Matches 51 - 100 out of 259 < 1 2 3 4 5 6 >


Match Document Document Title
6869516 Method for removing electrolyte from electrical contacts and wafer touching areas  
A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a...
6863796 Method for reducing cu surface defects following cu ECP  
A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an...
6827835 Method for electroplated metal annealing process  
A method for electroplated metal annealing process. First, a semiconductor structure is provided, wherein the semiconductor structure has a plurality of semiconductor components, such as a gate...
6825512 Micromachined sensor with insulating protection of connections  
An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically...
6808617 Electrolytic polishing method  
A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer...
6805785 Production method of sintered-type nickel positive electrode for alkaline secondary battery  
The following steps are conducted: preparing a metal salt carried-substrate A by soaking a sintered nickel substrate in an acidic solution containing cobalt ions and at least one metal ions of...
6797144 Method for reducing surface defects in an electrodeposition process  
A method for in-situ cleaning an electrodeposition surface following an electroplating process including providing a first electrode assembly and a second electrode assembly; applying a first...
6790336 Method of fabricating damascene structures in mechanically weak interlayer dielectrics  
A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer...
6777108 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil  
To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present...
6770184 Integrated de-ionized water pressure monitoring system for solder plating machines  
The present invention provides a solder plating system with automatic monitoring of wash fluid pressure. The system automatically activates an alarm and/or initiates shutdown of a solder plating...
6758956 Method for darkening a superficial layer which contains zinc and which is of a material piece  
The invention relates to a method for darkening a superficial layer of a workpiece which contains zinc by anodic oxidation. The workpiece is oxidized in a soaking bath containing an aqueous...
6755957 Method of plating for filling via holes  
A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the...
6749953 Whiskerless galvanized product having multi-layer rust prevention film and manufacturing method of whiskerless galvanized product having multi-layer rust prevention film  
A zinc whiskerless galvanized product has a multi-layer rust prevention film that provides excellent rust prevention, self-repair ability, and coating adhesion. A manufacturing method provides a...
6740222 Method of manufacturing a printed wiring board having a discontinuous plating layer  
The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core...
6716334 Electroplating process chamber and method with pre-wetting and rinsing capability  
A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim...
6709563 Copper-plating liquid, plating method and plating apparatus  
There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio,...
6706166 Method for improving an electrodeposition process through use of a multi-electrode assembly  
A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing...
6701613 Multilayer circuit board and method of manufacturing the same  
In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher...
6699380 Modular electrochemical processing system  
Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes two primary components. The first component is an...
6649039 Process of surface treating aluminum articles  
A process of surface treating an aluminum or aluminum alloy article includes the steps of: (1) forming an oxide layer on the aluminum or aluminum alloy article by anodizing; (2) sealing the oxide...
6632344 Conductive oxide coating process  
The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a...
6632343 Method and apparatus for electrolytic plating of surface metals  
A method and apparatus for electrolytic plating of selected areas of printed circuit board traces is disclosed. The method is characterized by its elimination of the need for plating bus bars and...
6632342 Methods of fabricating a microstructure array  
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion...
6613603 Photovoltaic device, process for production thereof, and zinc oxide thin film  
A photovoltaic device is provided which comprises a back reflection layer, a zinc oxide layer and a semiconductor layer stacked in this order on a substrate, wherein the zinc oxide layer contains...
6596150 Production method for an aluminum support for a lithographic printing plate  
Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the...
6589414 Nitride layer forming methods  
Nitride layer formation includes a method wherein a material is electrodeposited on a substrate and converted, at least in part, to a layer comprising nitrogen and the electrodeposited material....
6551488 Segmenting of processing system into wet and dry areas  
A method and apparatus for processing a substrate is described. In one aspect, a processing system is provided which includes a wet area and a dry area. In another aspect, a method comprises...
6548144 Semispherical microstructure, microlens and method of fabricating the same  
A semispherical microstructure includes a substrate, an insulating mask layer, and an electrodeposition layer. The substrate has an electrically-conductive portion. The mask layer is formed on the...
