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6491806 |
Electroplating bath composition
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper...
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6444110 |
Electrolytic copper plating method
The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide...
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6425996 |
Water bath and method for electrolytic deposition of copper coatings
For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper...
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6406609 |
Method of fabricating an integrated circuit
The present invention provides an aqueous electroplating solution. The aqueous electroplating solution includes a copper salt comprising a weight by weight percent of the electroplating solution...
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6402924 |
Programmed pulse electroplating process
The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a...
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6372113 |
Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
Treated copper foil produced by electrodepositing on a matte surface of a base copper foil a “corrective” copper layer having a surface roughness different from the surface roughness of the...
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6294220 |
Post-treatment for copper on printed circuit boards
A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit...
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6290833 |
Method for electrolytically depositing copper on a semiconductor workpiece
This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used...
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6248228 |
Metal alloy halide electroplating baths
The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has...
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6194056 |
High tensile strength electrodeposited copper foil
A high tensile strength copper foil having a matte side roughness Rz of 2.5 μm or less and a tensile strength of 40,000 Kgf/mm 2 after heating one hour at 180° C. is produced by a process in...
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6183622 |
Ductility additives for electrorefining and electrowinning
A method of electrowinning, electrorefining or electroforming of ductile copper deposits. The method uses an adduct of a tertiary alkyl amine with polyepichlorohydrin in amounts effective for...
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6183545 |
Aqueous solutions for obtaining metals by reductive deposition
An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R 1 , R 2 , and R 3 denote lower alkyl...
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6179985 |
Metal alloy fluoroborate electroplating baths
The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating...
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6054037 |
Halogen additives for alkaline copper use for plating zinc die castings
A method and electrolyte bath for depositing Cu +1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes...
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6024857 |
Electroplating additive for filling sub-micron features
An electroplating system includes a standard electroplating apparatus using an acid copper bath with an additive for leveling. The additive is chosen to have molecules of a size that is about the...
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5935402 |
Process for stabilizing organic additives in electroplating of copper
A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and...
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5863410 |
Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
An electrolytic process for producing copper foil having a low profile surface exhibiting a high peel strength when bonded to a polymeric substrate, which process comprises: (a) preparing an...
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5849171 |
Acid bath for copper plating and process with the use of this combination
An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and β-naphtholalkoxylate. A method for...
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5834140 |
Electrodeposited copper foil for fine pattern and method for producing the same
The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R z of...
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5730854 |
Alkoxylated dimercaptans as copper additives and de-polarizing additives
A copper electroplating process using alkoxylated dimercaptan ethers as an additive. The additives prevent dendritic formations which short out electrodes. Also provided is a method for polarizing...
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RE35513 |
Cyanide-free plating solutions for monovalent metals
A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate...
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5543522 |
Process for preparing an ambient temperature molten salt using thionyl chloride
There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum...
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5492615 |
Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths
A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so...
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5454930 |
Electrolytic copper plating using a reducing agent
An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a...
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5433840 |
Acid bath for the galvanic deposition of copper, and the use of such a bath
An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed...
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5421985 |
Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
This invention relates to electrodeposited copper foil having an elongation measured at 180° C. in excess of about 5.5%, an ultimate tensile strength measured at 23° C. in excess of about 60,000...
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5417841 |
Copper plating of gravure rolls
The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at...
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5328589 |
Functional fluid additives for acid copper electroplating baths
A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional...
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5277789 |
Metal, metal alloy, and metal oxide formation by electrodeposition of polymetalllic complexes
A novel method for making metals and homogeneous metal alloys comprises the steps of (a) providing a polymetallic complex of the general formula (μ 4 -0)L 4 M'M"M'"M""X n wherein L is a ligand...
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5252196 |
Copper electroplating solutions and processes
Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful...
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5232575 |
Polymeric leveling additive for acid electroplating baths
Acid, electroplating baths having consistent leveler activity contain levelers which are quaternized near-monodisperse polymers of acrylic or methacrylic trialkyl amine esters. The polymers may...
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5207996 |
Acid leaching of copper ore heap with fluoroaliphatic surfactant
Improved methods of heap leaching of copper ore with aqueous sulfuric acid solutions comprising a fluoroaliphatic surfactant are disclosed. The fluoroaliphatic surfactant increases the amount of...
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5174886 |
High-throw acid copper plating using inert electrolyte
Improved through-hole plating of printed circuit boards, wherein the ratio of the printed circuit board thickness to the diameter of at least one through hole is greater than 3 to 1, is achieved by...
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5151170 |
Acid copper electroplating bath containing brightening additive
For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is...
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4990224 |
Copper plating bath and process for difficult to plate metals
An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with...
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4981560 |
Method of surface treatment of copper foil or a copper clad laminate for internal layer
The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using...
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4975159 |
Aqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating and method of using same
The aqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating, especially for reinforcement of conductive pathways of a printed circuit with outstanding breaking...
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4954226 |
Additive plating bath and process
An additive plating bath and process are described for use in printed circuit manufacturing for applying copper to thick film patterns, said bath includes a low concentration of sulfuric acid,...
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4820388 |
Polyalkylene glycol naphthyl-3-sulfopropyl diether compounds and their salts, process for preparing same and electroplating baths containing same
Novel Polyalkylenglycol naphthyl-3-sulfopropyl diethers and salts thereof of the formula ##STR1## (R 1 -R 3 =H, C p H 2p --1 ; p=l--4, A=(PO) m --(EO) n --, (EO) n --(PO) m ,--(EO) n ...
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4755265 |
Processes for the deposition or removal of metals
Methods for depositing metals on or removing metals from substrates are provided which involve the use of electrolytic cells comprising an anode and cathode, sulfuric acid, and a...
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4686017 |
Electrolytic bath and methods of use
An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pK a of about 6 or less, and a...
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4673469 |
Method of plating plastics
A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member...
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4667049 |
Method of making dialkylamino-thioxomethyl-thioalkanesulfonic acid compounds
A method for the preparation of an alkali metal dialkylaminothioxomethyl-thioalkanesulfonate composition comprising reacting a monoamine with carbon disulfide to form a dithiocarbamic acid...
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4555315 |
High speed copper electroplating process and bath therefor
An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed...
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4551212 |
Bath and process for the electrodeposition of micromachinable copper and additive for said bath
It has been found that an additive comprising a mixture of phenazine dyestuffs in the combination from about 30 to 40 percent by weight of (a) a Janus Green B type dyestuff or a mixture thereof and...
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4521282 |
Cyanide-free copper electrolyte and process
An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an...
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4490220 |
Electrolytic copper plating solutions
Acid copper electroplating solutions containing the reaction product of (A) a compound containing a nitrogen-carbon-sulfur radical of the general structural formula ##STR1## where R 1 and R 2 ...
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4479852 |
Method for determination of concentration of organic additive in plating bath
The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an...
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4469569 |
Cyanide-free copper plating process
A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base...
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4430173 |
Additive composition, bath and process for acid copper electroplating
Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of ω-sulfo-n-propyl...
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