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7578920 |
Electrolytic processing method
An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus...
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7544280 |
Plating analyzing method and apparatus
A plating analyzing method is disclosed for analyzing an electroplating system having an anode, a cathode and plating liquid, based on a Laplace's equation. The method comprises the steps of making...
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7537681 |
Method for forming and measuring the thickness of an anodized coating
An anodizing system for forming a anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The anodizing system includes a bath, a coating...
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7427344 |
Methods for determining organic component concentrations in an electrolytic solution
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring...
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7425255 |
Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
Bipolar wave current, with both positive and negative current portions, is used to electrodeposit a nanocrystalline grain size deposit. Polarity Ratio is the ratio of the absolute value of the time...
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7384535 |
Bath analysis
Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and...
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7371312 |
Using cell voltage as a monitor for deposition coverage
A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal...
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7371311 |
Modified electroplating solution components in a low-acid electrolyte solution
An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment,...
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7291253 |
Detection of an unstable additive breakdown product in a plating bath
The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be...
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7279084 |
Apparatus having plating solution container with current applying anodes
A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model...
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7189647 |
Sequential station tool for wet processing of semiconductor wafers
Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are...
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7186326 |
Efficient analysis of organic additives in an acid copper plating bath
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two...
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7183787 |
Contact resistance device for improved process control
A device for measuring resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process. The device includes a substrate and a conductive...
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7161689 |
Apparatus and method for processing a microelectronic workpiece using metrology
A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a...
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7144488 |
Electrode, electrochemical cell, and method for analysis of electroplating baths
A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor;...
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7094323 |
Process analyzer for monitoring electrochemical deposition solutions
The present invention relates to a process analyzer for analyzing composition of sample electrochemical deposition solutions, comprising at least one microelectrode having a radius of not more than...
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7093347 |
Method of making a current-perpendicular to the plane (CPP) magnetoresistive (MR) sensor
A magnetoresistive (MR) sensor having a decreased electrical profile due to a confining of the device sense current within a conductive nanoconstriction. The MR sensor includes a giant...
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7060203 |
Electrolyte solution for particle measuring apparatus, and particle measuring method using same
An electrolyte solution for a particle measuring apparatus which comprises an inorganic salt, such as sodium chloride or calcium chloride, dissolved in an organic solvent. A substance that promotes...
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RE39123 |
Plating apparatus
The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing...
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7022215 |
System and methods for analyzing copper chemistry
The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample...
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7001497 |
Process and apparatus for positioning replacement anodes in electrolytic cells
A spent anode is replaced with a new anode in an electrolysis cell having an anode bus bar and an anode rod contacting the bus bar. A desired distance (D 4 ) from the bus bar to a reference point...
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6969672 |
Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the...
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6936157 |
Interference correction of additives concentration measurements in metal electroplating solutions
The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model...
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6926816 |
Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes
The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in...
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6911136 |
Method for regulating the electrical power applied to a substrate during an immersion process
A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying...
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6899805 |
Automated chemical management system executing improved electrolyte analysis method
A method for determining the concentration of an additive X of an electrochemical bath that includes at least one further component Y is set forth. In accordance with the method, a predetermined...
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6899802 |
Method for recycling of plating solutions
In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads,...
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6896784 |
Method for controlling local current to achieve uniform plating thickness
A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the...
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6896783 |
Method for producing material libraries by means of electrochemical deposition
The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of...
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6893548 |
Method of conditioning electrochemical baths in plating technology
An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical...
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6884333 |
Electrochemical system for analyzing performance and properties of electrolytic solutions
The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a...
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6884332 |
Method and apparatus for treating an aqueous electroplating bath solution
A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of...
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6827839 |
Plating bath analysis
Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods...
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6814855 |
Automated chemical management system having improved analysis unit
A method and apparatus for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth. In accordance with the method, at least two electrodes are...
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6814848 |
Method for determining alloy phase in plating layer and method for evaluating sliding property of alloy galvanized steel plate
A method for determining a quantity of each of alloy phases in the plating layer includes subjecting each alloy phase in the plating layer to constant potential electrolysis in each of a plurality...
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6814847 |
Method and apparatus for electro-deposition of metal
A method and apparatus for maintaining electro-deposition of metal on a cathode in an electrolytic cell. The cell comprises a metal anode, a cathode, an electrolytic bath and a main power supply to...
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6808611 |
Methods in electroanalytical techniques to analyze organic components in plating baths
Embodiments of the invention provide an electro-analytical method for determining the concentration of an organic additive in an acidic or basic metal plating bath using an organic chemical...
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6790331 |
ELECTRODEPOSITION COATING FILM THICKNESS CALCULATING METHOD, RECORDING MEDIUM STORED WITH FILM THICKNESS CALCULATING PROGRAM AND READABLE BY MEANS OF COMPUTER, AND ELECTRODEPOSITION COATING FILM THICKNESS SIMULATION APPARATUS
A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is...
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6773569 |
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives
A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an...
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6770184 |
Integrated de-ionized water pressure monitoring system for solder plating machines
The present invention provides a solder plating system with automatic monitoring of wash fluid pressure. The system automatically activates an alarm and/or initiates shutdown of a solder plating...
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6761812 |
Apparatus and method for electrochemical metal deposition
In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative...
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6758955 |
Methods for determination of additive concentration in metal plating baths
The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before...
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6749776 |
Method for rapid screening of emission-mix using a combinatorial chemistry approach
A method of making an electron emissive material using combinatorial chemistry techniques is provided. The method includes providing a plurality of pixels of the electron emissive material, each...
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6746579 |
Electrolytic gold plating method and apparatus therefor
An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously...
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6733656 |
Voltammetric reference electrode calibration
In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a...
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6726825 |
Method and apparatus for manufacturing positive electrode foil of aluminum electrolytic capacitor
A method of manufacturing a positive electrode foil of an aluminum electrolytic capacitor is provided in which anodizing conditions are optimally determined and automatically set to minimize the...
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6726824 |
Closed loop monitoring of electroplating bath constituents using mass spectrometry
The present invention provides methods and apparatus for analysis and monitoring of electrolyte bath composition. Based on the results of the analysis, the invention controls electrolyte bath...
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6716330 |
Electroless plating apparatus and method
An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having...
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6716329 |
Processing apparatus and processing system
A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be...
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6709568 |
Method for determining concentrations of additives in acid copper electrochemical deposition baths
The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the...
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