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9028668 Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath  
For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance...
9011666 Composition for metal electroplating comprising leveling agent  
A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R1—OH)3 (Ia) and/or at least one...
8991050 High wear durability aluminum gravure cylinder with environmentally safe, thermally sprayed pre-coat layer  
The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of a light weight material like aluminum. The method involves the surface treatment of...
8992757 Through silicon via filling using an electrolyte with a dual state inhibitor  
A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely...
8961771 Electrolytic process using cation permeable barrier  
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed...
8808525 Cyanide free electrolyte composition for the galvanic deposition of a copper layer  
A cyanide-free electrolyte composition for the galvanic deposition of a copper layer on substrate surfaces and a method for the deposition of such layers. The electrolyte composition comprises at...
8801912 Continuous copper electroplating method  
Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a...
8795505 Copper electroplating method  
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer,...
8771495 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers  
A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
8747643 Plating bath and method  
Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the...
8679316 Aqueous, acid bath and method for the electrolytic deposition of copper  
An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler...
8679317 Copper electroplating bath  
A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a...
8591715 Electrodeposition composition and method for coating a semiconductor substrate using the said composition  
The present invention relates to an electrodeposition composition intended particularly for coating a semiconductor substrate in order to fabricate structures of the “through via” type for the...
8589084 Detection of ethanol emission from a spark ignition engine operating on gasohols  
Ethanol emissions from a direct ignition spark ignition are measured using mass spectrometry. The method exploits specific fragment ions from ethanol. Ethanol contributes ions of mass number 31,...
8574418 Electroplating method for coating a substrate surface with a metal  
The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the...
8419920 Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film  
An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a...
8388824 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers  
A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back...
8349149 Apparatus for enhanced electrochemical deposition  
One embodiment of the invention is an apparatus for electrochemical deposition (ECD) of a metal or an alloy inside at least one opening located at a front surface of a substrate, said apparatus...
8337688 Metal plating compositions  
Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal...
8329018 Metal plating compositions and methods  
Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
8262894 High speed copper plating bath  
A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The...
8262891 Leveler compounds  
Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected...
8236159 Electrolytic process using cation permeable barrier  
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed...
8152914 Process for applying a metal coating to a non-conductive substrate  
Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA...
8123926 Electrolytic copper process using anion permeable barrier  
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed...
8118988 Analysis of copper ion and complexing agent in copper plating baths  
A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene...
8114263 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit  
The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for...
8048284 Metal plating compositions  
Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal...
8012334 Metal plating compositions and methods  
Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
7993510 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board  
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in...
7892411 Electrolytic copper plating process  
Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive...
7879218 Deposit morphology of electroplated copper  
The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a...
7857961 Copper plating bath formulation  
To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated...
7824534 Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith  
The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the...
7815786 Copper electrodeposition in microelectronics  
An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition...
7781731 Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution  
Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and...
7771579 Electro chemical plating additives for improving stress and leveling effect  
A chemical solution for an electro chemical plating process includes an electro chemical plating solution; and an additive, added in the electro chemical plating solution, substantially consisting...
7749610 Copper foil and method of manufacturing the same  
The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this...
7678257 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same  
There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an...
7517555 Copper plating solution and method for copper plating  
A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic...
7510639 Leveler compounds  
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion...
7438794 Method of copper electroplating to improve gapfill  
A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating...
7427344 Methods for determining organic component concentrations in an electrolytic solution  
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring...
7374652 Plating method  
Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a...
7371311 Modified electroplating solution components in a low-acid electrolyte solution  
An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one...
7338585 Electroplating chemistries and methods of forming interconnections  
A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an...
7335288 Methods for depositing copper on a noble metal layer of a work piece  
Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The...
7316772 Defect reduction in electrodeposited copper for semiconductor applications  
A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating...
7232513 Electroplating bath containing wetting agent for defect reduction  
An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid...
7153408 Copper electroplating of printing cylinders  
The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a...

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