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6726825 |
Method and apparatus for manufacturing positive electrode foil of aluminum electrolytic capacitor
A method of manufacturing a positive electrode foil of an aluminum electrolytic capacitor is provided in which anodizing conditions are optimally determined and automatically set to minimize the...
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6726824 |
Closed loop monitoring of electroplating bath constituents using mass spectrometry
The present invention provides methods and apparatus for analysis and monitoring of electrolyte bath composition. Based on the results of the analysis, the invention controls electrolyte bath...
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6645364 |
Electroplating bath control
Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
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6630360 |
Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
A method is provided that comprises forming a copper seed layer on a workpiece and measuring the uniformity of the copper seed layer on the workpiece. The method further comprises applying the...
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6596147 |
Methods of overplating surfaces of microelectromechanical structure
MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active...
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6569307 |
Object plating method and system
A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the...
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6565729 |
Method for electrochemically depositing metal on a semiconductor workpiece
A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate...
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6542784 |
Plating analysis method
A plating analysis method is disclosed for electroplating in a system in which resistance of an anode and/or a cathode cannot be neglected. This method comprises giving a three-dimensional...
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6533920 |
Device for detecting an end point of electro-plating and method thereof
A device for detecting an end point of electro-plating comprises a mandrel having a substrate and a patterned conductive layer with a main conductive area and an insulated conductive area on the...
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6521112 |
Paced chemical replenishment system
A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition;...
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6516233 |
Pulse plating rectifiers and methods, systems and computer program products for controlling pulse plating rectifiers in master/slave mode
Methods, systems and computer program products for controlling plating pulse rectifiers are provided by identifying one of the plurality of plating pulse rectifiers as a master plating pulse...
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6511591 |
Method for the electrolytic refining of copper
The present invention concerns a method for the prevention of anode passivation in the electrolytic refining of copper, when periodic reversal current technology is used in electrolysis. The method...
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6508924 |
Control of breakdown products in electroplating baths
Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
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6478943 |
Method of manufacture of electrochemically textured surface having controlled peak characteristics
Textured surfaces comprised of peaks which have been electrochemically deposited on a substrate are prepared using a pulsed direct current process. Typical substrates are machine components such as...
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6466927 |
Method for creating a process capability database
A procedure and method for eliciting expert information on process capability and thereafter manipulating the elicited information in such a manner that it can effectively be used in a process...
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6458262 |
Electroplating chemistry on-line monitoring and control system
The present invention provides methods and apparatus for analysis and monitoring of electrolyte bath composition. Based on analysis results, the invention controls electrolyte bath composition and...
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6351682 |
Semiconductor processing workpiece position sensing
The present invention provides semiconductor workpiece position sensors and methods of monitoring the position of a semiconductor workpiece. One embodiment of the invention provides a method of...
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6350361 |
Real time control device for electroformation, plating and deplating processes
Precise control of deposition or etching of thin films on a transparent substrate is particularly useful for electroformation of nozzles and formation control. A computer based measuring system is...
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6274021 |
Method for making layer electrodes
The invention relates to a method and an apparatus for producing an electrode coating. The fundamental idea of the invention is to regulate in a time-defined manner at any instant during an...
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6258239 |
Process for the manufacture of an electrode for a solid polymer fuel cell
In a process for manufacturing an electrode for a PEM fuel cell or an electrochemical energy converter, an ion-exchange polymer is applied to one face of an electrode substrate. An electrocatalyst...
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6251692 |
Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter...
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6231743 |
Method for forming a semiconductor device
A substrate (155) is placed into a plating bath (19, 59), a current in the bath is measured, and a film (110) is plated onto the substrate (155). In one embodiment the current is measured using a...
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