6540901 Production of support for lithographic printing plate  
The present invention provides a process for the manufacture of a substrate for use in the production of lithographic printing plates, the process comprising the steps of: (a) providing an...
6533917 Method for producing aluminum support for lithographic printing plate  
Disclosed are a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate in sequence to (1) a surface roughening treatment, (2) a heat...
6531047 Surface modification method for an aluminum substrate  
A surface modification method for an aluminum substrate, which comprises treating a Ni—P plated aluminum substrate with a functional water having a plus or minus oxidation-reduction potential for...
6521114 Prevention of marine encrustation on bronze propellers  
From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze...
6503382 Method of electrodepositing a porous film  
A method of preparing a porous film comprises electrodepositing material from a mixture onto a substrate, the mixture comprising: (I) a source of metal, inorganic oxide, non-oxide...
6495020 Method of manufacturing a brain probe assembly  
The present invention is a method of producing an electrode probe assembly, comprising, providing a flexible polymer substrate bearing a coating of conductive material and using photolithography...
6471848 Electrodeposition method of forming an oxide film  
This invention provides an electrodeposition apparatus, comprising at least one electrodeposition vessel for supplying a current between a substrate and an electrode in an electrodeposition bath...
6440230 Nitride layer forming method  
Nitride layer formation includes a method where a material is electrodeposited on a substrate and converted, at least in part, to a layer comprising nitrogen and the electrodeposited material. The...
6428674 Process for the removal of galvanic electrolytic residues from electrode frames or electrode frame webs with fiber structure  
A process for the removal of galvanic electrolytic residues from galvanically reinforced fiber structure frames, where the fiber structure frame is produced through chemical metallization of a...
6423389 Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body  
An object is to provide a metallic-conduit-armored type linear member in which a linear member and the like contained in a metallic conduit do not become damaged and a defect in the metallic...
6416648 Method of manufacturing steel sheets coated with Zn-Fe alloy  
The present invention relates to a method to manufacture steel sheets coated with Zn—Fe alloy with an excellent corrosion resistance used in producing a body frame and a chassis of an automobile...
6406607 Method for forming a nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and nozzle plate  
An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer...
6375822 Method for enhancing the solderability of a surface  
A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated...
6372115 Process for anodizing Si-based aluminum alloy  
A process for anodizing an Si-based aluminum alloy comprises the steps of subjecting the Si-based aluminum alloy to electrolysis in an electrolyte containing phosphate and fluoride to form an...
6368484 Selective plating process  
A method is described for electroplating a metal structure in a feature formed in a substrate. A seed layer of the metal is deposited on the top surface and on the bottom and sidewalls of the...
6340422 Method for electroplating metallic and non-metallic endless products and device for carrying out said method  
The present invention is directed to processes and devices for performing the processes comprising electroplating one or more metallic or non-metallic continuous products with metals or metal...
6333120 Method for controlling the texture and microstructure of plated copper and plated structure  
Copper is plated onto a substrate by plating a layer of copper onto the substrate to provide a maximum thickness of about 350 nanometers, followed by subjecting the copper coated substrate to an...
6315883 Electroplanarization of large and small damascene features using diffusion barriers and electropolishing  
A disclosed electroplanarization process involves "masking" certain regions of a wafer surface during electropolishing. The regions chosen for masking are features of relatively low aspect ratio...
6303181 Direct metallization process employing a cationic conditioner and a binder  
A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive...
6299750 Coating method for elongated metal blanks  
A method based on superfinishing for coating elongated metal blanks. The blanks have at least two axially aligned portions with varying cross-sections, wherein particles of a hard substance...
6294220 Post-treatment for copper on printed circuit boards  
A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit...
6290834 Ceramic coated liquid transfer rolls and methods of making them  
Liquid transfer rolls such as printing rolls are made by imposing a hard ceramic coating on an incipient liquid transfer roll in an electrolytic bath subjected to a modified shaped wave...

Matches 51 - 100 out of 259 < 1 2 3 4 5 6 >