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7517555 |
Copper plating solution and method for copper plating
A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic...
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7510639 |
Leveler compounds
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion...
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7438794 |
Method of copper electroplating to improve gapfill
A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating...
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7427344 |
Methods for determining organic component concentrations in an electrolytic solution
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring...
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7374652 |
Plating method
Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a...
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7371311 |
Modified electroplating solution components in a low-acid electrolyte solution
An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment,...
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7338585 |
Electroplating chemistries and methods of forming interconnections
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an...
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7335288 |
Methods for depositing copper on a noble metal layer of a work piece
Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The...
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7316772 |
Defect reduction in electrodeposited copper for semiconductor applications
A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating...
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7232513 |
Electroplating bath containing wetting agent for defect reduction
An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid...
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7153408 |
Copper electroplating of printing cylinders
The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a...
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7147767 |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or...
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7144491 |
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith
It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous...
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7128823 |
Anolyte for copper plating
Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the...
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7128822 |
Leveler compounds
Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of...
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7105082 |
Composition and method for electrodeposition of metal on a work piece
A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a...
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7074315 |
Copper bath and methods of depositing a matt copper coating
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over...
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6977035 |
Method for electrolytic copper plating
A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from...
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6911068 |
Plating bath and method for depositing a metal layer on a substrate
A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated...
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6897152 |
Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated...
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6893550 |
Electroplating bath composition and method of using
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper...
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6890416 |
Copper electroplating method and apparatus
An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within...
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6881319 |
Electrolytic copper plating solution and method for controlling the same
Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an...
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6866765 |
Electrolytic copper-plated R-T-B magnet and plating method thereof
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray...
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6835294 |
Electrolytic copper plating method
Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper...
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6800188 |
Copper plating bath and plating method for substrate using the copper plating bath
A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this...
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6776893 |
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
A copper electroplating bath and a method to plate substrates with the bath are provided. The bath and method are particularly effective to plate electronic components such as semiconductive wafer...
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6773573 |
Plating bath and method for depositing a metal layer on a substrate
A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated...
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6740221 |
Method of forming copper interconnects
A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.
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6723219 |
Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
A method of electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current...
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6709564 |
Integrated circuit plating using highly-complexed copper plating baths
The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based...
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6709563 |
Copper-plating liquid, plating method and plating apparatus
There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can...
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6709562 |
Method of making electroplated interconnection structures on integrated circuit chips
A process is described for the fabrication of submicron interconnect structures for integrated circuit chips. Void-free and seamless conductors are obtained by electroplating Cu from baths that...
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6682642 |
Seed repair and electroplating bath
Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
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6679983 |
Method of electrodepositing copper
Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices,...
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6676823 |
High speed acid copper plating
One aspect of the invention relates to an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of...
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6649038 |
Electroplating method
Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
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6638411 |
Method and apparatus for plating substrate with copper
The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper...
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6635166 |
Composite plating method
Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an...
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6632345 |
Apparatus and method for electrolytically depositing a metal on a workpiece
In accordance with one embodiment of the invention, a process for applying a metal to a workpiece is set forth. The workpiece initially includes a seed layer deposited on at least a portion of a...
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6610191 |
Electro deposition chemistry
The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small...
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6607654 |
Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect
A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble β-naphtholethoxylate compound having the formula wherein n is an integer from 10 to 24, one selected from...
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6605204 |
Electroplating of copper from alkanesulfonate electrolytes
Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which...
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6576111 |
Process for the copper plating of substrates
A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the...
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6572753 |
Method for analysis of three organic additives in an acid copper plating bath
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order...
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6562222 |
Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
In filling fine via holes or trenches of the wiring (LSI) pattern formed on a semiconductor wafer, a copper electroplating is carried out by using a copper electroplating solution. containing an...
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6562220 |
Metal alloy sulfate electroplating baths
The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths...
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6531046 |
Seed layer repair method
Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal...
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6527939 |
Method of producing copper foil with an anode having multiple coating layers
A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises...
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6511588 |
Plating method using an additive
A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005× h 2 /w<D/κ< 0.5× h 2 /w, and 0.01≦Θ≦0.7 wherein D is a...
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